EP20K600EFC672-2X - APEX 20KE 600K Gates FPGA | Intel/Altera
MPN: EP20K600EFC672-2X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $145 | $14,500.00 |
| 500 | $128 | $64,000.00 |
| 1,000 | $115 | $115,000.00 |
EP20K600EFC672-2X Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnects, and dedicated memory blocks on a single silicon die. APEX 20KE sits in the mid-to-large-capacity tier of early-2000s programmable logic, providing MultiCore architecture that integrates look-up table logic with embedded memory. It is commonly used for high-density glue logic, custom datapath designs, and prototyping of ASIC-equivalent systems.
The device exposes 508 user I/O pins supporting a wide variety of I/O standards and includes 4 Phase-Locked Loops (PLLs) for clock synthesis and skew management. Embedded system blocks (ESBs) provide true dual-port RAM, FIFO, and content-addressable memory (CAM) functions. Hot-swap compatibility and I/O programmability allow direct interfacing with backplane buses and mixed-voltage systems without external glue.
Architecturally, APEX 20KE uses a four-level hierarchical interconnect network (MegaLAB, LAB, row, and column) and supports LVTTL, LVCMOS, SSTL, HSTL, GTL, and PECL I/O standards. The 1.48 ns propagation delay and 200 MHz internal performance place this part in the high-speed regime for its generation, suitable for telecom line cards, imaging pipelines, and industrial control logic.
Typical applications include telecommunications line-card interfaces, high-speed image and video processing, industrial automation controllers, ASIC prototyping platforms, and test-and-measurement instrumentation. The 672-pin FineLine BGA package provides high I/O density for backplane-driven designs. When integrating this part, allocate sufficient PCB area for the BGA fanout, follow the manufacturer's decoupling and power-plane recommendations, and use the Quartus design toolchain for configuration bitstream generation. This page synthesizes distributor availability, parametric drop-in alternatives, and design guidance not found on a single manufacturer page.
Drop-in alternatives for EP20K600EFC672-2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K600EFC672-2X (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Family, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K600EFC672-2N
✅ Drop-In✓ In Stock
$158 / Unit
View Datasheet →EP20K600EFC672-1XN
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →EP20K600EFC672-1X
✅ Drop-In✓ In Stock
$980 / Unit
View Datasheet →EP20K600EFC672-3N
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K600EBC652-2X
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$275 / Unit
View Datasheet →EP20K600EFC672-2X Maximum Ratings & Electrical Characteristics
| Family | APEX 20KE |
| Typical Gates | 600,000 |
| Logic Elements / Cells | 24,320 |
| Embedded Memory Bits | 311,296 |
| Maximum User I/O | 508 |
| Number of PLLs | 4 |
| Package Type | 672-pin FineLine BGA (FC-FBGA) |
| Package Size | 45 x 45 mm, 1.27 mm pitch |
| Core Voltage | 1.8 V |
| Process Technology | 0.15 µm all-layer copper CMOS |
| Propagation Delay (typical) | 1.48 ns |
| Maximum Internal Frequency | 200 MHz |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Lead-Free Variant | EP20K600EFC672-2N |
| RoHS Status | Not RoHS compliant (X suffix is SnPb); use -2N suffix for lead-free |
| Configuration Method | Serial / Parallel (Quartus-supported) |
EP20K600EFC672-2X 45 x 45 mm, 1.27 mm pitch Pin Configuration Guide
Pin configuration for EP20K600EFC672-2X (45 x 45 mm, 1.27 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K600EFC672-2X.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K600EFC672-2X is suitable for 6 applications: Telecommunications Line-Card Interfaces, High-Speed Image and Video Processing Pipelines, ASIC Prototyping Platform, Industrial Automation Controllers, Test and Measurement Instrumentation, Military and Aerospace Avionics Datapaths.
Telecommunications Line-Card Interfaces
The EP20K600EFC672-2X delivers 600K gates and 508 user I/Os in a 672-FBGA package, making it a fit for telecom line cards that aggregate multiple framers, mappers, and MAC-layer functions. Its 4 on-chip PLLs synthesize the multiple reference clocks required for T1/E1, SONET, and Ethernet PHY interfaces. According to the APEX 20KE datasheet, the I/O banks support LVTTL, LVCMOS, SSTL, and HSTL standards, allowing direct interface to bus transceivers without external glue logic. The 311,296-bit embedded memory buffer small FIFO queues between PHY and MAC layers, eliminating external SRAM.
Recommended
High-Speed Image and Video Processing Pipelines
The 24,320 logic elements and 311 Kbit embedded memory of the EP20K600EFC672-2X support real-time pixel pipelines for image preprocessing, color-space conversion, and edge detection. The 1.48 ns propagation delay and 200 MHz internal frequency allow line-rate processing at 720p/60 over wide parallel video buses. According to the APEX 20KE datasheet, the ESBs can be configured as dual-port RAM, enabling frame-buffer line storage without external memory. The 508 I/Os route wide data buses and sync signals across the device.
Recommended
ASIC Prototyping Platform
Engineers commonly use the EP20K600EFC672-2X as an ASIC prototyping vehicle for designs targeting 0.5M-0.7M ASIC gates. The MultiCore architecture with embedded ESBs preserves the memory hierarchy of the target ASIC, simplifying RTL-to-FPGA mapping. According to the APEX 20KE datasheet, Quartus synthesis maps Altera IP and standard RTL to the device with timing-driven place-and-route. The 672-FBGA provides the I/O density needed to replicate complex ASIC pin-out for bring-up.
