EPM3256AFC256-7 - MAX 3000A CPLD, 256 Macro Cells, BGA-256 | Altera
MPN: EPM3256AFC256-7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $22.5 | $22.50 |
| 10 | $19.8 | $198.00 |
| 100 | $17.2 | $1,720.00 |
| 500 | $14.5 | $7,250.00 |
| 1,000 | $12.1 | $12,100.00 |
EPM3256AFC256-7 Overview
A Complex Programmable Logic Device (CPLD) is a non-volatile programmable logic device that combines multiple PAL/GAL-like logic blocks on a single chip with a centralized interconnect. CPLDs sit between simple glue-logic ICs (small-scale SPLDs) and high-density FPGAs in the programmable logic hierarchy, offering deterministic pin-to-pin timing, instant-on behavior from EEPROM configuration, and low power consumption. The MAX 3000A architecture (CPLD -> programmable logic -> digital IC -> semiconductor) is particularly suited for bus decoding, state-machine control, and address-mapping functions where predictable timing is critical.
Key features of the EPM3256AFC256-7 include 10,000 usable gates, IEEE Std. 1532-compliant 3.3-V in-system programmability (ISP) that supports concurrent programming across multiple PLD vendors, JTAG boundary-scan testing, and open-drain output option for flexible bus interfacing. The 161 available user I/Os provide extensive connectivity for high-pin-count designs, and the 256-ball FBGA package supports fine-pitch surface-mount PCB layouts typical of high-density logic integration.
The device is built on a 0.30 µm CMOS EEPROM process, providing non-volatile storage of the configuration bitstream. With 256 macro cells partitioned across 16 logic array blocks (LABs) and a programmable interconnect array (PIA), the EPM3256AFC256-7 can implement combinational logic, registered logic, and small state machines. Typical propagation delay is specified at 4.5 ns, making it suitable for high-speed control applications.
Typical applications include bus-interface bridging in telecommunications equipment, address decoding in embedded systems, and glue-logic replacement in industrial control. It is widely used in legacy systems, manufacturing automation controllers, and PCI/ISA bus designs where deterministic timing and 5-V tolerance are required. The commercial 0 °C to 70 °C operating range fits office and laboratory environments.
When designing with the EPM3256AFC256-7, ensure the FBGA-256 PCB footprint matches the JEDEC MS-034 ball-map standard. Decoupling capacitors (0.1 µF) should be placed close to each VCC pin, and JTAG chain routing should follow IEEE 1149.1 guidelines for reliable ISP programming. Designers migrating to newer designs should evaluate MAX II or MAX V CPLDs as modern equivalents with lower power consumption.
Drop-in alternatives for EPM3256AFC256-7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPM3256AFC256-7 (same form factor and footprint) — differing in Package, Operating Temperature, Usable Gates, User I/Os, Logic Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM3256AFC256-10
✅ Drop-In✓ In Stock
$19.95 / Unit
View Datasheet →EPM3256AFC256-10N
✅ Drop-In✓ In Stock
$25.95 / Unit
View Datasheet →EPM3128AFC256-7N
✅ Drop-In✓ In Stock
$19.85 / Unit
View Datasheet →EPM3128AFI256-10N
✅ Drop-In✓ In Stock
$9.75 / Unit
View Datasheet →EPM7256BFC256-5N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM3256AFC256-7 Maximum Ratings & Electrical Characteristics
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macro Cells | 256 |
| Logic Array Blocks (LABs) | 16 |
| Usable Gates | 10,000 |
| User I/Os | 161 |
| Pin-to-Pin Logic Delay | 4.5 ns (max) |
| Counter Frequency | 227.3 MHz (max) |
| Propagation Delay (tpd) | 10 ns |
| Core Voltage | 3.3 V |
| I/O Compatibility | 5.0 V / 3.3 V / 2.5 V (MultiVolt I/O) |
| Process Technology | CMOS EEPROM, 0.30 µm |
| In-System Programmability | IEEE Std. 1532-compliant 3.3-V ISP |
| Boundary-Scan Test | JTAG (IEEE 1149.1) |
| Package | FBGA-256 (FineLine BGA), 256 balls |
| Operating Temperature | 0 °C to 70 °C (Commercial) |
| Speed Grade | -7 |
EPM3256AFC256-7 fbga-256 (fineline bga), 256 balls Pin Configuration Guide
Pin configuration for EPM3256AFC256-7 (fbga-256 (fineline bga), 256 balls package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM3256AFC256-7.
Refer to the datasheet for full pin configuration.
Typical Applications
EPM3256AFC256-7 is suitable for 6 applications: Legacy Telecom Bus Interface Bridge, PCI/ISA Address Decoder, Industrial Glue-Logic Replacement, State-Machine-Based Motor Control, Test & Measurement Equipment Front-End, Automotive Dashboard Multiplexing.
Legacy Telecom Bus Interface Bridge
The EPM3256AFC256-7's 161 user I/Os and 5-V tolerant MultiVolt I/O make it ideal for bridging legacy telecom buses such as H.110, MVIP, and SCSA to modern serial interfaces. With 256 macro cells it can implement multiple bus-arbitration state machines and protocol converters in a single device. Its 4.5 ns pin-to-pin delay supports the strict timing budgets of TDM bus interfaces used in telecom backplanes, while the 227.3 MHz counter frequency enables precise timing-reference generation.
Recommended
PCI/ISA Address Decoder
In embedded systems, the EPM3256AFC256-7 is widely deployed as a PCI or ISA address decoder that maps CPU cycles to peripheral chip selects. Its 4.5 ns pin-to-pin delay ensures setup-and-hold timing is met even at 33 MHz PCI bus frequencies. The 161 user I/Os can decode a 32-bit address plus control signals across multiple peripherals, while the JTAG ISP allows field-updatable address maps - critical for embedded designs requiring late-stage configuration changes.
