EPF6024AQC240-4 - FLEX 6000 24K Gates FPGA, 240-PQFP | Altera
MPN: EPF6024AQC240-4 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $85.5 | $855.00 |
| 100 | $76 | $7,600.00 |
| 500 | $68.4 | $34,200.00 |
| 1,000 | $61.75 | $61,750.00 |
EPF6024AQC240-4 Overview
A FLEX 6000 device is a CMOS SRAM-based programmable logic device (PLD) that combines the high integration of a gate array with the design flexibility of a programmable logic device. It belongs to the broader taxonomy: FPGA -> programmable logic device -> logic IC -> integrated circuit. FLEX 6000 devices use a Look-Up Table (LUT)-based architecture combined with continuous FastTrack interconnect, making them well suited for designs that require medium-density logic, predictable timing, and in-system reconfigurability via SRAM configuration cells.
Key features of the EPF6024AQC240-4 include 24,000 typical gates, 1,960 logic elements, 196 LABs, 199 maximum user I/Os, an internal operating frequency in the range of 170-200 MHz depending on configuration, and 3.3V core supply with 5V-tolerant I/O on selected banks. The PQFP-240 package is a through-hole-compatible surface-mount footprint measuring approximately 32 mm x 32 mm with 0.5 mm pitch, suitable for prototype boards and legacy designs.
The architecture combines four-input LUTs per logic element with FastTrack continuous interconnect, providing fast and predictable timing for datapath, state machine, and bus-interface logic. Configuration is loaded from a serial or parallel EPROM at power-up, supporting 5V/3.3V PCI and other common bus standards of the era.
Typical applications for the EPF6024AQC240-4 include bus-interface bridging (PCI to ISA, VME bridges), telecommunications glue logic, industrial control and instrumentation, test and measurement equipment, and legacy system replacements. With 199 user I/Os and 24K gates, it targets medium-density logic consolidation tasks.
When designing with this part, ensure that the configuration PROM is correctly sized for the chosen data-compression mode and that the JTAG chain (if used) is properly terminated. Designers should also note that this device is in the legacy/last-time-buy window; long-term production designs should evaluate modern replacements such as the Altera MAX II or Cyclone families.
This page synthesizes distributor pricing, drop-in alternatives drawn from the Site MPN list, and practical design notes not found in the original datasheet PDF, providing AI-citable context for engineers migrating or maintaining FLEX 6000 designs.
Drop-in alternatives for EPF6024AQC240-4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024AQC240-4 (same form factor and footprint) — differing in Speed Grade, Package, Configuration Method, Operating Temperature, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024AQC240-3
✅ Drop-In✓ In Stock
$19.8 / Unit
View Datasheet →EPF6024AQC240-2
✅ Drop-In✓ In Stock
$23.1 / Unit
View Datasheet →EPF6024AQC240-1
✅ Drop-In✓ In Stock
$18.95 / Unit
View Datasheet →EPF6024AQC240-3N
✅ Drop-In✓ In Stock
$69.3 / Unit
View Datasheet →EPF6024AQC240-2N
✅ Drop-In✓ In Stock
$26.1 / Unit
View Datasheet →EPF6016AQC240-3
✅ Drop-In📋 Reference alternative (not in catalog)
EPF6024AQC240-4 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Device Type | FPGA (SRAM-based) |
| Typical Gates | 24,000 |
| Logic Elements | 1,960 |
| LABs (Logic Array Blocks) | 196 |
| Maximum User I/Os | 199 |
| Speed Grade | -4 |
| Operating Temperature | 0C to +70C (Commercial) |
| Supply Voltage (Core) | 3.3 V |
| Package | PQFP-240 (240-pin) |
| Package Family | PQFP / QFP-240 (plastic) |
| Mounting Type | Surface Mount |
| Configuration Method | SRAM, serial or parallel EPROM |
EPF6024AQC240-4 pqfp / qfp-240 (plastic) Pin Configuration Guide
Pin configuration for EPF6024AQC240-4 (pqfp / qfp-240 (plastic) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6024AQC240-4.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6024AQC240-4 is suitable for 6 applications: PCI-to-ISA Bus Bridge, Industrial Control Glue Logic, Telecommunications Backplane Logic, Test and Measurement Equipment, Legacy System Replacement Board, VMEbus Interface Controller.
PCI-to-ISA Bus Bridge
The EPF6024AQC240-4's 24K-gate density and 199 user I/Os make it ideal for PCI-to-ISA bus-bridging applications where a single device must handle the full 32-bit PCI bus plus the legacy ISA bus plus state-machine glue logic. With 196 LABs and 1,960 logic elements, the part can hold the full bridge state machine, address decoding, interrupt steering, and DMA controller logic in a single chip. The -4 speed grade is sufficient for 33 MHz PCI, which has a 30 ns clock period easily met by the -4 timing corner. Designers should note that 5V PCI signaling requires the 5V-tolerant I/O banks configured for PCI standard compliance.
Recommended
Industrial Control Glue Logic
Industrial control systems frequently need to consolidate scattered 74-series glue logic into a single programmable device, and the EPF6024AQC240-4 fits this role with 24K gates of capacity and 199 I/Os to handle address decoding, bus arbitration, peripheral interfacing, and timing generation. The commercial 0C to +70C temperature range is acceptable for cabinet-mounted industrial controllers; for harsher environments the industrial-grade EPF6024AQI variant (if available) should be selected. The 3.3V core supply integrates cleanly with modern industrial MCUs and the 5V-tolerant I/Os bridge to legacy 5V peripherals.
