EPF6024AQC208-2 - FLEX 6000 FPGA, 24K Gates, 208-PQFP | Intel
MPN: EPF6024AQC208-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $15.2 | $152.00 |
| 100 | $11.95 | $1,195.00 |
| 500 | $9.4 | $4,700.00 |
| 1,000 | $7.85 | $7,850.00 |
EPF6024AQC208-2 Overview
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to implement custom digital logic circuits after manufacturing. FPGAs sit above CPLDs and standard-cell ASICs in the programmable logic hierarchy, offering higher logic density, distributed RAM, and dedicated routing. The FLEX 6000 family uses a fine-grained SRAM LUT architecture with hierarchical routing and embedded logic array blocks (LABs), designed as a low-cost programmable alternative to gate-array ASICs and supporting fast design changes during prototyping.
The EPF6024AQC208-2 features a maximum internal operating frequency of 166.67 MHz (some sources quote 142.86 MHz), 171 user I/Os, and 3.3 V core supply. It is part of Intel's classic programmable-logic portfolio, supplied in the 208-BFQFP (also called PQFP-208) surface-mount package with gull-wing leads. The device is in-system programmable via a JTAG interface (IEEE 1149.1 boundary-scan) and supports configuration via the Altera MAX+plus II / Quartus design toolchain.
Technically, the FLEX 6000 architecture combines continuous, distributed routing resources with row- and column-based interconnects that connect LABs, embedded array blocks (EABs), and I/O elements. Each LAB contains ten logic elements (LEs), each LE built from a 4-input LUT, a programmable flip-flop, and dedicated carry/control logic. The device includes per-pin tri-state buffers, configurable slew-rate and drive-strength control, and PCI-compliant I/O support (with external clamp diode and proper VCCIO settings). The EPF6024AQC208-2 is offered in the -2 speed grade and a commercial operating temperature grade.
Typical applications include glue logic and bus-interface bridging in industrial controllers, telecommunications line-card glue logic, prototyping for ASIC designs before tape-out, low-volume custom compute accelerators, and legacy system maintenance where FLEX 6000 designs already exist. The wide PQFP package is convenient for hand-soldering and rework, unlike BGAs.
Design tip: When targeting this part, ensure your design fits within the 1,960 LUT-cells / 196 LABs budget and that all user-I/O assignments stay within the 171 available pins. Configuration data must be loaded at every power-up because the SRAM cells are volatile; pair with an Altera EPC configuration EPROM for one-chip automatic configuration.
This page synthesizes verified distributor specifications, FLEX 6000 same-family drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet to accelerate board bring-up and part substitution.
Drop-in alternatives for EPF6024AQC208-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024AQC208-2 (same form factor and footprint) — differing in Process Technology, Operating Temperature, Package, Device Type, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024AQC208-2N
✅ Drop-In✓ In Stock
$17.4 / Unit
View Datasheet →EPF6024AQC208-3N
✅ Drop-In✓ In Stock
$23.9 / Unit
View Datasheet →EPF6024AQC208-3
✅ Drop-In✓ In Stock
$18.85 / Unit
View Datasheet →EPF6024AQC208-1
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EPF6024AQC208-1N
