EP4SGX530KF43I3 - Stratix IV GX FPGA 531K LE | Intel | Altera
MPN: EP4SGX530KF43I3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5985 | $5,985.00 |
| 10 | $5750 | $57,500.00 |
| 100 | $5420 | $542,000.00 |
| 500 | $5120 | $2,560,000.00 |
| 1,000 | $4890 | $4,890,000.00 |
EP4SGX530KF43I3 Overview
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic fabric, interconnect, and I/O behavior are defined after manufacturing via a user-supplied configuration bitstream. Within the taxonomy of programmable logic, FPGAs sit above CPLDs in density and below ASICs in unit cost at very high volumes. The Stratix IV family from Intel/Altera occupies the high-performance tier, with the GX variants adding multi-gigabit transceivers for serial connectivity. EP4SGX530KF43I3 belongs to the largest density of that family, optimized for wireline communications, military radar, and ASIC prototyping.
Key features include 21,248 adaptive logic modules (ALMs), 1,120 DSP blocks for fixed/floating-point acceleration, and 32 global clock networks with up to 800 MHz internal performance. The KF43 package designation indicates a 42.5 x 42.5 mm body with 1760 balls on a 1.0 mm pitch FCBGA, and the I3 speed grade places it between the fastest I4 and slower C3/C4 commercial grades.
Typical applications include 40G/100G wireline interface cards, software-defined radio, ASIC prototyping, broadcast video processing, and high-end military signal processing. The high transceiver count and PCI-SIG-compliant Gen2 hard IP also suit PCIe Gen2 endpoint and root-port designs.
When designing with this device, plan for multi-rail power sequencing (0.9 V VCC, 1.1 V VCCA, 2.5 V/3.3 V VCCPD), provide a minimum of eight PCB layers for the FCBGA breakout, and use Altera/Intel Quartus II or Quartus Prime for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in alternative recommendations, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP4SGX530KF43I3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX530KF43I3 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Transceivers, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX530KF43C4N
✅ Drop-In✓ In Stock
$3500 / Unit
View Datasheet →EP4SGX530KF43C3N
✅ Drop-In✓ In Stock
$3425 / Unit
View Datasheet →EP4SGX530KF43C2N
✅ Drop-In✓ In Stock
$3450 / Unit
View Datasheet →EP4SGX530HH35I3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3200 / Unit
View Datasheet →EP4SGX530KF43I3 Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements (LE) | 531,200 |
| Adaptive Logic Modules (ALMs) | 21,248 |
| Embedded Memory Bits | 28,033,024 |
| Logic Blocks / LABs | 21,248 (per Mouser listing) |
| User I/Os | 880 |
| Transceivers | Up to 24 (600 Mbps to 8.5 Gbps per Stratix IV GX family) |
| DSP Blocks | 1,120 |
| Process Technology | 40 nm TSMC |
| Core Supply Voltage | 0.9 V |
| Internal Performance | Up to 800 MHz |
| Package | 1760-ball FCBGA (KF43), 42.5 x 42.5 mm |
| Speed Grade | I3 (industrial, mid-speed) |
| Operating Temperature | 0C to +85C (industrial) |
| PCIe Hard IP | PCI Express Gen1 / Gen2 |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP4SGX530KF43I3 1760-ball fcbga (kf43), 42.5 x 42.5 mm Pin Configuration Guide
Pin configuration for EP4SGX530KF43I3 (1760-ball fcbga (kf43), 42.5 x 42.5 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX530KF43I3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX530KF43I3 is suitable for 7 applications: 40G/100G Wireline Communications Interface Cards, Software-Defined Radio (SDR) and Radar Signal Processing, ASIC Prototyping and Emulation, Broadcast Video Processing and Studio Equipment, High-Performance Test and Measurement Equipment, Military and Aerospace Signal Intelligence, Medical Imaging (CT, MRI, Ultrasound) Pre-Processing.
