EPF10K100EFC484-1X - FLEX-10KE FPGA 100K Gates 484-FBGA | Intel
MPN: EPF10K100EFC484-1X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $367.97 | $367.97 |
| 10 | $366.13 | $3,661.30 |
| 100 | $362.88 | $36,288.00 |
| 500 | $364.29 | $182,145.00 |
| 1,000 | $360.61 | $360,610.00 |
| 1,500 | $356.93 | $535,395.00 |
| 2,000 | $353.25 | $706,500.00 |
| 2,500 | $349.57 | $873,925.00 |
EPF10K100EFC484-1X Overview
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines a large array of configurable logic blocks (LABs), embedded memory, and programmable interconnect to implement arbitrary digital circuits. FPGAs sit at the top of the programmable logic hierarchy (FPGA -> PLD -> logic IC -> integrated circuit) and are widely used as flexible alternatives to ASICs for glue logic, prototyping, signal processing, and interface bridging. The FLEX 10KE family introduced dedicated embedded array blocks (EABs) for SRAM memory, making these parts useful for designs that need on-chip RAM, FIFOs, or ROM lookup tables.
Key features of the EPF10K100EFC484-1X include 624 logic array blocks (LABs), 338 user I/Os, 49,152 RAM bits distributed across embedded array blocks, and a propagation delay of approximately 0.6 ns per logic element. The device is offered in the 484-pin FineLine BGA (23 × 23 mm) package and supports in-system programmability via a JTAG-compliant serial interface. The "-1X" speed grade designates the slowest commercial-grade speed bin used in this family, suitable for cost-sensitive applications that do not require the highest possible toggle rate.
Architecturally, the EPF10K100EFC484-1X combines four-input look-up tables (LUTs) inside each LAB with carry-chain logic and dedicated EABs that can be configured as 256 × 8, 512 × 4, 1024 × 2, or 2048 × 1 memory blocks. The interconnect is a hierarchical routing network with FastTrack direct-connect lines between adjacent LABs and longer row/column lines for global signals. This combination gives the device predictable timing and lets designers place critical paths on dedicated routing resources.
Typical applications include telecommunications interface cards, industrial control and instrumentation logic, PCI bridge controllers, network routers and switches, and legacy systems that need a high-gate-count programmable platform. The device is also used in test-and-measurement front-ends, where its embedded RAM blocks provide buffering for sample storage.
When designing with this part, plan I/O assignments around the 484-pin FineLine BGA footprint and use the Altera (now Intel) Quartus II or MAX+PLUS II toolchain for synthesis, place-and-route, and timing analysis. Note that the FLEX 10KE family is no longer recommended for new designs; consult Intel's product change notifications for current lifecycle status before committing to a long-lifecycle program.
Drop-in alternatives for EPF10K100EFC484-1X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100EFC484-1X (same form factor and footprint) — differing in Package, Mounting Type, Operating Temperature, Process Technology, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100EFC484-1N
✅ Drop-In✓ In Stock
$158 / Unit
View Datasheet →EPF10K100EFC484-1
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →EPF10K100EFC484-2X
✅ Drop-In✓ In Stock
$237.71 / Unit
View Datasheet →EPF10K100AFC484-2N
✅ Drop-In✓ In Stock
$152 / Unit
View Datasheet →EPF10K100EFC484-3
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →EPF10K100EFC484-1X Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Series | FLEX-10KE® |
| Logic Elements / Cells | 4992 |
| System Gates | 100,000 |
| Logic Array Blocks (LABs) | 624 |
| Total RAM Bits | 49,152 |
| User I/O Count | 338 |
| Number of I/O Pins | 338 (package provides up to 488 bonded I/O pads) |
| Supply Voltage (Core) | 2.5 V (2.375 V – 2.625 V) |
| Supply Voltage (I/O) | 3.3 V |
| Process Technology | 0.22 µm CMOS |
| Maximum Internal Frequency | 333.33 MHz |
| Propagation Delay | 0.6 ns (per logic element, typical) |
| Package | 484-FBGA (FineLine BGA, 23 × 23 mm) |
| Operating Temperature | 0 °C to +70 °C (commercial) |
| Mounting Type | Surface Mount |
| Programming Interface | JTAG / serial (ByteBlaster-compatible) |
EPF10K100EFC484-1X 484-fbga (fineline bga, 23 × 23 mm) Pin Configuration Guide
Pin configuration for EPF10K100EFC484-1X (484-fbga (fineline bga, 23 × 23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K100EFC484-1X.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K100EFC484-1X is suitable for 6 applications: Telecommunications Interface Cards, Industrial Control and Instrumentation Logic, PCI Bridge / Bus Controller Logic, Network Router and Switch Glue Logic, Test and Measurement Front-End, Legacy System Sustainment / Long-Life Programs.
