EPF10K30EFC256-2X - 30K FLEX-10KE FPGA 1728 Cells 256-BGA | Intel / Altera
MPN: EPF10K30EFC256-2X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.4 | $324.00 |
| 100 | $26.85 | $2,685.00 |
| 500 | $21.2 | $10,600.00 |
| 1,000 | $17.95 | $17,950.00 |
EPF10K30EFC256-2X Overview
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable semiconductor that can be configured by the designer after manufacturing to implement custom digital logic. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> FPGAs -> SRAM-based FPGAs -> embedded-block FPGAs. The FLEX-10KE family pioneered embedded array blocks, integrating RAM and logic to enable System-on-a-Programmable-Chip (SOPC) designs that combine glue logic, FIFOs, and state machines on a single device.
Key features include 24,576 bits of embedded SRAM distributed across EABs (Embedded Array Blocks), 216 Logic Array Blocks (LABs), 0.22 µm CMOS technology, and a -2 speed grade. The FineLine BGA package provides high I/O density for designs requiring many parallel interfaces in a compact footprint, suitable for legacy telecom, industrial control, and ASIC prototyping systems.
Typical applications include ASIC prototyping, glue-logic consolidation, custom DSP pre-processing, telecom interface bridges, and industrial bus controllers. The device is also used in test equipment, military/aerospace (when properly screened), and legacy communications infrastructure where the FLEX-10KE architecture is well-supported by mature toolchains such as Quartus II and MAX+PLUS II.
When designing with this device, ensure proper decoupling per FLEX-10KE guidelines and verify configuration mode support (e.g., passive serial, JTAG) against the toolchain version. Note that this part is now legacy hardware - confirm long-term availability with authorized distributors before committing to new designs.
Drop-in alternatives for EPF10K30EFC256-2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K30EFC256-2X (same form factor and footprint) — differing in Operating Temperature, Speed Grade, Package, Process Technology, Logic Elements / Cells.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K30EFC256-2N
✅ Drop-In✓ In Stock
$48.57 / Unit
View Datasheet →EPF10K30EFC256-2
✅ Drop-In✓ In Stock
$12.1 / Unit
View Datasheet →EPF10K30EFC256-1X
✅ Drop-In✓ In Stock
$95.6 / Unit
View Datasheet →EPF10K30EFC256-1
✅ Drop-In✓ In Stock
$69.5 / Unit
View Datasheet →EPF10K100EFC256-2X
✅ Drop-In✓ In Stock
$30.5 / Unit
View Datasheet →EPF10K30EFC256-2X Maximum Ratings & Electrical Characteristics
| Series | FLEX-10KE |
| Family | FLEX 10KE |
| Gates | 30,000 |
| Logic Elements / Cells | 1,728 |
| Number of LABs/CLBs | 216 |
| Number of Logic Elements/Cells | 1,728 |
| Total RAM Bits | 24,576 |
| Number of I/O | 176 |
| Voltage - Supply | 2.375 V to 2.625 V |
| Operating Temperature | 0°C to 70°C |
| Internal Frequency (Max) | 200 MHz |
| Propagation Delay | 0.6 ns |
| Technology | 0.22 µm CMOS |
| Supplier Device Package | 256-FBGA (17x17) |
| Package / Case | 256-BGA |
| Mounting Type | Surface Mount |
| Speed Grade | -2 |
EPF10K30EFC256-2X 256-bga Pin Configuration Guide
Pin configuration for EPF10K30EFC256-2X (256-bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K30EFC256-2X.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K30EFC256-2X is suitable for 6 applications: ASIC Prototyping and Pre-Silicon Validation, Glue Logic Consolidation, Telecom Interface Bridging, Industrial Control and Bus Controllers, Legacy Communications Infrastructure, Test and Measurement Equipment.
ASIC Prototyping and Pre-Silicon Validation
The EPF10K30EFC256-2X is widely used in legacy ASIC prototyping because its 1,728 logic elements and 24,576 bits of embedded SRAM provide enough capacity to validate mid-complexity ASIC designs before tape-out. The 200 MHz internal frequency and 0.6 ns propagation delay enable accurate timing emulation of many ASIC blocks. The 256-FBGA 17x17 mm package supports high I/O density required for chip-to-FPGA emulation boards, with 176 user I/Os enabling parallel signal access.
Recommended
Glue Logic Consolidation
Many legacy designs use the EPF10K30EFC256-2X to replace discrete TTL/CMOS glue logic with a single programmable device. Its 216 LABs and 1,728 LEs can absorb dozens of standard logic parts, reducing PCB area and improving reliability. The 2.5 V core and configurable I/O standards allow direct interfacing with 3.3 V and 5 V legacy components when proper level shifting is used. The device's JTAG support enables in-system reconfiguration.
