EP20K400CF672C-7ES - 400K Gates APEX 20KC FPGA | Altera | 672-BGA
MPN: EP20K400CF672C-7ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 50 | $198 | $9,900.00 |
| 100 | $165 | $16,500.00 |
| 500 | $132 | $66,000.00 |
EP20K400CF672C-7ES Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic. Within the programmable-logic hierarchy, FPGAs sit above CPLDs and gate arrays in density and below ASICs in per-unit cost, while delivering reconfigurable logic, embedded memory blocks (here, embedded array blocks / EABs), and DSP-friendly carry chains. The APEX 20KC family introduced 2.5 V LVDS I/O support, embedded CAM blocks, and a MultiCore architecture combining logic elements (LEs) with embedded array blocks (EABs) for true dual-port RAM and product-term logic.
Key features include in-system programmability via Altera EPC16 / EPC8 / EPC4 / EPC2 / EPC1 configuration devices, four phase-locked loops for clock multiplication and skew management, 32 Kbytes of distributed RAM, and built-in boundary-scan (IEEE 1149.1 JTAG). The FineLine BGA package at 1.00 mm pitch supports high-density board layouts while enabling fine-pitch probing and rework. Industrial temperature variants and faster speed grades (up to -8) are also available within the same EP20K400 silicon family.
The APEX 20KC architecture combines a fine-grained logic-element fabric with coarse-grained embedded array blocks (each EAB providing up to 2 Kbits of RAM or 16 product-term logic blocks). This dual-grain architecture makes EP20K400 well suited to datapath-heavy designs where the EABs can be configured as FIFO, dual-port RAM, or ROM, while LEs handle the surrounding state machines and glue logic. PLLs allow designers to multiply, divide, and phase-shift incoming clocks; JTAG support simplifies board-level testing.
Typical applications include telecommunication line cards, ASIC prototyping, high-speed DSP datapath front ends, video and image processing pipelines, industrial control and factory automation, and pre-silicon validation of SoC designs. The 488 user I/Os are particularly useful where many buses, memory interfaces, or serializer / deserializer channels need to be brought off-chip simultaneously.
When designing with this part, place decoupling capacitors as close as possible to every VCCINT and VCCIO pin pair, and follow Altera's recommended 4-layer PCB stack-up to keep the 1.00 mm-pitch BGA routable. Use the Quartus II (or MAX+PLUS II) toolchain with an Altera programming cable or EPC configuration device to load the bitstream.
This page consolidates distributor pricing, same-family drop-in alternatives (speed-grade, package, and logic-density variants), and practical design notes that complement - rather than duplicate - the official Altera datasheet.
Drop-in alternatives for EP20K400CF672C-7ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400CF672C-7ES (same form factor and footprint) — differing in Process Technology, Operating Temperature, Family, Speed Grade, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400CF672C-7
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP20K400EFC672-1XN
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP20K400CF672C7ES
✅ Drop-In✓ In Stock
$152 / Unit
View Datasheet →EP20K400EFC672-2X
✅ Drop-In✓ In Stock
$118.9 / Unit
View Datasheet →EP20K400EFC672-1X
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K400CF672C-7ES Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Series | EP20K400 |
| System Gates | 400,000 |
| Logic Elements | 16,640 |
| Embedded Memory (bits) | 212,992 |
| Maximum User I/O | 488 |
| Number of PLLs | 4 |
| Process Technology | 0.15 um CMOS |
| Core Voltage | 1.8 V |
| Speed Grade | -7 |
| Maximum Internal Clock Frequency | 375.94 MHz |
| Propagation Delay (per Sierra IC) | 1.400 ns |
| Operating Temperature Range | 0 C to 85 C (commercial) |
| Package | 672-BGA (FineLine BGA, 1.00 mm pitch) |
| Mounting Type | Surface Mount |
| Configuration Support | EPC16, EPC8, EPC4, EPC2, EPC1 serial devices; JTAG |
EP20K400CF672C-7ES 672-bga (fineline bga, 1.00 mm pitch) Pin Configuration Guide
Pin configuration for EP20K400CF672C-7ES (672-bga (fineline bga, 1.00 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400CF672C-7ES.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400CF672C-7ES is suitable for 7 applications: ASIC Prototyping and Pre-Silicon Validation, Telecommunication Line-Card Interface, High-Speed DSP Datapath Front End, Video and Image Processing Pipeline, Industrial Control and Factory Automation, Legacy Hardware Maintenance and Field Replacement, Test and Measurement Instrumentation.
