EPF10K30EFC256-2XN - 30K FLEX-10KE FPGA, 256-BGA, Industrial | Altera
MPN: EPF10K30EFC256-2XN ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $14 | $1,400.00 |
| 250 | $12.5 | $3,125.00 |
| 500 | $11.25 | $5,625.00 |
| 1,000 | $9.8 | $9,800.00 |
EPF10K30EFC256-2XN Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that can be re-programmed to implement arbitrary digital logic functions. FPGAs sit above fixed-function ASICs and microcontrollers in flexibility, occupying the niche between software-defined microcontrollers and fully custom silicon - enabling rapid prototyping, low-volume production, and hardware-reconfigurable signal processing. The FLEX 10KE family introduced embedded array blocks (EABs) for on-chip RAM and ROM, making it suitable for designs requiring distributed memory alongside logic.
Key features include 24,576 bits of embedded RAM (6 EABs of 4,096 bits each), multi-volt I/O support (3.3 V and 5.0 V tolerant), in-system programmability via JTAG, and built-in PCI compliance for bus-interface designs. The 256-FBGA 17x17 mm package provides high pin density for compact board layouts, with all 176 user I/Os available at standard logic levels.
The architecture combines 1,728 logic elements (each containing a 4-input LUT and a register) with embedded array blocks for synchronous memory, allowing single-chip implementation of glue logic, state machines, bus bridges, and DSP datapaths. MultiVolt I/O lets the device interface directly with 5 V, 3.3 V, and 2.5 V peripherals without external level shifters, a significant advantage in mixed-voltage systems.
Typical applications include telecom interface cards, industrial control and automation, legacy PCI bridge logic, motor control, and glue logic replacement in telecom and embedded systems where the FLEX 10KE remains in long-lifecycle production. The industrial temperature range and EOL-managed mature-node silicon also suit it for defense and aerospace programs requiring stable, multi-decade component availability.
When designing with this part, remember the FLEX 10KE requires 2.5 V core; plan a separate regulator from any 3.3 V or 5 V rails. The device is configured via JTAG or an Altera EPC configuration EEPROM, and Quartus II (legacy versions) or MAX+PLUS II software is used for design entry. For new designs, consider Cyclone IV or MAX 10 as modern, lower-power, higher-density drop-in-compatible replacements in many applications.
This page synthesizes distributor pricing, drop-in alternatives, lifecycle notes, and practical design guidance for engineers maintaining FLEX 10KE-based systems, information not consolidated in the manufacturer datasheet alone.
Drop-in alternatives for EPF10K30EFC256-2XN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K30EFC256-2XN (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Process Technology, Core Supply Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K30EFC256-2X
✅ Drop-In✓ In Stock
$17.95 / Unit
View Datasheet →EPF10K30EFC256-2
✅ Drop-In✓ In Stock
$12.1 / Unit
View Datasheet →EPF10K30EFC256-2N
✅ Drop-In✓ In Stock
$48.57 / Unit
View Datasheet →EPF10K30EFC256-3N
✅ Drop-In✓ In Stock
$58 / Unit
View Datasheet →EPF10K30EFC256-1X
✅ Drop-In✓ In Stock
$95.6 / Unit
View Datasheet →EPF10K30EFC256-2XN Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Typical Gates | 30,000 |
| Logic Elements | 1,728 |
| Logic Cells | 1,728 |
| Embedded RAM Bits | 24,576 (6 x 4,096-bit EABs) |
| User I/O Pins | 176 |
| Logic Blocks (LABs) | 216 |
| Process Technology | 0.22 micrometer CMOS, 4-layer metal |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) |
| Internal Frequency (max) | 200 MHz |
| Speed Grade | -2 |
| I/O Standards Supported | 3.3 V, 5.0 V (MultiVolt I/O) |
| Operating Temperature | -40 C to +85 C (Industrial, 'N' suffix) |
| Package | 256-ball FBGA, 17x17 mm |
| Configuration Interface | JTAG / serial via EPC EEPROM |
| Mounting Type | Surface Mount |
| Lead-Free / RoHS | Yes (per 'N' suffix) |
| MSL Level | 3 (168 hours) |
EPF10K30EFC256-2XN 256-ball fbga, 17x17 mm Pin Configuration Guide
Pin configuration for EPF10K30EFC256-2XN (256-ball fbga, 17x17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K30EFC256-2XN.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K30EFC256-2XN is suitable for 6 applications: Telecom Interface Cards and Line Cards, Industrial Control and PLC Systems, Legacy PCI Bridge and Bus Interface Logic, Glue Logic Replacement in Embedded Systems, Test and Measurement Instrumentation, Defense and Aerospace Legacy Programs.
