EP20K400GC655-2V - 400K Gate APEX-20KC FPGA 655-CPGA | Altera
MPN: EP20K400GC655-2V ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $127.51 | $127.51 |
| 10 | $118.2 | $1,182.00 |
| 100 | $108.4 | $10,840.00 |
| 250 | $99.5 | $24,875.00 |
| 500 | $92.75 | $46,375.00 |
EP20K400GC655-2V Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, and programmable I/O, all interconnected by a programmable routing fabric. FPGAs occupy the broader category of programmable logic devices (PLDs), which sit hierarchically between fixed-function ASICs and software-driven microcontrollers. The APEX-20KC family belongs to the system-on-a-programmable-chip (SOPC) generation of Altera PLDs, designed for high-performance data-path and bus-interface applications.
Key features of the EP20K400GC655-2V include 212,992 total RAM bits, 16,640 logic elements (LEs), embedded array blocks (EABs) for memory implementation, support for LVDS I/O, and a maximum toggle frequency aligned with the -2 speed grade. The MultiCore architecture allows designers to allocate silicon resources dynamically between register-intensive LUT logic and product-term logic, optimizing the device for DSP, datapath, and control-plane tasks. The 655-CPGA package is a ceramic pin grid array measuring 62.48 x 62.48 mm, intended for through-hole industrial and military-grade installations.
Typical applications for the EP20K400GC655-2V span communications infrastructure (SONET/SDH framer, ATM switch fabric), industrial control and test equipment, military/aerospace embedded systems, and high-speed datapath glue logic. The combination of high logic density and embedded RAM makes it well suited to parallel processing, bus bridging, and custom protocol acceleration. The ceramic CPGA package and -2 speed grade also suit thermally demanding environments.
When designing with this device, plan power sequencing carefully: the 2.5 V core must be stable before the I/O supplies ramp. Because the APEX-20KC uses legacy 0.18-micron CMOS with a 2.5 V core, signal integrity and decoupling on the high-pin-count CPGA are critical; follow the manufacturer's reference design for via placement and bulk/ceramic capacitor distribution around the array.
This page synthesizes distributor pricing, drop-in APEX-20KC pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP20K400GC655-2V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400GC655-2V (same form factor and footprint) — differing in Mounting Type, Family, Package, Process Technology, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400GC655-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$80 / Unit
View Datasheet →EP20K400GC655-2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$127.5 / Unit
View Datasheet →EP20K400GC655-1V
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$555 / Unit
View Datasheet →EP20K400GC655-1X
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$193.04 / Unit
View Datasheet →EP20K400GC655-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$135 / Unit
View Datasheet →EP20K400CB652C8AA
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP20K400GC655-2V Maximum Ratings & Electrical Characteristics
| Series | APEX-20KC |
| Family | APEX 20KC (1.8 V, LVDS) |
| Logic Elements | 16,640 |
| Total RAM Bits | 212,992 |
| System Gates | ~400,000 (typical marketing figure) |
| Core Voltage (VCCINT) | 2.375 V to 2.625 V (nominal 2.5 V) |
| Propagation Delay | 3.000 ns |
| Process Technology | CMOS, 0.18 um |
| LVDS Support | Yes |
| Package | 655-CPGA (62.48 x 62.48 mm) |
| Package Type | Ceramic Pin Grid Array, through-hole |
| Mounting Type | Through-hole (CPGA) |
| Speed Grade | -2 |
| RoHS Status | unknown |
| Lead-Free | unknown |
| Architecture | MultiCore (LUT + product-term + embedded memory) |
EP20K400GC655-2V ceramic pin grid array, through-hole Pin Configuration Guide
Pin configuration for EP20K400GC655-2V (ceramic pin grid array, through-hole package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400GC655-2V.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400GC655-2V is suitable for 6 applications: Telecom Datapath Bridging, Industrial Test and Measurement, Military and Aerospace Embedded Computing, Custom Protocol Acceleration, High-Speed Datapath Glue Logic, Legacy System Sustainment and Redesign.
Telecom Datapath Bridging
The EP20K400GC655-2V fits telecom datapath bridging because its 16,640 logic elements and 212,992 RAM bits deliver the parallel processing capacity needed to convert between SONET/SDH, ATM, and Ethernet frames in real time. Placed on the line-card between the framer ASIC and the network processor, the device uses its embedded array blocks configured as dual-port RAM to buffer cells while the MultiCore LUT logic performs header parsing. The 2.5 V core and LVDS-capable I/O simplify interfacing to high-speed serial backplanes common in legacy central-office equipment.
Recommended
Industrial Test and Measurement
For industrial test and measurement platforms, the EP20K400GC655-2V provides the logic density to implement custom stimulus generators, pattern comparators, and timing engines in a single device. Its 212,992 RAM bits allow deep capture buffers for protocol analyzers, while the 16,640 logic elements handle real-time state-machine sequencing. The ceramic 655-CPGA package delivers the thermal headroom required in fan-less test chassis, and the -2 speed grade supports deterministic timing for instrumentation-grade signal integrity at sample rates up to 200 MHz LVDS.