ASIC Prototyping and Pre-Silicon Validation
The EP20K400CF672C-7ES is widely deployed as an ASIC prototyping vehicle because its 400K system gates, 16,640 logic elements, and 488 user I/Os provide enough density to absorb medium-complexity ASIC RTL for functional verification before tape-out. The four on-chip PLLs allow accurate modeling of complex clock trees typical of networking ASICs, while 212,992 bits of embedded array block memory emulate register files and FIFOs that would otherwise require off-chip SRAM. Designers fit large datapath blocks directly into the EABs and use the LE fabric for glue logic and control plane state machines, achieving multi-MHz system-clock operation in a real-hardware environment.
Recommended
Telecommunication Line-Card Interface
The combination of 488 user I/Os and LVDS support via APEX 20KC makes the EP20K400CF672C-7ES well suited for telecom line cards that aggregate multiple T1/E1, Ethernet, or SONET/SDH channels. The device's four PLLs derive the precise multiple clocks needed for serializer/deserializer (SERDES) companion chips, while the EAB-based dual-port RAM buffers packet data at line rate. With 1.8 V core operation and 0 to 85 C commercial temperature, the part drops into central-office-grade designs when paired with appropriate thermal management. JTAG support simplifies board bring-up and field diagnostics on populated cards.
Recommended
High-Speed DSP Datapath Front End
Designers building high-speed DSP pipelines use the EP20K400CF672C-7ES to perform FIR filtering, FFT pre-processing, or channelization before handing data off to a dedicated DSP ASIC or processor. The 212,992 embedded RAM bits allow large coefficient tables to be stored in EABs and accessed in a single clock, while the LE fabric implements arithmetic datapath logic with predictable timing up to 375 MHz. The 488 I/Os let the FPGA stream parallel data from multiple ADC/DAC channels simultaneously without external bus multiplexing, simplifying PCB routing and reducing system BOM cost.
Recommended
Video and Image Processing Pipeline
In video broadcast and machine-vision equipment, the EP20K400CF672C-7ES implements color-space conversion, scaling, and frame-buffer arbitration in real time. The EABs serve as line buffers or small frame stores, while the LE fabric runs pixel-pipelined processing at video rates. With 488 I/Os the FPGA can simultaneously drive digital video interfaces (BT.656, BT.1120), DDR memory controllers, and host processor buses. Operating up to 375 MHz internal, the part comfortably handles 1080p60 processing with margin for additional overlay or alpha-blend logic.
Recommended
Industrial Control and Factory Automation
The EP20K400CF672C-7ES serves as a flexible control and glue-logic platform in factory-automation equipment, where its 488 I/Os interface to many sensors, encoders, and actuators without external bus expanders. The four PLLs derive motor-control clocks and quadrature-encoder sampling rates from a single reference oscillator, while the EABs implement deterministic FIFO buffering between field-bus cycles and host processor read-backs. Industrial users benefit from the device's ability to absorb late-stage protocol changes (field-bus variants, custom I/O maps) without board rework.
Recommended
Legacy Hardware Maintenance and Field Replacement
Because the APEX 20KC family has been obsolete since the late 2000s, the EP20K400CF672C-7ES is now primarily used to keep installed equipment (telecom line cards, test instruments, industrial controllers) operational. Distributor broker inventory remains the primary supply channel, and the 672-BGA FineLine footprint means no board rework is required when swapping a failed part on an existing PCB. Designers tasked with field replacement value the device's known bitstream compatibility and Altera's archived Quartus II toolchain support, which preserves the original design intent and verification IP.
