EP20K400CF672C-7 - 400K Gate APEX 20KC FPGA, 672-BGA | Altera
MPN: EP20K400CF672C-7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP20K400CF672C-7 Overview
An FPGA (Field Programmable Gate Array) is a reprogrammable digital logic device whose logic cells, routing, and I/O are configured by a configuration bitstream rather than hardwired. APEX 20KC belongs to the APEX 20K family (1999-2003 generation), which occupies the high-density end of the SRAM-based FPGA taxonomy: logic cell array -> PLD/FPGA -> programmable logic -> digital IC -> semiconductor. The 20KC variant added 2.5 V PCI compliance and a faster interconnect fabric versus 20K, while retaining the same Quartus-compatible design flow and Look-Up Table (LUT)-based Logic Element (LE) architecture.
Key specifications include 16,640 logic elements, 212,992 RAM bits, 488 maximum user I/O pins, 4 phase-locked loops, and 1.8 V core VCCINT with MultiVolt I/O supporting 1.8 V, 2.5 V, and 3.3 V interfaces. The 672-BGA package exposes 8 dedicated clock pins, 8 dedicated inputs, and a JTAG boundary-scan port. APEX 20KC devices are configured via passive serial (PS), passive parallel asynchronous (PPA), passive parallel synchronous (PPS), or JTAG modes using an EPC configuration device or a microprocessor. Hot-socketing and Power-On-Reset (POR) sequencing are supported.
Typical applications span telecommunication line cards, PCI 64-bit/66 MHz bridge designs, high-speed DSP co-processing, network packet classification using CAM, and legacy industrial control where MultiVolt I/O bridges 5 V system logic to 3.3 V or 2.5 V PHYs. The part is rated for commercial temperature (0 °C to +85 °C junction). Please refer to the manufacturer datasheet for full electrical characteristics and AC timing.
When designing with EP20K400CF672C-7, observe MultiVolt I/O bank power sequencing: VCCIO banks must ramp before or simultaneously with VCCINT to avoid latch-up; otherwise POR may be indeterminate. Reserve at least 4 user I/O for the JTAG chain if in-system programmability is required, and verify the 672-BGA escape allows adequate fan-out for the 488 signal pins.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes beyond the manufacturer datasheet, enabling faster design-in decisions for engineers working with this legacy Altera / Intel FPGA family.
Drop-in alternatives for EP20K400CF672C-7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400CF672C-7 (same form factor and footprint) — differing in Process Technology, Package, Operating Temperature, Speed Grade, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400CF672C-8
✅ Drop-In✓ In Stock
$95 / Unit
View Datasheet →EP20K400EFC672-1XN
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP20K400EFI672-2X
✅ Drop-In✓ In Stock
$168 / Unit
View Datasheet →EP20K300EFC672-2X
✅ Drop-In✓ In Stock
$99.5 / Unit
View Datasheet →EP20K300EFC672-1
✅ Drop-In✓ In Stock
$92.4 / Unit
View Datasheet →EP20K300EFC672-2N
✅ Drop-In✓ In Stock
$59.2 / Unit
View Datasheet →EP20K400CF672C-7 Maximum Ratings & Electrical Characteristics
| Family | APEX-20KC |
| Logic Elements (LE) | 16640 |
| Embedded Memory Bits | 212992 |
| Maximum User I/O | 488 |
| Number of PLLs | 4 |
| Number of Logic Array Blocks (LABs) | 1664 |
| Number of ESBs (Embedded System Blocks) | 212 |
| Number of CAM Blocks | 16 |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Process Technology | 0.15 µm CMOS, SRAM-based |
| Package | 672-pin FC-FBGA (FineLine BGA) |
| Speed Grade | -7 (commercial) |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Mounting Type | Surface Mount (SMD/SMT) |
| PCI Support | PCI 2.2 compliant, 64-bit / 66 MHz |
| Configuration Modes | PS, PPA, PPS, JTAG |
| External Memory Support | DDR SDRAM, ZBT SRAM |
EP20K400CF672C-7 672-pin fc-fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP20K400CF672C-7 (672-pin fc-fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400CF672C-7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400CF672C-7 is suitable for 6 applications: PCI 64-bit/66 MHz Bridge Design, Telecommunication Line Card Processing, High-Speed DSP Co-Processing, Network Packet Classification with CAM, Legacy Industrial Control Bridge, DDR SDRAM / ZBT SRAM Memory Controller.