Recommended
Military and Aerospace Embedded Computing
The EP20K400GC655-2V is well suited to military and aerospace embedded computing because its ceramic CPGA-655 package offers hermeticity, mechanical robustness, and wide thermal tolerance for avionics, vetronics, and missile systems. The APEX-20KC family was widely designed into legacy defense platforms, and the device supports the long lifecycle and configuration-retention requirements typical of those programs. Designers can allocate logic elements to MIL-STD-1553 or ARINC-429 interface controllers while using embedded memory for redundant fault buffering.
Recommended
Custom Protocol Acceleration
For proprietary or legacy bus protocols, the EP20K400GC655-2V accelerates throughput by offloading CRC, scrambling, and packetization from a host CPU. The 16,640 logic elements can implement multi-channel protocol engines running concurrently, while the 212,992 RAM bits serve as descriptor rings and packet buffers. The MultiCore architecture lets designers choose between LUT for register-heavy state machines and product-term logic for decoder-heavy address logic, optimizing silicon usage per channel.
Recommended
High-Speed Datapath Glue Logic
When systems need wide bus multiplexing, bus-width conversion, or clock-domain crossing between high-performance ASICs, the EP20K400GC655-2V provides ample headroom with its 16,640 logic elements and 212,992 RAM bits. The LVDS I/O support simplifies connections to serializer/deserializer (SerDes) ASICs, while the embedded memory blocks act as elastic FIFOs across asynchronous clock domains. Designers commonly use the device as a bridge between legacy 32-bit processors and modern 64-bit SoCs.
Recommended
Legacy System Sustainment and Redesign
The EP20K400GC655-2V is most commonly specified today in legacy system sustainment programs where the original APEX-20KC design cannot be re-spinned due to qualification cost. By choosing the -2V speed grade and ceramic CPGA package, sustainment engineers obtain a form, fit, and function drop-in for boards that must continue manufacturing for another decade. The MultiCore architecture allows incremental logic updates using the existing Quartus design flow, extending program life without certification rework.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400GC655-2V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400GC655-2 | EP20K400GC655-2N | EP20K400GC655-1V | EP20K400GC655-1X | EP20K400GC655-1 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 655-CPGA (62.48 x 62.48 mm) | 655-CPGA - same | 655-CPGA - same | 655-CPGA - same | 655-CPGA - same | 655-CPGA - same |
| Series | APEX-20KC | APEX-20KC | APEX-20KC | APEX-20KC | APEX-20KC | APEX-20KC |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Total RAM Bits | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 |
| Speed Grade | -2 | -2 (same) | -2 (same) | -1 (slower) | -1 (slower) | -1 (slower) |
| Core Voltage | 2.375 V to 2.625 V (2.5 V nom) | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
| Propagation Delay | 3.000 ns | 3.000 ns | 3.000 ns | ~3.4 ns | ~3.4 ns | ~3.4 ns |
Key Differentiators
- High-density 400K APEX-20KC silicon in ceramic CPGA package (vs EP20K400BC652-3V)
- -2 speed grade versus slower -1 alternatives (vs EP20K400GC655-1V)
- LVDS I/O support integrated on silicon (vs EP20K200FC484-2)
Design Notes
The APEX-20KC core requires a 2.5 V supply within 2.375 V to 2.625 V; ramp VCCINT before VCCIO to avoid I/O latch-up. Use a dedicated LDO with at least 1 A capability for the 2.5 V rail, plus bulk decoupling of 100 uF tantalum and 0.1 uF ceramic per supply pin cluster. Estimated: with VCCINT at 2.5 V and ICC around 0.5 A under typical use, the regulator must dissipate roughly 0.25 W above its input voltage drop, so a small SOT-223 or DPAK LDO is adequate.
The 655-CPGA ceramic package provides excellent thermal conductivity, but its large 62.48 x 62.48 mm footprint still concentrates heat at the die. Ensure the PCB socket or solder column interface allows heat flow to an underlying copper plane or heat spreader. In fan-less enclosures, verify junction-to-ambient thermal resistance by attaching a thermocouple to the package lid during worst-case workload characterization.
For the 655-CPGA, use a PGA socket (e.g., 3M Textool or equivalent) for prototyping to allow device swap, or solder directly for production. Distribute at least eight 0.1 uF ceramic decoupling capacitors around the perimeter of the package plus one bulk 47 uF tantalum on each supply rail. Match the trace lengths from each clock input pin to within 50 mils to avoid skew on global clock networks.
Do not confuse the EP20K400 (APEX-20KC, 2.5 V core) with the EP20K400E (APEX-20KE, 1.8 V core) - they share a pinout family but require different supply voltages. Also avoid mixing the EP20K400GC (CPGA) and EP20K400BC (BGA) variants on the same board design; although the die is the same, the package footprints differ and the I/O assignments around the periphery may not match exactly.
Compliance Information
APEX-20KC family predates current RoHS compliance documentation in publicly available distributor listings. AEC-Q100 does not apply (FPGA, not automotive-grade IC). Verify compliance with the manufacturer for new designs.