Recommended
Telecom Interface Bridging
Telecom systems from the late 1990s and early 2000s frequently use the EPF10K30EFC256-2X as a protocol bridge between E1/T1 framers, HDLC controllers, and TDM backplanes. Its 24,576 bits of embedded SRAM can hold framing buffers and look-up tables, while the 200 MHz internal frequency supports typical telecom bit rates. The 256-FBGA package's 176 I/Os accommodate multiple parallel telecom interfaces in a single device.
Recommended
Industrial Control and Bus Controllers
The EPF10K30EFC256-2X is found in industrial PLCs, motor controllers, and fieldbus interface cards where it implements custom control logic, encoder decoding, and serial protocol handling. Its 0.6 ns propagation delay allows fast feedback loop implementations. The 0°C to 70°C commercial operating temperature range suits indoor control cabinet environments, while the 176 I/Os accommodate multiple sensor inputs and actuator outputs.
Recommended
Legacy Communications Infrastructure
Many installed telecom base stations and switching centers still rely on FLEX-10KE FPGAs for channel card processing. The EPF10K30EFC256-2X supports custom framing, encryption pre-processing, and routing functions on legacy equipment. Its mature Quartus II and MAX+PLUS II toolchain support keeps existing designs operational, and authorized distributors continue to supply stock for service continuity.
Recommended
Test and Measurement Equipment
The EPF10K30EFC256-2X is used in test equipment for custom timing generation, pattern matching, and data acquisition sequencing. Its embedded EABs can implement deep FIFOs for capturing high-speed transients, while the 176 I/Os drive multiple test channels simultaneously. The 200 MHz internal frequency supports high-resolution timing applications in oscilloscope and logic analyzer auxiliary modules.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K30EFC256-2X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K30EFC256-2N | EPF10K30EFC256-2 | EPF10K30EFC256-1X | EPF10K30EFC256-1 | EPF10K100EFC256-2X |
|---|---|---|---|---|---|---|
| Package | 256-FBGA (17x17) | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Series / Family | FLEX-10KE | FLEX-10KE | FLEX-10KE | FLEX-10KE | FLEX-10KE | FLEX-10KE |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 4,992 |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 100,000 |
| Speed Grade | -2 | -2 | -2 | -1 | -1 | -2 |
| Internal Frequency (Max) | 200 MHz | 200 MHz | 200 MHz | ~125 MHz (lower fMAX) | ~125 MHz (lower fMAX) | 200 MHz |
| Total RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 40,960 |
| User I/Os | 176 | 176 | 176 | 176 | 176 | 176 |
Key Differentiators
- Exact same FLEX-10KE silicon and 256-FBGA footprint for zero-design-change drops (vs EPF10K30EFC256-2N)
- Three times more logic capacity in the same footprint for design growth headroom (vs EPF10K100EFC256-2X)
- Higher speed grade offers ~60% higher fMAX for timing-critical paths (vs EPF10K30EFC256-1X)
Design Notes
The EPF10K30EFC256-2X operates from a 2.375 V to 2.625 V core supply with separate VCCIO pins for I/O bank voltage selection. Decoupling per Altera FLEX-10KE guidelines requires bulk capacitors (≥47 µF) at each power plane entry plus 0.1 µF and 0.01 µF high-frequency ceramics near each VCC/VCCIO pin group. Power sequencing between VCCINT and VCCIO must be coordinated to prevent I/O latchup during power-up.
Estimated: at typical 2.5 V core with 80% toggle rate at 200 MHz, core current approximates 250-400 mA, dissipating ~0.6-1.0 W. The 256-FBGA package requires a properly designed thermal copper pour and via array beneath the die to dissipate heat to inner PCB layers. Forced airflow is recommended for closed enclosure designs. Junction temperature must remain below 125°C for the commercial-grade EPF10K30EFC256-2X (0°C to 70°C ambient range).
Use at least a 4-layer PCB with dedicated ground and power planes for FLEX-10KE designs. The 256-FBGA 17x17 mm package requires 1.0 mm pitch BGA fanout routing - use microvia stack-ups or HDI technology for breakout. Reference the Altera AN-114 application note for BGA escape routing and impedance-controlled trace recommendations.
Common pitfalls: (1) Do not confuse -2X (lead-free speed grade -2) with -2N (lead-free speed grade -2 with N suffix indicating different lead-finish variant); both are functional drop-ins but check your contract manufacturer's RoHS requirements. (2) The FLEX-10KE configuration schemes require external configuration devices (e.g., EPC2) - verify JTAG chain integrity. (3) The MAX+PLUS II legacy toolchain is end-of-life; use Quartus II 13.0 or earlier Web Edition for continued design support.
Compliance Information
RoHS and lead-free status not specified in verified web data. The -2X suffix historically indicates a Pb-free mat tin finish per Altera legacy naming conventions, but this should be confirmed against the manufacturer's material declaration. AEC-Q100 not applicable - this is a commercial-grade legacy FPGA.