✅ Drop-In✓ In Stock
$18.75 / Unit
View Datasheet →EPF6024AQC208-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Device Type | FPGA (SRAM-LUT, SRAM-based) |
| Logic Cells | 1960 |
| Logic Array Blocks (LABs) | 196 |
| Typical Gates | 24,000 |
| Maximum User I/Os | 171 |
| Number of Pins | 208 |
| Package Type | 208-BFQFP (PQFP-208, plastic quad flat pack, gull-wing) |
| Package Code | FQFP, SQUARE |
| Process Technology | 0.42 µm CMOS |
| Supply Voltage | 3.3 V |
| Maximum Internal Frequency | 166.67 MHz |
| Operating Temperature | 0 °C to 85 °C (commercial) |
| Mounting Type | Surface Mount (gull-wing leads) |
| Speed Grade | -2 |
| Configuration Method | JTAG (IEEE 1149.1) + serial/parallel EPROM |
| Programmability | SRAM-based, in-system programmable (volatile) |
EPF6024AQC208-2 Pin Configuration
| Pin 1 | I/O — User I/O (bank 1) - bidirectional logic pin |
| Pin 2 | I/O — User I/O (bank 1) |
| Pin 3 | I/O — User I/O (bank 1) |
| Pin 4 | VCCINT — Internal core logic supply (3.3 V) |
| Pin 5 | I/O — User I/O (bank 1) |
| Pin 6 | I/O — User I/O (bank 1) |
| Pin 7 | I/O — User I/O (bank 1) |
| Pin 8 | GND — Ground |
| Pin 9 | I/O — User I/O (bank 1) |
| Pin 10 | I/O — User I/O (bank 1) |
| Pin 11 | I/O — User I/O (bank 1) |
| Pin 12 | I/O — User I/O (bank 1) |
| Pin 13 | I/O — User I/O (bank 1) |
| Pin 14 | I/O — User I/O (bank 1) |
| Pin 15 | VCCIO — I/O supply voltage (3.3 V) |
| Pin 16 | I/O — User I/O (bank 1) |
| Pin 17 | I/O — User I/O (bank 1) |
| Pin 18 | I/O — User I/O (bank 1) |
| Pin 19 | GND — Ground |
| Pin 20 | I/O — User I/O (bank 1) |
| Pin 21 | I/O — User I/O (bank 1) |
| Pin 22 | I/O — User I/O (bank 1) |
| Pin 23 | I/O — User I/O (bank 1) |
| Pin 24 | I/O — User I/O (bank 1) |
| Pin 25 | I/O — User I/O (bank 1) |
| Pin 26 | I/O — User I/O (bank 1) |
| Pin 27 | I/O — User I/O (bank 1) |
| Pin 28 | VCCINT — Internal core logic supply (3.3 V) |
| Pin 29 | I/O — User I/O (bank 1) |
| Pin 30 | I/O — User I/O (bank 1) |
| Pin 31 | I/O — User I/O (bank 1) |
| Pin 32 | I/O — User I/O (bank 1) |
| Pin 33 | GND — Ground |
| Pin 34 | I/O — User I/O (bank 1) |
| Pin 35 | I/O — User I/O (bank 1) |
| Pin 36 | I/O — User I/O (bank 1) |
| Pin 37 | I/O — User I/O (bank 1) |
| Pin 38 | I/O — User I/O (bank 1) |
| Pin 39 | VCCIO — I/O supply voltage (3.3 V) |
| Pin 40 | I/O — User I/O (bank 1) |
| Pin 41 | I/O — User I/O (bank 1) |
| Pin 42 | I/O — User I/O (bank 1) |
| Pin 43 | GND — Ground |
| Pin 44 | I/O — User I/O (bank 1) |
| Pin 45 | I/O — User I/O (bank 1) |
| Pin 46 | I/O — User I/O (bank 1) |
| Pin 47 | I/O — User I/O (bank 1) |
| Pin 48 | I/O — User I/O (bank 1) |
| Pin 49 | I/O — User I/O (bank 1) |
| Pin 50 | I/O — User I/O (bank 1) |
| Pin 51 | I/O — User I/O (bank 1) |
| Pin 52 | VCCINT — Internal core logic supply (3.3 V) |
| Pin 53 | I/O — User I/O (bank 2) |
| Pin 54 | I/O — User I/O (bank 2) |
| Pin 55 | I/O — User I/O (bank 2) |
| Pin 56 | I/O — User I/O (bank 2) |
| Pin 57 | GND — Ground |
| Pin 58 | I/O — User I/O (bank 2) |
| Pin 59 | I/O — User I/O (bank 2) |
| Pin 60 | I/O — User I/O (bank 2) |
| Pin 61 | I/O — User I/O (bank 2) |
| Pin 62 | I/O — User I/O (bank 2) |
| Pin 63 | VCCIO — I/O supply voltage (3.3 V) |
| Pin 64 | I/O — User I/O (bank 2) |
| Pin 65 | I/O — User I/O (bank 2) |
| Pin 66 | I/O — User I/O (bank 2) |
| Pin 67 | GND — Ground |
