EPF10K200SFI672-2B - 200K Gates FLEX 10KE FPGA | Altera
MPN: EPF10K200SFI672-2B ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $320 | $320.00 |
| 10 | $285 | $2,850.00 |
| 100 | $248 | $24,800.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $188 | $188,000.00 |
EPF10K200SFI672-2B Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory blocks that engineers can reconfigure post-manufacture to implement custom digital logic. FPGAs sit above standard logic ICs and microcontrollers in the programmable logic taxonomy (CPLD -> FPGA -> SoC FPGA) and belong to the broader category of programmable logic devices (PLDs) used for high-speed parallel processing, glue logic, prototyping ASICs, and DSP pipelines.
The EPF10K200SFI672-2B features 98,304 bits of embedded SRAM, 24 Embedded System Blocks (EABs) totaling 96 Kbits of block RAM, and four phase-locked loops (PLLs) for clock management. Its FastTrack interconnect fabric delivers predictable timing across the device, while 5V-tolerant I/Os simplify interface to legacy peripherals. These characteristics make it suitable for telecom line cards, industrial control, and high-speed image processing applications.
The 672-pin FineLine BGA package uses a 1.0 mm pitch on a 27 × 27 mm substrate, providing high signal density in a compact footprint. The FineLine BGA family is a sub-category of plastic BGA (PBGA) packaging designed for fine-pitch surface-mount assembly. The 'I' suffix in the part number indicates an industrial temperature grade (-40 °C to +85 °C), while 'S' denotes the 10KE family, 'F' indicates FineLine BGA package, and '672' identifies the pin count.
Typical applications include telecommunications switching, high-speed serial protocol bridging (UTOPIA, POS-PHY), industrial machine vision, ASIC prototyping, and DSP co-processing. The device is well suited to high-I/O-count designs where 470 user pins and abundant block RAM simplify system partitioning.
When designing with this part, verify PCB footprint compatibility with the FBGA-672 27 × 27 mm land pattern and ensure 6-layer or thicker stack-ups to maintain signal integrity for high-speed I/O. Plan JTAG access via the dedicated TEST pins for in-system programming, and check Quartus II / MAX+PLUS II support for bitstream generation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EPF10K200SFI672-2B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200SFI672-2B (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Core Supply Voltage, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200SFI672-2
✅ Drop-In✓ In Stock
$99.5 / Unit
View Datasheet →EPF10K200SFC672-2
✅ Drop-In✓ In Stock
$320 / Unit
View Datasheet →EPF10K200SFC672-1X
✅ Drop-In✓ In Stock
$135 / Unit
View Datasheet →EPF10K200SFC672-1
✅ Drop-In✓ In Stock
$138.75 / Unit
View Datasheet →EPF10K200SFI672-2B Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Logic Elements | 9,984 |
| System Gates | 200,000 |
| Maximum System Gates | 513,000 |
| Embedded Memory | 98,304 bits |
| Embedded Array Blocks (EABs) | 24 (96 Kbits total) |
| User I/Os | 470 |
| Process Technology | 0.22 µm CMOS, SRAM |
| Core Supply Voltage | 2.5 V |
| Maximum Operating Frequency | 200 MHz |
| PLLs | 4 |
| Package | FBGA-672 (FineLine BGA, 27 × 27 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Programming Memory Type | SRAM |
| RoHS Status | Non-compliant (legacy FLEX 10KE) |
EPF10K200SFI672-2B fbga-672 (fineline bga, 27 × 27 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EPF10K200SFI672-2B (fbga-672 (fineline bga, 27 × 27 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K200SFI672-2B.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K200SFI672-2B is suitable for 6 applications: Telecommunications Line Cards, Industrial Machine Vision, ASIC Prototyping and Emulation, High-Speed DSP Co-Processing, Legacy Avionics and Defense Systems, Medical Imaging and Diagnostics.
Telecommunications Line Cards
The EPF10K200SFI672-2B is well suited to telecommunications line cards where 470 user I/Os and 200K gates of programmable logic are needed for protocol bridging and channel aggregation. Its 98 Kbits of embedded SRAM organized as 24 EABs provides on-chip buffering for UTOPIA, POS-PHY, and ATM cell processing. With 4 PLLs, the device can generate multiple clock domains required for TDM bus interfacing at up to 200 MHz. The industrial temperature rating (-40 °C to +85 °C) supports central-office and outside-plant deployments, and the SRAM-based configuration allows field firmware updates via JTAG.
Recommended
Industrial Machine Vision
In industrial machine vision systems, the EPF10K200SFI672-2B provides the parallel processing bandwidth needed for real-time image preprocessing. Its 470 I/Os accommodate direct connection to multiple CMOS/CCD sensors at LVTTL/LVCMOS levels, while 96 Kbits of block RAM (24 EABs) holds line buffers and lookup tables for gamma correction and color-space conversion. The 200 MHz FastTrack interconnect fabric delivers deterministic timing across parallel pixel pipelines, and 4 PLLs generate the multiple clock domains required for camera link and pixel-rate conversion.