PCI 64-bit/66 MHz Bridge Design
The EP20K400CF672C-7's PCI 2.2 compliance at 33/66 MHz with 32- or 64-bit bus width makes it ideal for legacy PCI bridge ASIC replacement. Its 16,640 logic elements can absorb bus state machines, scatter-gather DMA engines, and address translation logic without external glue. The 488 user I/Os in the 672-FBGA package expose enough lanes for full 64-bit PCI plus auxiliary interrupt and arbiter signals, while 4 PLLs generate the 66 MHz PCI clock and downstream local-bus clocks. Per the APEX 20KC datasheet, MultiVolt I/O at 3.3 V interfaces directly to PCI signaling levels.
Recommended
Telecommunication Line Card Processing
The 16,640 LEs and 212,992 bits of embedded memory in the EP20K400CF672C-7 enable packet-header classification, traffic shaping, and ATM/Ethernet segmentation-and-reassembly (SAR) blocks. With 16 CAM blocks on-chip, the device performs high-speed address lookup without external CAM memory, ideal for line cards forwarding Layer-3 packets. The 488 I/Os route LVDS links to framer MACs and SRAM/SSRAM payloads, while 4 PLLs synthesize multiple clock domains for SONET/SDH and Gigabit Ethernet rates. The 1.8 V core VCCINT keeps junction temperature manageable in tightly-packed line-card slots.
Recommended
High-Speed DSP Co-Processing
The EP20K400CF672C-7 functions as a glue-less DSP co-processor in radar, sonar, and baseband signal-processing arrays. Its 212 ESBs deliver 16-bit multiplication through dedicated arithmetic routing paths, and the 16,640 LEs implement FIR filters, FFT butterflies, and CORDIC engines alongside host-processor glue logic. The 488 user I/Os route 16-bit parallel datapaths to external SRAM or SDRAM, and MultiVolt I/O bridges 3.3 V DSP hosts to 1.8 V core voltage. Speed grade -7 supports up to ~375 MHz internal Fmax, enabling 100 MHz+ DSP data rates with deep combinational paths.
Recommended
Network Packet Classification with CAM
The 16 dedicated CAM (Content Addressable Memory) blocks in the EP20K400CF672C-7 accelerate L2/L3 lookup tables for ACLs, MAC/VLAN tables, and routing prefix matching. Each CAM block stores up to 32 entries of 32-bit words, enabling 512-entry lookup tables without external TCAM chips. The 16,640 logic elements build the surrounding forwarding pipeline, while 488 I/Os route packet buses to external network processors. Per the APEX 20KC datasheet, CAM lookups complete in a single clock cycle, ideal for line-rate classification at Gigabit Ethernet speeds.
Recommended
Legacy Industrial Control Bridge
The EP20K400CF672C-7 bridges legacy 5 V-tolerant industrial buses (VME, ISA, parallel I/O) to modern 3.3 V microcontrollers without external level shifters. MultiVolt I/O supports 1.8 V, 2.5 V, and 3.3 V bank voltages, while 488 user I/Os expose enough channels for parallel ADC/DAC buses, encoder counters, and PWM outputs. The 16,640 LEs absorb PLC-style ladder-logic replacement and PID-loop calculations in deterministic fabric. Speed grade -7 and 4 PLLs synchronize motor-control loops at microsecond resolution, making this device well-suited to legacy factory-automation retrofit projects.