Telecommunications Interface Cards
The EPF10K100EFC484-1X is well suited for telecom interface cards that need flexible glue logic between PHYs, framers, and network processors. Its 100K system gates and 624 LABs provide enough capacity for protocol state machines, HDLC encoders, and ATM segmentation blocks, while the 12 EABs deliver 49,152 bits of on-chip RAM for cell buffers and FIFO queues. The 338 user I/Os in the 484-FBGA package let the device route parallel bus interfaces, E1/T1 framers, and serial MII/RGMII signals without external muxing. The 2.5 V core and 3.3 V I/O supplies match legacy telecom board rails, simplifying power-tree design. Although the -1X speed grade is the slowest commercial bin, telecom line-rate applications at 155 Mbit/s and below are well within its 333.33 MHz internal Fmax.
Recommended
Industrial Control and Instrumentation Logic
Industrial controllers often need a programmable platform that can be reconfigured in the field, and the EPF10K100EFC484-1X fits this role for legacy 0-70 °C installations. The 100K-gate capacity lets designers integrate encoder counters, PWM generators, PID loops, and Modbus/CAN glue logic in a single device. Its 338 I/Os in the 484-FBGA package support a large number of opto-isolated inputs and relay-driver outputs without external I/O expansion. The embedded array blocks (12 EABs, 49 Kbits RAM) provide local scratch memory for sample buffering and lookup tables used in non-linear control laws. The commercial 0-70 °C temperature grade and the robust FLEX 10KE architecture are well proven in factory-floor equipment.
Recommended
PCI Bridge / Bus Controller Logic
The EPF10K100EFC484-1X is widely used as a PCI bridge and bus controller in legacy desktop and embedded systems, taking advantage of its 100K-gate capacity to implement target and master state machines for 32-bit/33 MHz PCI. The 624 LABs provide abundant four-input LUT resources for address decoding, command-handling, and wait-state insertion, while the 12 EABs can be configured as 256 × 8 FIFOs for transaction buffering. The 338 user I/Os in the 484-FBGA package are sufficient for multiplexed address/data buses, arbitration signals, and sideband control. The 2.5 V core plus 3.3 V I/O rails match the PCI signaling environment directly without external level shifting.
Recommended
Network Router and Switch Glue Logic
In network routers and L2/L3 switches, the EPF10K100EFC484-1X is used as flexible glue logic between PHY transceivers, switch fabrics, and management CPUs. The 100K-gate fabric and 338 I/Os let designers implement GMII/RGMII multiplexing, SPI/I2C management bus arbiters, and LED/board-control state machines without a second ASIC. The 12 EABs deliver enough on-chip RAM (49,152 bits) for small packet queues and address-lookup scratch tables. The 484-FBGA package is BGA-compatible with most high-density router PCB layouts, allowing direct drop-in next to switch ASICs. Commercial 0-70 °C operation matches the indoor climate-controlled environment of central-office and enterprise wiring closets.
Recommended
Test and Measurement Front-End
Test and measurement instruments such as logic analyzers, protocol exercisers, and data-acquisition front-ends rely on FPGAs for sample buffering, pattern generation, and trigger logic. The EPF10K100EFC484-1X's 12 EABs (49,152 bits of RAM) are sufficient to build acquisition FIFOs for moderate sample rates, while the 100K-gate logic fabric handles trigger sequencers and protocol decoders. The 338 user I/Os in the 484-FBGA package accept a large fan-in of probe channels without external muxing. The 0.6 ns propagation delay gives sub-nanosecond response on critical trigger paths, which is adequate for many bench instruments. The commercial temperature range suits lab-environment operation.