Recommended
ASIC Prototyping and Emulation
Engineers use the EPF10K200SFI672-2B for ASIC prototyping because its 200K gates and 9,984 logic elements provide sufficient capacity to map medium-complexity ASICs into programmable logic. The SRAM configuration allows rapid design iteration via JTAG, and 470 user I/Os make it easy to bring out ASIC pins for bench validation. The FastTrack continuous routing fabric preserves timing closure when partitioning an ASIC netlist across multiple FPGAs, and 24 EABs implement ASIC RAM blocks with equivalent timing characteristics.
Recommended
High-Speed DSP Co-Processing
The EPF10K200SFI672-2B serves as a DSP co-processor where 200 MHz operation and 24 embedded array blocks enable FFT, FIR, and correlation pipelines. Each EAB functions as a coefficient ROM or dual-port RAM, simplifying multiplier-accumulator array implementation. The device's 470 I/Os stream data between host processor and accelerator fabric, while 4 PLLs derive the multiple clock phases required for pipelined DSP datapaths operating at full throughput.
Recommended
Legacy Avionics and Defense Systems
The EPF10K200SFI672-2B's industrial temperature range (-40 °C to +85 °C) and mature FLEX 10KE architecture make it a long-life fit for legacy avionics, naval electronics, and defense ground systems with multi-decade support requirements. Its 470 user I/Os interface to MIL-STD-1553, ARINC 429, and legacy parallel buses, and the SRAM configuration permits field firmware updates on deployed platforms. The FBGA-672 27 × 27 mm package supports ruggedized PCB layouts with controlled-impedance routing for high-speed signal integrity.
Recommended
Medical Imaging and Diagnostics
In ultrasound, endoscopy, and patient-monitoring equipment, the EPF10K200SFI672-2B provides the parallel processing backbone needed for real-time beamforming and image reconstruction. Its 96 Kbits of block RAM serves as line buffers for image pipelines, while 470 I/Os interface to high-speed ADCs and DACs used in ultrasound front-ends. The 200 MHz system clock supports continuous-wave Doppler processing, and the industrial temperature grade supports operating-room and bedside equipment requirements.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200SFI672-2B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200SFI672-2 | EPF10K200SFC672-2 | EPF10K200SFC672-1X | EPF10K200SFC672-1 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | FBGA-672 | FBGA-672 - same | FBGA-672 - same | FBGA-672 - same | FBGA-672 - same |
| Logic Elements | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| User I/Os | 470 | 470 | 470 | 470 | 470 |
| Embedded Memory | 98,304 bits | 98,304 bits | 98,304 bits | 98,304 bits | 98,304 bits |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| Speed Grade | -2B (industrial speed bin) | -2 | -2 | -1X (slower) | -1 (slowest) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature grade with -2B speed bin (vs EPF10K200SFC672-2)
- High-density 470 I/O count in FBGA-672 (vs EPF10K130EFC672-2)
- Four on-chip PLLs for multi-clock designs (vs EPF10K200SFC484-2)
Design Notes
The FBGA-672 package exhibits a theta-JA of approximately 8-10 °C/W with a standard 6-layer JEDEC test board, requiring thermal management at sustained high toggle rates. At 200 MHz with 80% utilization, internal dissipation can reach 3-4 W. For industrial enclosures, provide thermal vias under the package and consider a small heatsink or forced-air cooling if ambient temperature exceeds 60 °C to keep junction below 125 °C.
The 672-pin FineLine BGA uses 1.0 mm ball pitch on a 27 × 27 mm substrate. PCB design requires 6 or more layers with microvia or via-in-pad technology for reliable BGA breakout. Maintain 50 Ω single-ended controlled impedance on high-speed I/O traces, and route clock signals over a continuous ground plane. Decoupling requires at least 8 × 0.1 µF and 4 × 10 µF capacitors placed adjacent to the package power balls.
Because the FLEX 10KE family is SRAM-based, the FPGA loses its configuration when power is removed. A boot PROM such as EPC2 or EPC8 must be connected to the passive serial (PS) or passive parallel asynchronous (PPA) configuration port. Failure to provide correct MSEL pin strapping for the configuration mode prevents JTAG programming. Also verify I/O bank voltage compatibility before mixing 3.3 V and 5 V peripherals on the same bank.
At 200 MHz toggle rates, simultaneous switching noise (SSN) can couple through the shared VCCIO/GND planes. Decouple each VCCIO bank with 0.1 µF ceramic capacitors placed within 5 mm of the package balls, and add 1 µF bulk capacitors on each bank supply. For LVDS or SSTL signaling, maintain 100 Ω differential trace impedance with matched length matching within 25 mil to preserve data-eye margins.
Compliance Information
FLEX 10KE family is legacy non-RoHS. RoHS-converted variants have 'N' or 'G' suffix in the part number. Reach compliance is maintained by Altera/Intel legacy part documentation.
