EP20K400FI672-2VN 2.5V APEX-20K FPGA | Intel
MPN: EP20K400FI672-2VN ✗ End of Life| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP20K400FI672-2VN Overview
An FPGA, or field-programmable gate array, is a semiconductor containing configurable logic blocks, programmable routing, and input/output resources that can be configured after manufacturing. It belongs to the hierarchy programmable logic device, PLD, FPGA, and integrated circuit. Unlike a fixed-function ASIC, an FPGA can be reprogrammed during development and, in many applications, in-system. APEX-20K devices extend the FPGA concept by combining LUT-based and product-term-based resources with enhanced embedded memory for system-on-a-programmable-chip integration.
The principal verified resources are 16,640 logic cells, 1,664 logic array blocks, 212,992 RAM bits, and 502 programmable I/O lines. Its 2.5 V supply supports the legacy CMOS implementation, while the large I/O count makes the device useful for bus-intensive and interface-rich systems. A 200 MHz capability is reported by one distributor, and operating temperature is specified as 0 °C to 85 °C. These values support substantial digital processing, but they should not substitute for the complete manufacturer timing, power, and configuration specifications.
Architecturally, APEX-20K MultiCore technology combines LUT-based logic, product-term logic, and memory structures on one programmable platform. This heterogeneous resource mix can implement combinational logic, state machines, control functions, and moderate data-storage functions without immediately requiring a separate configuration memory or support device. The available source data does not provide configuration interface details, supported I/O standards, transceiver count, process geometry, or exact RAM organization; those parameters must be obtained from the manufacturer datasheet and selected-device documentation.
Typical applications include high-speed industrial control, communications-interface aggregation, test equipment, image or data preprocessing, and legacy digital systems that benefit from 502 user I/O pins. It is also suitable for prototyping configurable interfaces and logic consolidation. Because the part is from the mature APEX-20K family, lifecycle and tooling support should be confirmed before new production commitments.
PCB design must start with the official ball-map and package drawing because verified search results disagree between 652 and 672 physical ball descriptions. Preserve programmable-I/O placement constraints, provide complete power distribution for the 2.5 V rail, and follow the configuration-interface guidance in the manufacturer documentation. Validate signal integrity, simultaneous-switching output limits, thermal behavior, and I/O bank restrictions after the exact package is resolved.
This product record combines exact verified resources, package discrepancies, commercial data availability, and engineering cautions. It distinguishes confirmed values from unresolved package and timing details so procurement, PCB layout, and obsolescence-mitigation decisions can proceed without treating distributor snippets as a substitute for the complete manufacturer data sheet.
Drop-in alternatives for EP20K400FI672-2VN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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| Product Type | Field Programmable Gate Array (FPGA) |
| Series | APEX-20K |
| Architecture | MultiCore architecture |
| Logic Family | CMOS |
| Logic Elements | 16,640 |
| Logic Array Blocks | 1,664 |
| Total RAM | 212,992 bits |
| User I/O Pins | 502 |
| Supply Voltage | 2.5 V |
| Reported Maximum Frequency | 200 MHz |
| Operating Temperature | 0 °C to 85 °C |
| Terminal Count | 672 |
| Package | 672-BBGA |
| Alternative Package Description | S-PBGA-B672 with 1.000 mm terminal pitch |
| Moisture Sensitivity Level | MSL 3 |
| Technology Node | 0.22 µm |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
| REACH Status | unknown |
EP20K400FI672-2VN s-pbga-b672 with 1.000 mm terminal pitch Pin Configuration Guide
Pin configuration for EP20K400FI672-2VN (s-pbga-b672 with 1.000 mm terminal pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400FI672-2VN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400FI672-2VN is suitable for 6 applications: Industrial Control Platform, Communications Interface Aggregation, Test and Measurement Equipment, Image and Data Preprocessing, Legacy Interface Bridge, Configurable Datapath Accelerator.