Recommended
DDR SDRAM / ZBT SRAM Memory Controller
The EP20K400CF672C-7 integrates external memory controllers for DDR SDRAM and ZBT (Zero Bus Turnaround) SRAM through dedicated I/O and clocking resources. Its 4 PLLs provide the 90° phase-shifted clocks required for DDR center-aligned data capture, while MultiVolt I/O at 2.5 V matches SSTL-2 DDR signaling directly. The 212,992 bits of internal ESB memory act as FIFO write/read buffers between the memory controller and host datapath, and 488 user I/Os expose up to 72-bit DDR data buses plus address/command. This makes the part suitable for high-throughput frame buffers and network-processor glue.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400CF672C-7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400CF672C-8 | EP20K400EFC672-1XN | EP20K400EFI672-2X | EP20K300EFC672-2X | EP20K300EFC672-1 |
|---|---|---|---|---|---|---|
| Package | 672-pin FC-FBGA | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) |
| Brand | Altera (now Intel FPGA) | Altera (same brand) | Altera (same brand) | Altera (same brand) | Altera (same brand) | Altera (same brand) |
| Family | APEX 20KC | APEX 20KC | APEX 20K | APEX 20K | APEX 20K | APEX 20K |
| Logic Elements (LE) | 16640 | 16640 | 16640 | 16640 | 12000 (approx.) | 12000 (approx.) |
| Embedded Memory Bits | 212992 | 212992 | 212992 | 212992 | 150000 (approx.) | 150000 (approx.) |
| Maximum User I/O | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | -7 (commercial) | -8 (faster) | -1 (slower) | -2 (slower) | -2 (slower) | -1 (slower) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
Key Differentiators
- APEX 20KC family with 2.5 V PCI compliance (vs EP20K400CF672C-8)
- Industrial-temperature drop-in option exists in same package (vs EP20K400EFC672-1XN)
- 16 dedicated CAM blocks for high-speed lookup (vs EP20K300EFC672-2X)
- Higher density than APEX 20K base family (vs EP20K400EFC672-1XN)
Design Notes
The EP20K400CF672C-7 requires separate VCCINT (1.8 V core) and VCCIO (1.8 V / 2.5 V / 3.3 V) rails with MultiVolt bank partitioning. Per Altera application notes, VCCIO banks must power up before or simultaneously with VCCINT; otherwise Power-On-Reset (POR) may latch indeterminate configuration state, requiring a manual re-configuration cycle. Decouple each VCCIO bank with 0.1 µF and 10 µF ceramic capacitors placed within 5 mm of the BGA balls.
Estimated: at full utilization (16640 LEs switching at 100 MHz) and 1.8 V VCCINT, the EP20K400CF672C-7 dissipates roughly 3-5 W. The 672-FBGA package thermal resistance (theta_JA) is approximately 12-15 C/W on a 4-layer PCB with thermal vias, giving a 50-70 C junction temperature rise over ambient. Provide a continuous ground plane directly beneath the BGA and an array of thermal vias (0.3 mm pitch) under the die to keep Tj below 125 C.
The 672-FBGA package has 1.0 mm ball pitch and requires 4-layer or 6-layer PCB with microvia-in-pad for inner-row escape. Per APEX 20KC layout guidelines, place decoupling capacitors on the opposite PCB side directly under BGA balls, with via-in-pad to minimize loop inductance. Maintain a continuous reference plane beneath the BGA to control characteristic impedance for LVDS and DDR signals; break the reference plane only for the boundary-scan JTAG chain to avoid return-path discontinuities.
Do not assume any 672-FBGA APEX 20K device is bitstream-compatible across the 20K vs 20KC families: APEX 20KC adds 2.5 V PCI support and minor architectural enhancements, so designs targeting 20KC features may not load on plain 20K silicon. Also note that the 'C' suffix in EP20K400CF672C-7 denotes commercial temperature, while 'I' (industrial) parts share the same pinout but use a different die bin. Always confirm speed grade timing margins before substituting.
Differential pairs (LVDS) routed from the EP20K400CF672C-7 must be length-matched within 150 mils and have 100 Ω differential impedance, with the pair traces symmetrically routed over a continuous ground plane. Place series-termination resistors within 5 mm of the driver BGA ball. For DDR SDRAM, route address/command traces on a dedicated layer and use the 4 PLLs to generate 90°-shifted clocks for center-aligned data capture per the Altera external memory interface guidelines.
Compliance Information
Lifecycle status obsolete. RoHS / lead-free / halogen-free status not explicitly stated in the verified web data; consult Altera / Intel FPGA product page for definitive compliance documentation. AEC-Q100 not applicable (this is an FPGA, not an automotive-grade part).