Recommended
Test and Measurement Instrumentation
Engineers use the EP20K400CF672C-7ES to build custom protocol analyzers, logic-analyzer capture cards, and arbitrary waveform generators where the device's 488 user I/Os, high internal clock rate, and reconfigurable nature enable rapid prototype iteration. The four PLLs derive multiple synchronized sampling clocks for parallel-channel acquisition, while the EABs provide deterministic delay lines and pattern-matching storage. Once the design is validated, the bitstream can be cloned across multiple instruments without re-synthesis, which is valuable in low-volume T&M product lines.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400CF672C-7ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400CF672C-7 | EP20K400EFC672-1XN | EP20K400CF672C7ES | EP20K400EFC672-2X | EP20K400EFC672-1X |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 672-BGA (FineLine, 1.00 mm pitch) | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same |
| Family | APEX 20KC | APEX 20KC | APEX 20KE | APEX 20KC | APEX 20KE | APEX 20KE |
| System Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Maximum User I/O | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | -7 | -7 | -1X | -7 | -2X | -1X |
| Max Internal Clock | 375.94 MHz | 375.94 MHz | ~420 MHz | 375.94 MHz | ~280 MHz | ~260 MHz |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest pin-compatible density in the APEX 20KC family (vs EP20K300EFC672-1)
- Faster -7 speed grade than the EP20K400EFC672-1XN equivalent in some timing paths (vs EP20K400EFC672-2X)
- On-board configuration via EPC serial PROMs (vs Discrete SRAM-based FPGAs of the same era)
Design Notes
Estimated: at 1.8 V core with typical 20KC utilization, the EP20K400CF672C-7ES draws roughly 0.5-1.5 A from VCCINT depending on toggle rate and clock frequency; pair each VCCINT ball pair with a 0.1 uF X7R ceramic and a 10 uF bulk capacitor placed within 100 mil of the package. I/O banks (VCCIO) typically draw 10-50 mA per bank - budget decoupling per bank. Use a 4-layer PCB with a dedicated ground plane beneath the BGA to provide low-inductance returns for the high-speed I/O.
Estimated: with a 27 W maximum power dissipation budget (1.8 V * 15 A worst case) and a typical theta_JA around 12-15 C/W for the 672-BGA on a 4-layer JEDEC test board, junction temperature can rise 180 C above ambient under full load. Derate by clock activity: in typical designs (30-50% utilization at 100 MHz) the device dissipates 3-6 W, yielding a 36-90 C junction rise. Always provide 200 LFM of airflow or above for commercial-temperature operation; for sealed enclosures, attach a heatsink directly to the package lid with thermal interface material.
The 672-ball FineLine BGA uses a 1.00 mm pitch - this is beyond the practical limit of dog-bone fan-out on a 2-layer board. Use a 4-layer or 6-layer stack-up with 0.5 oz copper on outer layers and 1 oz on inner layers, and route signal escapes on the top layer with vias in-pad or near-pad. Matched-length traces (within 50 mil) are required for LVDS pairs; reference the Altera APEX 20KC handbook's 'PCB Layout Guidelines' for full routing rules. Leave at least 200 mil of unbroken ground plane beneath the BGA for thermal spreading.
Configuration pitfalls to avoid: (1) Do not leave MSEL pins floating - tie them to VCC or GND per the datasheet to select configuration mode. (2) The nCONFIG and nSTATUS lines must be pulled up to VCCIO with 10 kohm resistors; otherwise the device will not enter configuration. (3) Ensure the JTAG chain order (TCK/TMS/TDO/TDI) is correct when other JTAG devices share the bus. (4) Do not exceed 1.89 V on VCCINT during power-up - use a monotonic supply ramp of at least 1 ms to avoid latchup. (5) I/O pins are 5 V tolerant only when VCCIO is 3.3 V; at 2.5 V or 1.8 V VCCIO the inputs must not see signals above VCCIO + 0.3 V.
Place the EPC16 / EPC8 / EPC4 / EPC2 / EPC1 configuration PROM within 2 inches of the FPGA's DATA, DCLK, nCONFIG, and nSTATUS pins; keep the configuration traces short and free of stubs to avoid bitstream errors. JTAG daisy-chain signals (TCK, TMS, TDI, TDO) should be guarded by ground traces on both sides. The four PLLs each require their own filtered AVCC/AGND pair; isolate analog ground from digital ground with a single bridge near the PLL pins. Spread the global clock inputs (CLK[0..3]) across separate I/O banks to minimize skew.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status are not stated in the Verified Web Data for this obsolete part. As the APEX 20KC family predates widespread RoHS adoption, factory-new units were typically not RoHS compliant; however, broker inventory may include RoHS-reflowed units - confirm with distributor at RFQ.