Recommended
Legacy System Sustainment / Long-Life Programs
The EPF10K100EFC484-1X is most commonly used today as a sustainment part for long-life programs that were designed around the FLEX 10KE family between 1999 and 2005. Fielded defense, aerospace, industrial, and medical systems often require form-fit-function replacements over decades, and the EPF10K100EFC484-1X allows board-level repair without re-engineering. Its 484-FBGA footprint, 100K-gate logic capacity, and 338-I/O pinout are well documented in legacy design files. The 2.5 V core and 3.3 V I/O rails match the existing power trees of these long-life boards. With Intel's NRND classification, sourcing is increasingly routed through authorized aftermarket distributors such as Rochester Electronics.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100EFC484-1X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100EFC484-1N | EPF10K100EFC484-1 | EPF10K100EFC484-2X | EPF10K100AFC484-2N | EPF10K100EFC484-3 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (23x23 mm) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KA (predecessor) | FLEX 10KE |
| Speed Grade | -1X (slowest) | -1N (same speed, fab test flow) | -1 (same speed) | -2X (~30% faster) | -2N (FLEX 10KA, older) | -3 (~50% faster) |
| Logic Elements | 4992 | 4992 | 4992 | 4992 | 4992 (FLEX 10KA) | 4992 |
| User I/O | 338 | 338 | 338 | 338 | 338 | 338 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 5.0 V (FLEX 10KA) | 2.5 V |
| Lead-Free Finish | Yes (Pb-free, -X suffix) | Yes (Pb-free, -N suffix) | No (lead-bearing) | Yes (Pb-free) | Yes (Pb-free) | No (lead-bearing) |
Key Differentiators
- Drop-in RoHS-compliant finish in the same 484-FBGA footprint (vs EPF10K100EFC484-1)
- Same architecture as -1N but with explicit 'X' lead-free designation (vs EPF10K100EFC484-1N)
- FLEX 10KE architecture delivers higher Fmax at the same gate count (vs EPF10K100AFC484-2N)
- 338 user I/O in 484-FBGA is the maximum-density variant (vs EPF10K100EBC356-3)
Design Notes
The EPF10K100EFC484-1X requires a 2.5 V core supply (±5%) and a 3.3 V I/O supply; both rails must be sequenced with VCCINT rising before or simultaneously with VCCIO. Decouple VCCINT with 100 µF bulk plus 0.1 µF + 0.01 µF ceramic pairs close to each power ball, and place 4.7 µF + 0.1 µF pairs on every VCCIO region. Estimated quiescent current is 200-300 mA for VCCINT at 100% toggle on all 338 I/Os, but in-system current varies with utilization. Add a ferrite bead on VCCIO if switching noise couples to adjacent analog sections.
The 484-FBGA package uses a 1.0 mm ball pitch on a 23 × 23 mm substrate with a standard JEDEC FineLine BGA land pattern. Use NSMD (non-solder-mask-defined) pads with a solder-mask opening 0.4 mm larger than the pad for best assembly yield. Route signals on inner layers between BGA balls with 4-mil trace/space rules; place at least one solid ground plane directly under the BGA for return-path integrity. For high-speed designs keep clock traces layer-changes to a minimum and use matched-length tuning on global clock nets.
Do not confuse the FLEX 10KE part with the older FLEX 10K or FLEX 10KA devices: the FLEX 10K core is 5.0 V, while the FLEX 10KA family is 5.0 V with 3.3 V I/O and the FLEX 10KE is 2.5 V core with 3.3 V I/O. Mixing these on the same board will damage the silicon. Also note the FLEX 10KE does not support live reconfiguration like newer Cyclone devices, so all configuration must occur at boot via a serial configuration EPROM. Source: Altera FLEX 10KE datasheet, configuration chapter.
Estimated: at 0 °C to +70 °C ambient, the 484-FBGA FineLine package has theta-JA of approximately 18 °C/W with a 4-layer JEDEC test board. At 2 W total dissipation (typical for 100K-gate designs at moderate toggle rates), junction temperature rises about 36 °C above ambient, leaving substantial margin to the 125 °C absolute maximum. Add a heat-spreader copper pour and thermal vias under the center balls for designs that drive all 338 I/Os at high frequency.
Compliance Information
Lead-free ball finish indicated by 'X' suffix per Altera legacy ordering convention. RoHS compliance inferred from X-suffix designation; full material declaration not published in retrieved web data.