Industrial Control Platform
EP20K400FI672-2VN fits industrial control platforms that require substantial programmable logic and broad parallel connectivity. Its verified 16,640 logic elements, 1,664 logic array blocks, and 212,992 RAM bits can support state machines, sequencing logic, protocol handling, and local data buffering. The 502 user I/O count is valuable for actuator interfaces, sensor buses, and legacy control signals. Integration as a central configurable logic device may reduce multiple smaller CPLDs, but engineers must use a verified ball map because sources conflict between 652 and 672 physical balls. The confirmed 2.5 V supply and 0 °C to 85 °C range also require careful power and environmental qualification. For long-life production, legacy tool compatibility and obsolete-component supply should be treated as primary architecture constraints.
Recommended
Communications Interface Aggregation
EP20K400FI672-2VN can aggregate multiple communications interfaces where firmware flexibility and parallel datapaths are required. The device offers 16,640 logic elements for framing, encoding, buffering control, and protocol adaptation, while 212,992 RAM bits can hold packet descriptors, lookup data, or temporary data structures. Its 502 user I/O pins provide capacity for several narrow interfaces without extensive external multiplexing. The 200 MHz figure reported by one distributor suggests meaningful legacy processing headroom, but it is not a substitute for route-specific timing analysis. I/O voltage standards, bank composition, and allowable toggling rates are not present in the verified data. Board development therefore requires the official configuration, pin, and I/O-bank guidance, particularly because the package-ball count is inconsistently reported across sources.
Recommended
Test and Measurement Equipment
EP20K400FI672-2VN is suitable for configurable test equipment that needs parallel capture, deterministic sequencing, and adaptable signal processing. The verified 16,640 logic elements can implement timing generators, trigger logic, counters, encoders, and instrument control, while 212,992 RAM bits can support captured samples or calibration tables. A 502-I/O interface can connect numerous measurement channels, auxiliary controls, and data-converter interfaces. Unlike a fixed controller, the FPGA can be reconfigured for different test sequences or protocol variants. However, the 2.5 V supply must be integrated with the complete supported power architecture, and the 0 °C to 85 °C operating range may be insufficient for uncontrolled industrial environments. Exact propagation-delay data is also inconsistent, so timing closure must use the manufacturer speed-grade and configuration-specific tables.
Recommended
Image and Data Preprocessing
EP20K400FI672-2VN can perform front-end image or data preprocessing before information is transferred to a processor or storage subsystem. Its 16,640 logic elements are useful for pipeline control, filtering, formatting, error detection, and reduction logic, while 212,992 RAM bits can store line buffers, descriptors, or small lookup tables. The 502 user I/O resources help connect parallel image sensors, memories, and control buses. The MultiCore combination of LUT-based and product-term-based resources is particularly useful when a design mixes regular datapaths with control-intensive decode and interface logic. The 200 MHz capability reported by one source is promising, but actual throughput depends on routing, memory access patterns, I/O standards, and timing constraints. No verified embedded multiplier or DSP block is listed, so arithmetic-heavy designs require careful resource planning.
Recommended
Legacy Interface Bridge
EP20K400FI672-2VN is a strong architectural candidate for bridging legacy buses and interfaces to newer controllers. Its 502 user I/O pins can manage address, data, handshake, interrupt, and timing signals, while 16,640 logic elements provide protocol translation, latching, arbitration, and sequencing. The 212,992 RAM bits can support FIFOs, descriptor storage, or temporary conversion buffers. This resource combination can replace several fixed-interface devices with one programmable platform and permit late-stage bus adaptation. The main implementation risk is not logic capacity but physical and electrical verification: the verified sources disagree on 652 versus 672 balls, and detailed I/O-standard and bank information is absent. Engineers should treat any variant other than the exact ordering code as a redesign-level comparison, not a guaranteed drop-in replacement.