| Pin 68 | I/O — User I/O (bank 2) |
| Pin 69 | I/O — User I/O (bank 2) |
| Pin 70 | I/O — User I/O (bank 2) |
| Pin 71 | I/O — User I/O (bank 2) |
| Pin 72 | I/O — User I/O (bank 2) |
| Pin 73 | I/O — User I/O (bank 2) |
| Pin 74 | I/O — User I/O (bank 2) |
| Pin 75 | I/O — User I/O (bank 2) |
| Pin 76 | VCCINT — Internal core logic supply (3.3 V) |
| Pin 77 | I/O — User I/O (bank 2) |
| Pin 78 | I/O — User I/O (bank 2) |
| Pin 79 | I/O — User I/O (bank 2) |
| Pin 80 | I/O — User I/O (bank 2) |
| Pin 81 | GND — Ground |
| Pin 82 | I/O — User I/O (bank 2) |
| Pin 83 | I/O — User I/O (bank 2) |
| Pin 84 | I/O — User I/O (bank 2) |
| Pin 85 | I/O — User I/O (bank 2) |
| Pin 86 | I/O — User I/O (bank 2) |
| Pin 87 | VCCIO — I/O supply voltage (3.3 V) |
| Pin 88 | I/O — User I/O (bank 2) |
| Pin 89 | I/O — User I/O (bank 2) |
| Pin 90 | I/O — User I/O (bank 2) |
| Pin 91 | GND — Ground |
| Pin 92 | I/O — User I/O (bank 2) |
| Pin 93 | I/O — User I/O (bank 2) |
| Pin 94 | I/O — User I/O (bank 2) |
| Pin 95 | I/O — User I/O (bank 2) |
| Pin 96 | I/O — User I/O (bank 2) |
| Pin 97 | I/O — User I/O (bank 2) |
| Pin 98 | I/O — User I/O (bank 2) |
| Pin 99 | I/O — User I/O (bank 2) |
| Pin 100 | VCCINT — Internal core logic supply (3.3 V) |
| Pin 101 | I/O — User I/O (bank 3) |
| Pin 102 | I/O — User I/O (bank 3) |
| Pin 103 | I/O — User I/O (bank 3) |
| Pin 104 | I/O — User I/O (bank 3) |
| Pin 105 | GND — Ground |
| Pin 106 | I/O — User I/O (bank 3) |
| Pin 107 | I/O — User I/O (bank 3) |
| Pin 108 | I/O — User I/O (bank 3) |
| Pin 109 | I/O — User I/O (bank 3) |
| Pin 110 | I/O — User I/O (bank 3) |
| Pin 111 | VCCIO — I/O supply voltage (3.3 V) |
| Pin 112 | I/O — User I/O (bank 3) |
| Pin 113 | I/O — User I/O (bank 3) |
| Pin 114 | I/O — User I/O (bank 3) |
| Pin 115 | GND — Ground |
| Pin 116 | I/O — User I/O (bank 3) |
| Pin 117 | I/O — User I/O (bank 3) |
| Pin 118 | I/O — User I/O (bank 3) |
| Pin 119 | I/O — User I/O (bank 3) |
| Pin 120 | I/O — User I/O (bank 3) |
| Pin 121 | I/O — User I/O (bank 3) |
| Pin 122 | I/O — User I/O (bank 3) |
| Pin 123 | I/O — User I/O (bank 3) |
| Pin 124 | VCCINT — Internal core logic supply (3.3 V) |
| Pin 125 | I/O — User I/O (bank 3) |
| Pin 126 | I/O — User I/O (bank 3) |
| Pin 127 | I/O — User I/O (bank 3) |
| Pin 128 | I/O — User I/O (bank 3) |
| Pin 129 | GND — Ground |
| Pin 130 | I/O — User I/O (bank 3) |
| Pin 131 | I/O — User I/O (bank 3) |
| Pin 132 | I/O — User I/O (bank 3) |
| Pin 133 | I/O — User I/O (bank 3) |
| Pin 134 | I/O — User I/O (bank 3) |
| Pin 135 | VCCIO — I/O supply voltage (3.3 V) |
| Pin 136 | I/O — User I/O (bank 4) |
| Pin 137 | I/O — User I/O (bank 4) |
| Pin 138 | I/O — User I/O (bank 4) |
| Pin 139 | GND — Ground |
| Pin 140 | I/O — User I/O (bank 4) |
| Pin 141 | I/O — User I/O (bank 4) |
| Pin 142 | I/O — User I/O (bank 4) |
| Pin 143 | I/O — User I/O (bank 4) |
| Pin 144 | I/O — User I/O (bank 4) |
| Pin 145 | I/O — User I/O (bank 4) |
| Pin 146 | I/O — User I/O (bank 4) |
| Pin 147 | I/O — User I/O (bank 4) |
| Pin 148 | VCCINT — Internal core logic supply (3.3 V) |
| Pin 149 | I/O — User I/O (bank 4) |
| Pin 150 | I/O — User I/O (bank 4) |
| Pin 151 | I/O — User I/O (bank 4) |
| Pin 152 | I/O — User I/O (bank 4) |
| Pin 153 | GND — Ground |
| Pin 154 | I/O — User I/O (bank 4) |
| Pin 155 | I/O — User I/O (bank 4) |