Recommended
Industrial Glue-Logic Replacement
The EPM3256AFC256-7 is used to consolidate dozens of discrete 74-series TTL/CMOS glue-logic ICs into a single programmable device in industrial controllers. With 256 macro cells it can replace 15-20 standard SSI/MSI packages, reducing PCB area and improving reliability. The 5-V tolerant MultiVolt I/O simplifies integration with legacy industrial sensors and actuators, while EEPROM-based configuration ensures instant-on behavior with no boot delay - essential for safety-critical industrial systems.
Recommended
State-Machine-Based Motor Control
For stepper and DC motor control in industrial and 3D-printer applications, the EPM3256AFC256-7 implements precise multi-axis state machines with quadrature decoding and PWM generation. Its 227.3 MHz counter frequency supports microstepping algorithms at 50 kHz step rates with 12-bit resolution. The 161 user I/Os accommodate multiple encoder inputs, limit-switch monitoring, and stepper-driver control signals in a single chip, reducing BOM count and improving timing determinism.
Recommended
Test & Measurement Equipment Front-End
The EPM3256AFC256-7 provides deterministic timing for digital-oscilloscope and logic-analyzer front-end logic, where signal routing, channel multiplexing, and trigger conditioning must occur within nanoseconds. Its 4.5 ns pin-to-pin delay enables real-time trigger-arm generation across 161 channels, while 5-V tolerance simplifies interfacing with legacy probe interfaces. The non-volatile EEPROM configuration provides instant power-on readiness required in production test environments.
Recommended
Automotive Dashboard Multiplexing
While the commercial-grade EPM3256AFC256-7 is used in non-critical automotive subsystems, its MultiVolt I/O and high I/O count make it suitable for dashboard multiplexing in aftermarket and prototype applications. Engineers use the 256 macro cells to drive multiple LED segment displays, key-scan matrices, and CAN-LIN gateway logic. For production automotive designs, the AEC-Q100-qualified MAX II or MAX V variants are recommended as modern drop-in successors.
Recommended
Recommended Products Summary
Engineering reference data for EPM3256AFC256-7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3256AFC256-10 | EPM3256AFC256-10N | EPM3128AFC256-7N | EPM3128AFI256-10N | EPM7256BFC256-5N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-256 | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Family | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 7000B |
| Macro Cells | 256 | 256 | 256 | 128 | 128 | 256 |
| User I/Os | 161 | 161 | 161 | 96 | 96 | 164 |
| Pin-to-Pin Delay (max) | 4.5 ns | 10 ns | 10 ns | 7.5 ns | 10 ns | 5 ns |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 5.0 V |
| I/O Compatibility | 5.0 / 3.3 / 2.5 V | 5.0 / 3.3 / 2.5 V | 5.0 / 3.3 / 2.5 V | 5.0 / 3.3 / 2.5 V | 5.0 / 3.3 / 2.5 V | 5.0 / 3.3 V |
| Operating Temperature | 0 C to 70 C | 0 C to 70 C | 0 C to 70 C | 0 C to 70 C | -40 C to 85 C (industrial) | 0 C to 70 C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest speed grade in MAX 3000A family (vs EPM3256AFC256-10)
- Greater logic density than EPM3128A variants (vs EPM3128AFC256-7N)
- 3.3 V core with 5 V MultiVolt I/O tolerance (vs EPM7256BFC256-5N)
Design Notes
The FBGA-256 FineLine BGA package requires a 4-layer PCB minimum with a continuous ground plane beneath the device for signal integrity and thermal dissipation. Escape routing on the top layer must use 0.20 mm (8 mil) trace-and-space with 0.40 mm (16 mil) via-pad diameter per JEDEC MS-034 recommendations. Place at least four 0.1 µF decoupling capacitors adjacent to the VCC pins, and add a 10 µF bulk capacitor near the supply entry to suppress switching transients during ISP programming.
When interfacing the 3.3 V core with 5 V peripherals using the MultiVolt I/O, ensure the VCCIO supply is properly selected - typically tied to 3.3 V for mixed-voltage operation. Place a 33 Ω series-termination resistor on high-speed outputs driving traces longer than 50 mm to control reflections. Avoid routing JTAG signals near clock edges; keep TCK, TMS, TDI, and TDO on a dedicated layer or guarded by ground traces to prevent ISP programming failures.
Estimated: at maximum toggling rate of 161 I/Os at 5 MHz with 5 pF load, the EPM3256AFC256-7 dissipates approximately 1.2 W. The FBGA-256 package has a typical θJA of 22 C/W, yielding a junction-temperature rise of 26 C above ambient. For enclosed industrial environments with 55 C ambient, ensure adequate airflow or thermal vias beneath the package to keep Tj below 125 C. The exposed pad (if present in the package variant) must be soldered to a thermal pad for optimal heat transfer.
Do not assume the EPM3256AFC256-7 can be replaced with the non-A EPM3256 - the original EPM3256 uses a 5 V core while the EPM3256A uses a 3.3 V core. Verify I/O voltage compatibility before swapping. Additionally, Quartus Prime versions 12.0 and later do NOT support MAX 3000A; designers must retain a legacy Quartus II 9.0 SP2 or earlier installation for ongoing development work on this part.
Compliance Information
The original MAX 3000A family was launched before RoHS compliance was widely mandated. RoHS status of EPM3256AFC256-7 is not explicitly stated in the Verified Web Data; the -7N suffix variants are typically lead-free but this specific -7 part requires verification with the manufacturer.