Telecom Interface Cards and Line Cards
The EPF10K30EFC256-2XN is widely deployed in telecom interface cards where its 30K-gate capacity, 176 I/Os, and 200 MHz internal frequency handle glue logic, TDM bus multiplexing, and protocol conversion. The MultiVolt 3.3 V/5.0 V I/O support lets the FPGA interface directly with legacy 5 V telecom ASICs and 3.3 V processors without external level shifters, simplifying board design. Embedded array blocks (6 x 4,096-bit EABs) provide 24 Kbits of synchronous RAM for FIFO buffers and lookup tables used in channel-associated signaling. Industrial temperature range ensures reliable operation in central-office environments with elevated ambient temperatures.
Recommended
Industrial Control and PLC Systems
In industrial control systems, the EPF10K30EFC256-2XN serves as a programmable logic controller (PLC) coprocessor, motor-control timing engine, and field-bus protocol bridge. Its 1,728 logic elements handle deterministic state machines for stepper/servo control, while the 24 Kbits of embedded RAM implement encoder-capture buffers and PID loop state. The 256-FBGA package supports the dense I/O requirements of multi-axis motor drives (pulse/direction, encoder feedback, limit switches, and analog gate-driver control). Industrial temperature grade (-40 C to +85 C) and Altera's long-life program make it suitable for factory-floor equipment requiring 10-15 year product lifecycles.
Recommended
Legacy PCI Bridge and Bus Interface Logic
The EPF10K30EFC256-2XN includes built-in PCI-compliant I/O drivers, making it ideal for legacy PCI bus bridges and interface cards in industrial PCs, medical imaging, and test equipment. The 176 user I/Os accommodate 32-bit PCI plus local bus expansion, address decoding, and interrupt steering logic. With 1,728 logic elements, designers can implement bus-master DMA controllers, target devices, and protocol translation logic (PCI to ISA, PCI to local bus) on a single chip. The FLEX 10KE family's proven PCI compliance reduces certification effort compared to discrete logic implementations, and the 256-FBGA footprint is shared with other PCI-capable Altera FPGAs.
Recommended
Glue Logic Replacement in Embedded Systems
The EPF10K30EFC256-2XN is frequently used to replace dozens of 74-series TTL/CMOS glue-logic chips with a single programmable device, reducing board area and BOM cost while adding design flexibility. Common glue-logic functions implemented include address decoding, wait-state generation, chip-select steering, bus multiplexing, and reset distribution. The 176 I/Os handle wide data and address buses, and embedded RAM blocks can implement FIFO buffers between mismatched bus widths. Engineers can iterate pin assignments and logic without respinning the PCB, dramatically shortening development cycles for embedded computing platforms.
Recommended
Test and Measurement Instrumentation
In test and measurement equipment (logic analyzers, protocol testers, bench-top instruments), the EPF10K30EFC256-2XN implements custom timing generators, pattern sequencers, and parallel-data capture logic. The 200 MHz internal frequency supports high-speed state-machine operation, while the embedded RAM blocks serve as deep capture buffers and waveform lookup tables. The 176 I/Os enable parallel connectivity to multiple instrument channels, display controllers, and trigger sources. Industrial temperature grade and long-term Altera/Intel supply through Rochester Electronics make it suitable for high-end T&M products with multi-decade production runs.
