EP20K400GC655-2X - 400K Gates APEX 20K FPGA, 655-CPGA | Altera
MPN: EP20K400GC655-2X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $220 | $22,000.00 |
| 500 | $195 | $97,500.00 |
| 1,000 | $175 | $175,000.00 |
EP20K400GC655-2X Overview
A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that lets designers implement custom digital circuits through a combination of configurable logic blocks, routing fabric, I/O cells, and embedded memory. FPGAs sit at the top of the PLD hierarchy below application-specific integrated circuits (ASICs), offering ASIC-like density with the reprogrammability of a standard part - an FPGA is essentially a 'system on a programmable chip' (SOPC) platform. Within the broader semiconductor taxonomy, FPGAs belong to programmable logic > digital ICs > integrated circuits.
Key features include 200 MHz internal operation, JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface, MultiVolt I/O support for interfacing to 2.5 V, 3.3 V, and 5 V buses, and a peak reflow-compatible temperature rating of 220 °C. The ceramic CPGA package provides hermetic sealing for high-reliability environments.
The MultiCore architecture pairs 4-input LUTs for register-intensive datapaths with product-term logic for wide combinatorial decode, while dedicated embedded array blocks (EABs) provide true dual-port synchronous RAM up to 212,992 bits. This hybrid fabric enables efficient mapping of register-heavy state machines, DSP datapaths, and FIFOs without external memory.
Typical applications include telecom line-card glue logic, military/aerospace signal processing, industrial control and instrumentation, and ASIC prototyping where high gate count and hermetic packaging matter. The ceramic CPGA makes it well suited for environments requiring extended temperature and mechanical robustness.
When designing with this part, pay attention to the I/O bank voltage grouping and provide separate VCCIO rails for each bank. For new designs consider migrating to the APEX 20KE 1.8 V family or to the modern Cyclone series, as the APEX 20K is a multi-decade mature node.
This page synthesizes distributor pricing, same-package drop-in alternatives within the APEX 20K family, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP20K400GC655-2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400GC655-2X (same form factor and footprint) — differing in Process Technology, Mounting Type, Family, Speed Grade, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400GC655-2
✅ Drop-In✓ In Stock
$80 / Unit
View Datasheet →EP20K400GC655-2V
✅ Drop-In✓ In Stock
$92.75 / Unit
View Datasheet →EP20K400GC655-2N
✅ Drop-In✓ In Stock
$127.5 / Unit
View Datasheet →EP20K400GC655-1X
✅ Drop-In✓ In Stock
$193.04 / Unit
View Datasheet →EP20K400GC655-1V
✅ Drop-In✓ In Stock
$555 / Unit
View Datasheet →EP20K400GC655-1
✅ Drop-In✓ In Stock
$135 / Unit
View Datasheet →EP20K400GC655-2X Maximum Ratings & Electrical Characteristics
| Family | APEX 20K |
| Series | APEX-20KC® |
| Logic Elements / Cells | 16640 |
| System Gates | 400000 |
| Total RAM Bits | 212992 |
| Number of I/O | 496 |
| Number of Dedicated Inputs | 6 |
| Maximum Operating Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage (MultiVolt) | 2.5 V / 3.3 V / 5 V |
| Package Type | 655-BCPGA (SPGA655) |
| Package Body Material | CERAMIC, metal-sealed cofired grid array |
| Package Dimensions | 47 x 47 mm |
| Peak Reflow Temperature | 220 °C |
| Mounting Type | Through-hole (CPGA) |
| Programmability | In-system, JTAG (IEEE 1149.1) |
| RoHS Status | unknown |
EP20K400GC655-2X 47 x 47 mm Pin Configuration Guide
Pin configuration for EP20K400GC655-2X (47 x 47 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400GC655-2X.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400GC655-2X is suitable for 6 applications: Telecom Line-Card Glue Logic, ASIC Prototyping and Emulation, Military and Aerospace Avionics, Industrial Process Control and Instrumentation, High-Speed DSP Datapath Acceleration, Legacy Networking Backplane Bridging.
Telecom Line-Card Glue Logic
The EP20K400GC655-2X is well matched to telecom line-card glue logic where 400K system gates can absorb backplane bridging, TDM bus multiplexing, and protocol-conversion state machines. Its MultiCore LUT plus product-term fabric lets designers map wide decode and datapath registers on a single die without external CPLDs. The 496 user I/O plus MultiVolt banks (2.5/3.3/5 V) connect directly to legacy telecom buses while JTAG boundary scan enables in-system reconfiguration during board bring-up.
Recommended
ASIC Prototyping and Emulation
The 400K-gate capacity and 212,992 bits of embedded RAM make the EP20K400GC655-2X a strong ASIC prototyping vehicle for designs up to ~250K ASIC gates. Engineers can partition the silicon into LUT-heavy datapaths and EAB-based memory blocks, then iterate RTL without respinning masks. The ceramic CPGA and 0.22 µm process provide predictable timing closure at 200 MHz, while JTAG-based in-system programming lets prototype boards swap designs rapidly during bring-up.
Recommended
Military and Aerospace Avionics
The EP20K400GC655-2X ceramic, metal-sealed cofired 655-pin CPGA package is hermetically sealed, making it suitable for military and aerospace applications where plastic BGA outgassing is unacceptable. The 220 °C peak reflow rating supports high-temperature assembly processes required by MIL-STD-883 flows. The 16,640 logic cells deliver 400K system gates for MIL-1553B bridges, ARINC 429 channels, and radar signal preprocessing - all on a proven, long-lifecycle Altera silicon node.