40G/100G Wireline Communications Interface Cards
The EP4SGX530KF43I3 delivers up to 24 multi-gigabit transceivers at 8.5 Gbps per channel, enabling 4x10G (40G) and aggregation paths to 100G via soft MAC layers. Its 531,200 logic elements and 1,120 DSP blocks handle OTN framer/mapper functions, FEC encoding, and packet processing at line rate. The hard PCIe Gen2 IP and 880 user I/Os connect directly to QSFP+ cages and switch-fabric ASICs in line-card designs.
Recommended
Software-Defined Radio (SDR) and Radar Signal Processing
The 531K LE fabric and 1,120 dedicated DSP blocks of the EP4SGX530KF43I3 accelerate FFT, channelization, beamforming, and pulse-Doppler processing in real time. With 28 Mbit of embedded memory and 24 transceivers, the device can ingest multiple ADC data streams at 6.25 GSPS and run radar back-end signal chains. The industrial I3 temperature grade supports outdoor and ruggedized military enclosures without thermal derating.
Recommended
ASIC Prototyping and Emulation
With 531,200 logic elements, the EP4SGX530KF43I3 hosts ASIC RTL blocks up to 3-5 million gates in a multi-FPGA partitioned flow. The 24 transceivers connect to daughter boards at multi-gigabit rates, partitioning logic across stacked FPGAs. Quartus Prime with Synopsys Certify or Mentor LogicTiles supports automated partitioning. Designers benefit from real-world timing verification before ASIC tape-out.
Recommended
Broadcast Video Processing and Studio Equipment
The 531K LE and 1,120 DSP blocks of the EP4SGX530KF43I3 drive multi-stream 3G-SDI/HD-SDI processing, format conversion, scaling, and overlay composition. The hard PCIe Gen2 endpoint IP supports capture cards and playout servers, while the 880 user I/Os interface directly to video crosspoint ASICs. Industrial temperature rating suits remote broadcast trucks and outdoor OB vans.
Recommended
High-Performance Test and Measurement Equipment
Test instruments such as oscilloscopes, logic analyzers, and BERT testers leverage the EP4SGX530KF43I3 to process multi-channel data at line rate. The 24 transceivers aggregate data from multiple ADC lanes at 8.5 Gbps, while the 1,120 DSP blocks run real-time FFT, statistics, and trigger engines. Industrial temperature rating supports bench, lab, and field environments.
Recommended
Military and Aerospace Signal Intelligence
The EP4SGX530KF43I3 powers SIGINT, ELINT, and COMINT systems that demand high-density logic for parallel channel processing and encryption. The industrial I3 temperature rating and RoHS compliance meet long-lifecycle defense program requirements. With 28 Mbit of embedded memory the FPGA holds large circular buffers for narrowband intercept capture without external SRAM.