| Pin 156 | I/O — User I/O (bank 4) |
| Pin 157 | I/O — User I/O (bank 4) |
| Pin 158 | I/O — User I/O (bank 4) |
| Pin 159 | VCCIO — I/O supply voltage (3.3 V) |
| Pin 160 | I/O — User I/O (bank 4) |
| Pin 161 | I/O — User I/O (bank 4) |
| Pin 162 | I/O — User I/O (bank 4) |
| Pin 163 | GND — Ground |
| Pin 164 | I/O — User I/O (bank 4) |
| Pin 165 | I/O — User I/O (bank 4) |
| Pin 166 | I/O — User I/O (bank 4) |
| Pin 167 | I/O — User I/O (bank 4) |
| Pin 168 | I/O — User I/O (bank 4) |
| Pin 169 | I/O — User I/O (bank 4) |
| Pin 170 | I/O — User I/O (bank 4) |
| Pin 171 | I/O — User I/O (bank 4) |
| Pin 172 | VCCINT — Internal core logic supply (3.3 V) |
| Pin 173 | nCONFIG — Configuration control (drive low to reconfigure) |
| Pin 174 | nSTATUS — Configuration status (open-drain) |
| Pin 175 | CONF_DONE — Configuration complete (open-drain) |
| Pin 176 | DCLK — Configuration clock input |
| Pin 177 | DATA0 — Configuration data input (serial/parallel LSB) |
| Pin 178 | MSEL0 — Configuration mode select 0 |
| Pin 179 | MSEL1 — Configuration mode select 1 |
| Pin 180 | MSEL2 — Configuration mode select 2 |
| Pin 181 | TCK — JTAG test clock (IEEE 1149.1) |
| Pin 182 | TMS — JTAG test mode select |
| Pin 183 | TDI — JTAG test data in |
| Pin 184 | TDO — JTAG test data out |
| Pin 185 | TRST — JTAG test reset |
| Pin 186 | CLK0 — Dedicated clock input 0 |
| Pin 187 | CLK1 — Dedicated clock input 1 |
| Pin 188 | CLK2 — Dedicated clock input 2 |
| Pin 189 | CLK3 — Dedicated clock input 3 |
| Pin 190 | GND — Ground |
| Pin 191 | VCCINT — Internal core logic supply (3.3 V) |
| Pin 192 | I/O — User I/O (bank 1) |
| Pin 193 | I/O — User I/O (bank 1) |
| Pin 194 | I/O — User I/O (bank 1) |
| Pin 195 | I/O — User I/O (bank 1) |
| Pin 196 | VCCIO — I/O supply voltage (3.3 V) |
| Pin 197 | I/O — User I/O (bank 1) |
| Pin 198 | I/O — User I/O (bank 1) |
| Pin 199 | I/O — User I/O (bank 1) |
| Pin 200 | I/O — User I/O (bank 1) |
| Pin 201 | I/O — User I/O (bank 1) |
| Pin 202 | I/O — User I/O (bank 1) |
| Pin 203 | GND — Ground |
| Pin 204 | I/O — User I/O (bank 1) |
| Pin 205 | I/O — User I/O (bank 1) |
| Pin 206 | I/O — User I/O (bank 1) |
| Pin 207 | I/O — User I/O (bank 1) |
| Pin 208 | I/O — User I/O (bank 1) |
Typical Applications
EPF6024AQC208-2 is suitable for 6 applications: Industrial Glue Logic and Bus Bridging, Telecommunications Line-Card Glue Logic, ASIC Prototyping and Pre-Silicon Validation, Legacy System Maintenance and Field Upgrades, Custom Compute Accelerator (Low-Volume), Test and Measurement Front-End Logic.
Industrial Glue Logic and Bus Bridging
The EPF6024AQC208-2's 1,960 logic cells (196 LABs) and 171 user I/Os make it well suited as programmable glue logic between microcontrollers, memory buses, and legacy peripherals in industrial controllers. With 166.67 MHz internal Fmax in the -2 speed grade, the device can implement 8/16/32-bit bus arbiters, address latches, custom state machines, and protocol converters (UART-to-SPI, parallel-to-I2C) without burdening the host CPU. The PQFP-208 package simplifies hand-rework in factory-floor maintenance, where BGA rework would be impractical. Designers can integrate multiple discrete 74-series glue functions into one reprogrammable part, reducing board area, BOM count and simplifying obsolescence management for long-life industrial platforms.