Recommended
Configurable Datapath Accelerator
EP20K400FI672-2VN can accelerate deterministic datapaths, control pipelines, and format-conversion functions in a configurable system. The verified architecture combines LUT-based and product-term-based programmable logic, allowing regular arithmetic and routing functions to coexist with dense decode, state-machine, and control logic. Sixteen thousand six hundred forty logic elements and 212,992 RAM bits support moderate buffering and state storage, while 502 user I/O pins provide wide system integration. A reported 200 MHz capability indicates substantial clock-rate potential, although it must be validated with the selected configuration, speed grade, place-and-route result, and I/O assignments. The device does not expose a verified DSP-block count, and its 2.5 V legacy CMOS supply is not directly comparable with modern low-voltage FPGA platforms. New designs should evaluate migration risk, tooling longevity, and availability before selecting it.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400FI672-2VN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Brand | Intel |
| Package | 672-BBGA; exact ball count is inconsistent across verified sources |
| Logic Elements | 16,640 |
| RAM | 212,992 bits |
| Logic Array Blocks | 1,664 |
| User I/O | 502 pins |
| Supply Voltage | 2.5 V |
| Reported Maximum Frequency | 200 MHz |
| Operating Temperature | 0 °C to 85 °C |
| Lifecycle | Obsolete |
Key Differentiators
- High verified logic capacity for a mature APEX-20K platform (vs EP20K400FI672-2V)
- Large programmable I/O resource set (vs EP20K200FI484-2V)
- MultiCore programmable architecture (vs EP20K400FC672-2)
Design Notes
Do not use a 652-ball or 672-ball PCB footprint without resolving the discrepancy in the verified package data. One result identifies BGA-652 with 652 pins, while others identify 672-BBGA, 672 terminals, or S-PBGA-B672. Obtain the official package code, ball map, mechanical drawing, and ordering-code table, then generate the symbol, footprint, and pin constraints from the same verified source. An incorrect BGA land pattern can create escaped, shorted, or unconnected balls and may require a complete board respin.
The verified supply voltage is 2.5 V, but a complete legacy FPGA power design still requires the manufacturer power-up sequence, ramp limits, tolerance information, auxiliary rails, and decoupling network. The supplied data does not include current consumption, power sequencing, or transient limits. Before schematic release, confirm the required supply rails, regulator accuracy, bulk capacitance, local ceramic decoupling, and discharge behavior. Do not infer that a generic 2.5 V regulator implementation satisfies the device requirements.
Treat 502 user I/O pins as an upper resource figure rather than proof that all pins can operate simultaneously at the reported 200 MHz. The verified material does not identify supported I/O standards, bank voltages, direction rules, or simultaneous-switching limits. Assign bank-compatible pins, control edge rates, provide a continuous reference-return path, and estimate worst-case current through the power distribution network. Perform route-specific timing analysis with the selected speed grade and design software rather than relying on distributor propagation-delay snippets.
Plan escape routing, via-in-pad or dog-bone fanout, ground-reference continuity, and complete BGA return paths before final placement. The sources describe a 1.000 mm terminal pitch for one package representation, but the conflicting ball count makes every dimensional assumption provisional. Cross-check the package drawing for ball diameter, land diameter, courtyard, substrate keepout, and layer stackup. Keep high-current converter loops away from sensitive clock and configuration inputs, and use distributed decoupling at the BGA perimeter and inner areas where manufacturing access permits.
The 0 °C to 85 °C operating range is the only verified temperature limit, and no thermal resistance or power-consumption data is supplied. Do not assume that a large BGA package is automatically adequate for the selected logic utilization, clock rate, or I/O toggle load. Extract toggle and utilization data from a fitted design, estimate internal power using the supported design software, model the actual PCB copper and airflow, and verify that junction temperature remains within the manufacturer limit. Recalculate for the highest supported ambient and worst tolerated supply condition.
Compliance Information
The verified data does not establish RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. The operating temperature range is 0 °C to 85 °C; no automotive qualification is identified.