Recommended
Industrial Process Control and Instrumentation
The EP20K400GC655-2X delivers 496 user I/O pins - more than enough to land multi-axis motion controllers, PLC scan engines, and high-channel-count data-acquisition front-ends on a single FPGA. Its embedded RAM blocks (EABs) provide deterministic dual-port buffering for ADC/DAC FIFOs, while LUT-based logic handles encoder decoding and PWM generation. The MultiVolt I/O banks talk directly to 5 V industrial sensors and 3.3 V ADC/DACs without level shifters.
Recommended
High-Speed DSP Datapath Acceleration
The MultiCore architecture of the EP20K400GC655-2X is a strong fit for DSP datapath offload, where the LUT fabric implements parallel multipliers and the embedded array blocks (EABs) hold coefficient tables or delay lines. At 200 MHz internal operation, designers can build multi-tap FIR filters, FFT butterflies, and Reed-Solomon codecs in dedicated silicon - far faster than a general-purpose DSP core. The 496 I/O pins support wide parallel data buses directly to external SRAM and DACs.
Recommended
Legacy Networking Backplane Bridging
The EP20K400GC655-2X was designed into late-1990s/early-2000s networking backplanes for protocol bridging across ATM, POS, Fast Ethernet, and proprietary SERDES fabrics. Its 496 user I/O pins accommodate wide data buses plus dedicated clock and high-speed transceiver pin groups, while MultiVolt banks simplify mixed-voltage interface. The 0.22 µm process and 200 MHz Fmax sustain legacy OC-3/OC-12 line rates without external bus switches.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400GC655-2X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400GC655-2 | EP20K400GC655-2V | EP20K400GC655-2N | EP20K400GC655-1X | EP20K400GC655-1V | EP20K400GC655-1 |
|---|---|---|---|---|---|---|---|
| Package | 655-BCPGA (SPGA655, 47x47 mm) | 655-BCPGA - same | 655-BCPGA - same | 655-BCPGA - same | 655-BCPGA - same | 655-BCPGA - same | 655-BCPGA - same |
| Brand | Altera (Intel FPGA) | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same |
| Speed Grade | -2X | -2 | -2V | -2N | -1X | -1V | -1 |
| System Gates | 400000 | 400000 | 400000 | 400000 | 400000 | 400000 | 400000 |
| Logic Cells | 16640 | 16640 | 16640 | 16640 | 16640 | 16640 | 16640 |
| Total RAM Bits | 212992 | 212992 | 212992 | 212992 | 212992 | 212992 | 212992 |
| User I/O Pins | 496 | 496 | 496 | 496 | 496 | 496 | 496 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Drop-in same-package alternatives throughout the APEX 20K -2 speed grade (vs EP20K400GC655-2V, EP20K400GC655-2N, EP20K400GC655-2)
- Down-grade migration path to -1 speed grade in same package (vs EP20K400GC655-1X, EP20K400GC655-1V, EP20K400GC655-1)
- Higher gate density than the APEX 20K -200 variant in same package (vs EP20K200RC240-1 (200K gate, 240-pin RQFP))
Design Notes
The EP20K400GC655-2X requires separate VCCINT (2.5 V core) and per-bank VCCIO rails (2.5 V / 3.3 V / 5 V). Decouple each rail with 0.1 µF ceramic capacitors placed within 5 mm of every package pin, plus a bulk 47-100 µF tantalum or polymer capacitor near the device. The 0.22 µm process core can draw significant dynamic current during JTAG configuration bursts - budget for at least 1 A peak on VCCINT.
Estimated: At 200 MHz, 100% toggle rate, 2.5 V VCCINT, the APEX 20K core typically dissipates 1.5-2.5 W; this rises with I/O switching on the 496 user pins. The ceramic 47x47 mm CPGA package has a low θJA (~15-20 °C/W on a standard test board with through-hole socket), but designers should still provide airflow or a heatsink in sealed enclosures. Junction temperature must remain below 125 °C commercial or 150 °C industrial grade.
Route differential clock pairs (CLK[3:0]) with 50 Ω controlled impedance and 100 Ω differential impedance. Place configuration memory (EPC2 or EPC4) within 25 mm of the DATA, DCLK, nCONFIG, nSTATUS, and CONF_DONE pins to minimise JTAG and passive serial configuration skew. The 47x47 mm ceramic CPGA is typically socketed (e.g., a PGA socket) - reserve PCB clearance for the socket well and a retention clip.
Do NOT confuse the APEX 20K (2.5 V core, 'GC' 655-pin CPGA) with the APEX 20KE (1.8 V core, 'E' prefix, 'BC'/'FI' BGA packages) - their I/O standards and JTAG BSDL files differ. Applying 2.5 V to a 1.8 V APEX 20KE core will permanently damage the die. Always verify the full MPN including the speed-grade and package suffix before board bring-up. Pin-compatibility across the family is restricted to same-package members only.
Compliance Information
Compliance status not stated in the verified web data. The CPGA package is hermetic, but specific RoHS/REACH conformity to the EU Directive 2011/65/EU is not documented in the retrieved sources. The 220 °C peak reflow rating suggests a high-temperature assembly tolerance, consistent with MIL-STD-883 flows.