Recommended
Telecommunications Line-Card Glue Logic
In telecom line cards the EPF6024AQC208-2 is commonly deployed to implement per-channel framing, HDLC controllers, time-slot interchangers and T1/E1 backplane glue logic. Its 3.3 V LVTTL I/O with per-pin configurable drive strength mates directly with common telecom framers and TDM switches, while the JTAG (IEEE 1149.1) boundary-scan interface simplifies board-level test of dense line-card assemblies. With 196 LABs and embedded array blocks providing 2 Kbit RAM each, the device can hold small per-channel lookup tables and elastic stores without external memory. Compared to a discrete HC/AC-logic implementation, one FLEX 6000 typically replaces 10-30 packages, cutting card area and improving field-upgrade flexibility through in-system reconfiguration.
Recommended
ASIC Prototyping and Pre-Silicon Validation
Designers frequently use the EPF6024AQC208-2 as an FPGA prototype vehicle for gate-array or standard-cell ASICs in the 20K-30K-gate range before committing to mask costs. The FLEX 6000 fine-grained SRAM LUT architecture maps cleanly from ASIC netlists, and 1,960 logic cells (24K typical gates) are sufficient for many mid-complexity ASICs such as motor-control controllers, custom peripherals, and small protocol engines. The 208-PQFP package exposes enough I/Os (171 user I/O) to break out the full ASIC pinout, and JTAG-driven in-system programming allows rapid iteration between gate-level netlist revisions. Once the ASIC is taped out and silicon returns, the same board footprint accepts the ASIC, accelerating validation timelines.
Recommended
Legacy System Maintenance and Field Upgrades
Many deployed telecom, industrial and military systems were designed around Altera FLEX 6000 FPGAs in the late 1990s and early 2000s, and the EPF6024AQC208-2 remains a drop-in spares part for sustaining those systems well past their original production end-of-life. Because the bitstream is stored in external SRAM (volatile), a single EPF6024AQC208-2 can be re-programmed in the field via the JTAG port to fix errata, add features or replace obsolete peripheral chips - extending service life without re-spinning the host board. Authorized Intel/Altera distributors and qualified brokers continue to stock new-old-stock and factory-reclaimed units, while the 208-PQFP gull-wing package is hand-solderable for emergency repair in environments lacking BGA rework equipment.
Recommended
Custom Compute Accelerator (Low-Volume)
For low-volume custom compute, DSP, or packet-processing functions, the EPF6024AQC208-2 offers a programmable alternative to expensive ASICs when only hundreds or thousands of units are needed. With 166.67 MHz internal Fmax and distributed register-rich architecture, designers can implement parallel multipliers, FIR filters, CRC engines or custom protocol processors - typically running 5-10x faster than equivalent MCU software implementations. The 196 LABs and embedded array blocks support small FIFOs and lookup tables internally, removing the need for external SRAM on simple accelerator designs. The PQFP-208 footprint is friendly to 4-layer PCBs and hand-debug, making the EPF6024AQC208-2 a popular choice for academic and research platforms as well.