Recommended
Industrial Automation Controllers
The EP20K600EFC672-2X serves as a state-machine and protocol-conversion engine in industrial PLCs, motor drives, and SCADA front-ends. The 4 PLLs derive multiple servo-loop sampling rates from a single reference clock, and the 508 I/Os interface to encoder counters, PWM generators, and isolated digital I/O. According to the APEX 20KE datasheet, the commercial temperature range of 0 °C to +85 °C covers most factory-floor environments. The embedded ESBs implement deterministic FIFO buffering between the field-bus and the control CPU.
Recommended
Test and Measurement Instrumentation
Test-equipment designers leverage the EP20K600EFC672-2X for pattern generation, protocol-analyzer state machines, and high-speed data acquisition pre-processing. The 200 MHz internal performance drives real-time trigger logic, and the 508 I/Os sample wide parallel buses at full rate. According to the APEX 20KE datasheet, the ESBs in CAM mode enable hardware content-addressable search for protocol-analyzer pattern matching. The 1.8 V core plus 3.3 V tolerant I/O simplifies integration with mixed-voltage acquisition front-ends.
Recommended
Military and Aerospace Avionics Datapaths
Although Intel marks the EP20K600EFC672-2X as commercial temperature, it remains a maintenance part for deployed military and aerospace systems where the original APEX 20KE was qualified to MIL-STD or DO-254 standards. The high logic density, deterministic PLLs, and 508 I/Os fit avionics bus interfaces (MIL-STD-1553, ARINC 429) and radar preprocessing. According to the APEX 20KE datasheet, the device is built on a 0.15 µm copper CMOS process with proven reliability in long-life programs. Maintenance-of-supply contracts typically guarantee continued availability of -2X variants for legacy avionics LRUs.
Recommended
Recommended Products Summary
Engineering reference data for EP20K600EFC672-2X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K600EFC672-2N | EP20K600EFC672-1XN | EP20K600EFC672-1X | EP20K600EFC672-3N | EP20K600EBC652-2X |
|---|---|---|---|---|---|---|
| Package | 672-pin FineLine BGA (FC-FBGA) | 672-pin FineLine BGA - same | 672-pin FineLine BGA - same | 672-pin FineLine BGA - same | 672-pin FineLine BGA - same | 652-pin BGA (different) |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -2 (200 MHz internal) | -2 (200 MHz internal) | -1 (slower, ~150 MHz) | -1 (slower, ~150 MHz) | -3 (faster than -2) | -2 (200 MHz internal) |
| Lead-Free / RoHS | No (SnPb -2X suffix) | Yes (lead-free) | Yes (lead-free) | No (SnPb) | Yes (lead-free) | No (SnPb) |
| Logic Elements / Cells | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Embedded Memory (bits) | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 |
| Maximum User I/O | 508 | 508 | 508 | 508 | 508 | 488 (652-BGA package) |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
Key Differentiators
- Drop-in lead-free alternative on same 672-FBGA footprint (vs EP20K600EFC672-2N)
- Higher speed grade option on same footprint (vs EP20K600EFC672-3N)
- Lower-cost speed-grade variant for cost-sensitive designs (vs EP20K600EFC672-1X)
Design Notes
The EP20K600EFC672-2X is a 672-ball FC-FBGA on 1.27 mm pitch, requiring a 4-6 layer PCB with microvia (or via-in-pad) fanout. Follow the Altera/Intel BGA PCB layout guidelines: use a continuous ground plane on layer 2, dedicated 1.8 V and 3.3 V power planes on layers 3-4, and matched-length differential pairs for high-speed I/O. Decouple every VCCINT pin with a 0.1 µF X7R ceramic plus a 10 µF tantalum bulk cap within 5 mm of the BGA. Without microvia technology, signal escape routing is impossible for this pin density.
The EP20K600EFC672-2X requires a 1.8 V core supply (VCCINT) plus one or more I/O bank voltages (VCCIO) configurable to 1.5 V, 1.8 V, 2.5 V, 3.3 V. Sequence the supplies per the APEX 20KE datasheet: VCCINT must rise first or simultaneously with VCCIO; failure to sequence may damage the device. Estimated: at 200 MHz toggle rate with 30% utilization the device draws ~1.0-1.4 A from VCCINT - design the regulator for 1.6 A minimum and use a 4-layer copper pour to spread heat. Add a soft-start ramp of at least 1 ms to limit inrush current.
Estimated: at ambient 70 °C, 200 MHz toggle rate, 30% utilization, VCCINT 1.8 V at ~1.4 A, the EP20K600EFC672-2X dissipates ~2.5 W. With FC-FBGA thermal resistance θJA around 15 °C/W on a JEDEC 4-layer test board, junction rises by ~38 °C, yielding Tj ~108 °C - well within the commercial 0-85 °C ambient spec but no margin. For forced-air cooling or extended temperature operation, derate utilization to 20% or upgrade to industrial-grade -2X parts. The 672-FBGA provides bottom-side thermal contact suitable for an exposed-pad thermal interface.
Common pitfalls when designing with the EP20K600EFC672-2X include (1) confusing the -2X speed grade with the -2N lead-free grade - they share speed but differ in finish; (2) routing 3.3 V signals into a 1.8 V VCCIO bank, damaging the I/O; (3) using a non-Quartus-supported configuration mode without verifying the datasheet; (4) assuming the APEX 20KE ESBs can substitute for true dual-clock FIFO logic without checking timing closure; (5) using generic JTAG programmers - configure with the Altera ByteBlasterMV or USB-Blaster. Per the Intel/Altera APEX 20KE datasheet, always validate timing with the Quartus TimeQuest analyzer after place-and-route.
Compliance Information
The -2X suffix denotes SnPb (lead-bearing) finish and is not RoHS compliant; use the -2N suffix for lead-free RoHS compliance. AEC-Q100 is not applicable - this is an FPGA, not an automotive IC. Other compliance fields not stated in the verified data.