Recommended
Medical Imaging (CT, MRI, Ultrasound) Pre-Processing
The 1,120 DSP blocks and 24 transceivers of the EP4SGX530KF43I3 deliver real-time beamforming, image reconstruction, and noise filtering for high-end medical imaging systems. The 531K LE fabric runs back-projection, iterative reconstruction, and AI pre-filter kernels. The 880 user I/Os connect to multi-channel ADC front-ends and high-bandwidth memory, while the industrial I3 temperature grade suits equipment-room thermal envelopes.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX530KF43I3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX530KF43C4N | EP4SGX530KF43C3N | EP4SGX530KF43C2N |
|---|---|---|---|---|
| Package | 1760-ball FCBGA (KF43) | 1760-ball FCBGA (KF43) - same | 1760-ball FCBGA (KF43) - same | 1760-ball FCBGA (KF43) - same |
| Brand | Intel | Intel | Intel | Intel |
| Logic Elements | 531,200 | 531,200 - same | 531,200 - same | 531,200 - same |
| Speed Grade | I3 (industrial, mid) | C4 (commercial, slowest) | C3 (commercial, mid) | C2 (commercial, slowest of C-series) |
| Temperature Range | Industrial 0C to +85C junction (I3) | Commercial 0C to +85C (C4) | Commercial 0C to +85C (C3) | Commercial 0C to +85C (C2) |
| Transceivers | Up to 24 (8.5 Gbps) | Up to 24 (8.5 Gbps) - same | Up to 24 (8.5 Gbps) - same | Up to 24 (8.5 Gbps) - same |
| DSP Blocks | 1,120 | 1,120 - same | 1,120 - same | 1,120 - same |
| Embedded Memory (Mbit) | 28 Mbit | 28 Mbit - same | 28 Mbit - same | 28 Mbit - same |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Key Differentiators
- I3 speed grade offers industrial-temperature mid-speed bin in the same KF43 footprint (vs EP4SGX530KF43C4N)
- Highest-density Stratix IV GX FPGA in the KF43 1760-ball package family (vs EP4SGX360KF43I3)
- 24 multi-gigabit transceivers supporting 600 Mbps to 8.5 Gbps protocols (vs EP4SE530H35C4N)
Design Notes
The EP4SGX530KF43I3 requires multiple rails: 0.9 V VCC core, 1.1 V VCCA_PLL/VCCAUX, 2.5 V/3.3 V VCCPD for I/O banks, and 1.2 V-1.5 V VCCPGM for configuration. Intel recommends a sequencing controller such as LM3880, LTC2923, or equivalent to enforce 0.9 V VCC before VCCPD/VCCA. Decoupling requires at least 24x 0.1 uF X7R MLCCs adjacent to the BGA plus 4x 22 uF bulk caps per rail within 25 mm of the package. Estimated: total decoupling budget ~3 nF per rail per ball count group.
At full logic utilization and 8.5 Gbps transceiver operation, the EP4SGX530KF43I3 can dissipate 25-30 W. The 42.5 x 42.5 mm KF43 FCBGA thermal resistance theta_JB is approximately 0.5 C/W, requiring a heatsink with thermal resistance under 1.2 C/W plus airflow of at least 200 LFM for industrial temperature operation. Use a thermal-interface material rated for 1 mm-thick TIM. Always estimate junction temperature rise as Pdiss x theta_JA with theta_JA near 2.5 C/W in still air.
For the 1760-ball KF43 FCBGA with 1.0 mm pitch, an 8-layer minimum stackup is recommended. Use 1.2 oz copper on outer layers for high-current transceiver regions. Via-in-pad with microvia (0.1 mm laser via) is required to escape the inner-row balls - partner with a manufacturer capable of stacked microvias. Maintain 50 ohm controlled impedance for transceiver pairs and 90 ohm for PCIe. Follow Altera's Stratix IV GX PCB design guidelines for break-in/break-out.
Do not operate EP4SGX530KF43I3 with I/O bank voltage above the VCCIO specification - overshoot on MSEL configuration pins can lock the device. Ensure CONFIG_DONE, nSTATUS, and nCONFIG pins have pull-up or pull-down per the Stratix IV GX handbook chapter on configuration. Avoid powering the transceivers before PLL supplies ramp - use Altera's recommended sequencing. Estimated: at >95% utilization, plan for at least 5% timing margin to absorb routing skew across the BGA.
Group high-speed transceiver channels to within 25 mm of the device edge to minimize loss. Reference transceiver pairs with continuous GND beneath every differential trace. Keep JTAG/USB-Blaster header accessible via test points to allow in-system programming post-assembly. Use length-matching within 150 um for parallel transceiver lanes. Estimated: at 8.5 Gbps, insertion loss budget to connector is 6 dB - use Megtron 6 or Tachyon 100G dielectric.
Compliance Information
RoHS and lead-free per Intel/Altera product page. AEC-Q100 not applicable - this is a high-end industrial/commercial FPGA, not an automotive-grade part. Conflict minerals compliance per Intel supply-chain disclosure.