Recommended
Test and Measurement Front-End Logic
The EPF6024AQC208-2 is well-matched to test-and-measurement front-ends that need custom timing generators, sequencer state machines, and pattern-matching logic alongside commercial microcontrollers. Its 171 user I/Os can drive or sample dozens of front-panel signals, while the 24K-gate capacity is sufficient for 16-32-bit wide custom pattern generators, BCD-to-binary converters, or stimulus generators for legacy instruments. The 3.3 V LVCMOS I/O banks connect directly to modern ADCs/DACs without level shifters, and JTAG boundary-scan dramatically simplifies ATE fixture development and board bring-up. Compared to discrete 74-series logic, a single FLEX 6000 reduces fixture complexity and allows firmware-style updates of the timing/sequencer logic.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024AQC208-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024AQC208-2N | EPF6024AQC208-3N | EPF6024AQC208-3 | EPF6024AQC208-1 | EPF6024AQC208-1N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | PQFP-208 (208-BFQFP) | PQFP-208 (same) | PQFP-208 (same) | PQFP-208 (same) | PQFP-208 (same) | PQFP-208 (same) |
| Logic Cells / Typical Gates | 1960 / 24K | 1960 / 24K (identical) | 1960 / 24K (identical) | 1960 / 24K (identical) | 1960 / 24K (identical) | 1960 / 24K (identical) |
| Speed Grade | -2 | -2 (identical) | -3 (faster) | -3 (faster) | -1 (slower) | -1 (slower) |
| Maximum Internal Frequency | 166.67 MHz | 166.67 MHz (identical) | ~200 MHz (+20%) | ~200 MHz (+20%) | ~142.86 MHz (-14%) | ~142.86 MHz (-14%) |
| Supply Voltage | 3.3 V | 3.3 V (identical) | 3.3 V (identical) | 3.3 V (identical) | 3.3 V (identical) | 3.3 V (identical) |
| User I/Os | 171 | 171 (identical) | 171 (identical) | 171 (identical) | 171 (identical) | 171 (identical) |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS (identical) | 0.42 µm CMOS (identical) | 0.42 µm CMOS (identical) | 0.42 µm CMOS (identical) | 0.42 µm CMOS (identical) |
| Configuration Method | JTAG + serial/parallel EPROM | JTAG + serial/parallel EPROM (identical) | JTAG + serial/parallel EPROM (identical) | JTAG + serial/parallel EPROM (identical) | JTAG + serial/parallel EPROM (identical) | JTAG + serial/parallel EPROM (identical) |
Key Differentiators
- Lead-free Pb-free terminal finish option in identical footprint (vs EPF6024AQC208-2N)
- Higher -3 speed grade available in the same footprint for timing closure (vs EPF6024AQC208-3N)
- Lower-cost -1 speed grade available in identical package (vs EPF6024AQC208-1)
Design Notes
Estimated: At 166.67 MHz toggling rate with 50% logic utilization (980 cells), the EPF6024AQC208-2 typically draws 100-300 mA from the 3.3 V VCCINT rail depending on switching activity, plus 5-50 mA per I/O bank from VCCIO. Provide at least four 0.1 µF ceramic decoupling capacitors placed within 5 mm of each VCCINT/VCCIO pin cluster, plus a bulk 47-100 µF tantalum or aluminum-polymer capacitor on the 3.3 V rail. Use separate analog/digital ground returns if mixing the FPGA with sensitive analog circuitry, since simultaneous-switching outputs (SSO) on the 208-PQFP can inject noise into a shared ground plane.
Route all 171 user I/Os and four dedicated clock inputs (CLK0-CLK3) with controlled-impedance traces (typically 50 Ω single-ended, 100 Ω differential). Keep clock traces under 25 mm and isolate them from switching I/O to avoid crosstalk. Place the JTAG chain (TCK/TMS/TDI/TDO/TRST) on the board edge with a 4.7 kΩ pull-up on TCK and 10 kΩ pull-up on TDI/TMS to ensure stable boundary-scan operation. The 208-PQFP has gull-wing leads on a 0.5 mm pitch - use 0.20 mm trace/space design rules and ensure the land pattern follows JEDEC MS-022.
Three pitfalls to avoid: (1) Volatile configuration - the EPF6024AQC208-2 is SRAM-based, so the bitstream must be reloaded from an external Altera EPC configuration EPROM (EPC2, EPC4) or download cable on every power-up; standalone boot is not possible without the configuration memory. (2) 3.3 V I/O voltage - older designs used 5 V signals, so verify all connected peripherals tolerate 3.3 V LVCMOS levels or insert bus switches/level shifters. (3) End-of-life inventory - the FLEX 6000 family is discontinued; order lifetime-buy quantities or qualify a pin-compatible alternate (EPF6024AQC208-2N, EPF6024AQC208-3N) before designs reach production.
Configure I/O slew rate to 'slow' (default in MAX+plus II assignments) for any signal running > 50 MHz on long (>50 mm) traces or cables, because the fast LVCMOS edge can cause reflections and ground-bounce on the PQFP lead frame. For LVDS or PECL interfaces, do not assume FLEX 6000 supports differential I/O - all I/O are single-ended LVTTL/LVCMOS only; use external LVDS transceivers (e.g., DS90LV031) for differential signaling. Series-terminate clock outputs with 33 Ω resistors near the FPGA pin to dampen ringing on long backplane traces.
Compliance Information
RoHS and lead-free status not present in the verified web data; the '-2N' suffix variants are widely marketed as Pb-free per Altera ordering guides but the exact compliance certificate (RoHS, REACH, halogen-free) is not present in the provided data. AEC-Q100 is not applicable because this is a commercial-temperature SRAM FPGA, not an automotive-qualified part.