Recommended
Defense and Aerospace Legacy Programs
The EPF10K30EFC256-2XN's mature 0.22 micrometer silicon, industrial temperature range, and long-term availability through Rochester Electronics make it well-suited for defense and aerospace legacy programs requiring component stability over 15-25 year deployment cycles. The FPGA implements avionics bus interfaces (MIL-STD-1553, ARINC 429 glue logic), radar timing, and signal-conditioning logic in upgraded legacy systems. Its established Altera tooling (Quartus II / MAX+PLUS II) and extensive documentation support long-term maintenance by program engineering teams. The lead-free RoHS packaging complies with modern defense environmental regulations while preserving pin compatibility with legacy designs.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K30EFC256-2XN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K30EFC256-2X | EPF10K30EFC256-2 | EPF10K30EFC256-2N | EPF10K30EFC256-3N | EPF10K30EFC256-1X |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same |
| Logic Elements | 1,728 | 1,728 - same | 1,728 - same | 1,728 - same | 1,728 - same | 1,728 - same |
| Typical Gates | 30,000 | 30,000 - same | 30,000 - same | 30,000 - same | 30,000 - same | 30,000 - same |
| Speed Grade | -2 | -2 (same) | -2 (same) | -2 (same) | -3 (faster) | -1 (slower) |
| Temperature Grade | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Commercial (0 to +70 C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) |
| Lead-Free / RoHS | Yes (N suffix) | Yes (X suffix) | No (Pb-bearing) | Yes (N suffix) | Yes (N suffix) | Yes (X suffix) |
| Embedded RAM | 24,576 bits (6 x EABs) | 24,576 bits - same | 24,576 bits - same | 24,576 bits - same | 24,576 bits - same | 24,576 bits - same |
| User I/Os | 176 | 176 - same | 176 - same | 176 - same | 176 - same | 176 - same |
| Lifecycle Status | Last Time Buy | Obsolete | Obsolete | Last Time Buy | Last Time Buy | Obsolete |
Key Differentiators
- Industrial temperature grade with RoHS lead-free compliance (vs EPF10K30EFC256-2 (commercial-temp, Pb-bearing))
- True drop-in compatibility within the FLEX 10KE 256-FBGA family (vs Cyclone IV EP4CE30F29 (modern replacement))
- Long-term supply through franchised legacy distributor (vs Most other FLEX 10KE speed grades now obsolete)
Design Notes
The FLEX 10KE requires a clean 2.5 V core supply (2.375 V to 2.625 V) - plan a dedicated LDO (e.g., LT1117-2.5 or TPS7A4533) rather than sharing a 3.3 V rail. I/O banks can be independently powered at 3.3 V or 5.0 V thanks to MultiVolt I/O; tie unused VCCIO pins to the same rail as the active bank to avoid floating inputs. Estimated: at 100% toggle rate on all 176 I/Os, ICC_core can reach 100-150 mA - decouple with 0.1 uF + 10 uF per supply pin cluster, placed within 5 mm of the FBGA balls.
The 256-FBGA package uses 1.0 mm ball pitch - use at least 4-layer PCB with continuous GND plane under the BGA and 0.4 mm laser-drilled microvias for breakout. Fan-out the inner balls to inner signal layers with via-in-pad if board area is tight; otherwise dog-bone fan-out with 0.5 mm via drill works. Match trace length within each I/O bank if you are implementing source-synchronous interfaces (LVDS-style timing not natively supported, but DDR-style capture is).
Do NOT confuse the EPF10K30EFC256-2XN (industrial temp, Pb-free, 'N' suffix) with the EPF10K30EFC256-2 (commercial, Pb-bearing) - mixing them causes RoHS compliance failures in production audits. Also: ensure your Quartus II version targets FLEX 10KE (legacy toolchain v13.0 sp1 or earlier); newer Quartus Prime versions do not support this family. Use the EPC2, EPC4, or EPC8 configuration EEPROM for serial-mode boot rather than relying on a microprocessor to bit-bang configuration data - JTAG-only boot fails after power-cycle reset.
Estimated: at 200 MHz, 80% utilization, the EPF10K30EFC256-2XN dissipates approximately 0.5-0.8 W depending on switching activity. With theta_JA around 25 C/W for the 256-FBGA on a 4-layer JEDEC test board, junction temperature rise above ambient is 12-20 C. Industrial-temp parts are rated to +85 C ambient, so this is well within margin - no heatsink required. For sealed enclosures with no airflow, validate with a thermal probe on a center BGA ball under worst-case workload.
Compliance Information
RoHS compliant per 'N' suffix in MPN per Altera ordering guide. Lead-free (Pb-free) packaging confirmed. Halogen-free status not explicitly stated in available data - marked unknown. Not AEC-Q100 qualified (FPGAs are not typically AEC-Q100 automotive qualified; this family predates that requirement). REACH compliance inferred from RoHS compliance and Altera/Intel environmental policy.