Recommended
Telecommunications Backplane Logic
The EPF6024AQC240-4 is well suited for telecommunications backplane interface logic where it must handle HDLC framing, time-slot assignment, clock distribution, and backplane arbitration across 199 user I/Os. The 196 LABs provide sufficient capacity for multiple independent channel controllers running concurrently, and the FastTrack continuous interconnect ensures predictable timing for backplane signals where skew matters. The -4 speed grade suits T1/E1 (1.544/2.048 MHz) and lower-speed backplanes, while higher-speed designs should use the -2 or -1 speed grade variants.
Recommended
Test and Measurement Equipment
Test equipment such as logic analyzers, protocol testers, and bench instruments benefit from the EPF6024AQC240-4's combination of 199 I/Os and reprogrammable logic, allowing engineers to update instrument functionality via configuration bitstream changes without PCB rework. The 24K-gate capacity holds pattern generators, timing sequencers, and display drivers. JTAG (IEEE 1149.1) support enables in-system firmware updates, and the SRAM-based configuration allows field upgrades. The commercial 0C to +70C range covers benchtop use; for outdoor field test gear, an industrial variant is required.
Recommended
Legacy System Replacement Board
For maintaining or replicating end-of-life systems originally built around the FLEX 6000 family, the EPF6024AQC240-4 serves as a drop-in replacement component for field repairs and manufacturing spares. The PQFP-240 footprint is identical to other FLEX 6000 devices, so repair boards accept any -1, -2, -3, or -4 speed grade interchangeably. Designers of new equipment should plan around last-time-buy availability; the EPF6024AQC240 family remains available at authorized distributors as of 2026-09-12 but new wafer production has ended.
Recommended
VMEbus Interface Controller
The EPF6024AQC240-4 implements a complete VMEbus interface controller including address decoding, bus arbitration, interrupt handling, and block-transfer state machines within its 24K-gate density. The 199 user I/Os accommodate the full VMEbus data and address buses plus local CPU and memory interfaces. The -4 speed grade handles VMEbus DTB cycles at the standard 10 MHz rate with comfortable timing margin. For VME64 designs requiring higher bandwidth, designers should evaluate the -2 or -1 speed grade variants in the same PQFP-240 package.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024AQC240-4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024AQC240-3 | EPF6024AQC240-2 | EPF6024AQC240-1 | EPF6016AQC240-3 |
|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | PQFP-240 | PQFP-240 - same | PQFP-240 - same | PQFP-240 - same | PQFP-240 - same |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 16,000 (-33%) |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,960 | 1,320 (-33%) |
| LABs | 196 | 196 | 196 | 196 | 132 (-33%) |
| Speed Grade | -4 (slowest) | -3 | -2 | -1 (fastest) | -3 |
| Operating Temperature | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Family / Type | FLEX 6000 FPGA (SRAM) | FLEX 6000 FPGA (SRAM) | FLEX 6000 FPGA (SRAM) | FLEX 6000 FPGA (SRAM) | FLEX 6000 FPGA (SRAM) |
Key Differentiators
- Lowest-cost speed grade in the FLEX 6000 PQFP-240 family (vs EPF6024AQC240-1)
- Higher logic density than the EPF6016 family (vs EPF6016AQC240-3)
- Same package enables design migration across speed grades (vs EPF6024AQC208-3)
Design Notes
The EPF6024AQC240-4 requires a clean 3.3V core supply with adequate decoupling: place one 0.1uF ceramic capacitor per VCC pin (typically 12-16 VCC pins on PQFP-240), plus 10uF and 100uF bulk capacitors near the device. Use a star-ground topology with separate analog and digital grounds if mixing 5V and 3.3V domains. Estimated: ICC core current scales with clock frequency; plan for approximately 200-400 mA typical Icore at 50 MHz with all LABs active.
Do not confuse the EPF6024AQC240 family with the EPF6024ATC144 family - the package pin counts and pinouts are entirely different. Verify the footprint matches PQFP-240 before PCB assembly. The PQFP-240 has a 32 mm body with 0.5 mm lead pitch, which requires careful PCB land pattern design and reflow profile control. Also note that the 'A' in EPF6024A indicates the second-generation silicon, while the absence of 'A' would indicate the original EPF6024 with slightly different timing characteristics.
PQFP-240 routing requires careful escape planning: the 0.5 mm pitch allows routing with 4 mil traces and 4 mil spaces on 4-layer boards. Place the configuration EPROM within 50 mm of the EPF6024AQC240-4 to minimize configuration signal trace length, which improves configuration reliability. Keep JTAG chain signals away from high-frequency switching nets, and place a 4.7k ohm pull-up on nCONFIG and a 4.7k ohm pull-down on nSTATUS per the FLEX 6000 configuration handbook.
The PQFP-240 package has an estimated theta_JA of approximately 25-30 C/W on a standard 4-layer JEDEC test board. Estimated: at 3.3V core and 400 mA ICC, internal power dissipation is approximately 1.3W, giving a junction temperature rise of 33-39 C above ambient. Ensure adequate copper pour on the board and consider airflow for high-utilization designs exceeding 50 percent LAB occupancy.
Compliance Information
EPF6024AQC240-4 RoHS and REACH compliance status was not present in the verified web data; standard (non-N suffix) FLEX 6000 devices were typically non-RoHS in the original launch era, but lead-free 'N' suffix variants are available within the family.
