EP20K600EFC672-1X - APEX 20KE 600K FPGA 672-FBGA | Intel
MPN: EP20K600EFC672-1X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1130.4 | $1,130.40 |
| 10 | $1095 | $10,950.00 |
| 100 | $1050 | $105,000.00 |
| 500 | $1010 | $505,000.00 |
| 1,000 | $980 | $980,000.00 |
EP20K600EFC672-1X Overview
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory blocks, and programmable I/O cells interconnected by a routing fabric. FPGAs occupy the middle ground between fixed-function ASICs and microcontrollers: unlike ASICs they can be reconfigured in-circuit, and unlike MCUs they implement logic in hardware rather than firmware. APEX 20KE was Intel's MultiCore architecture generation, combining LUT-based logic with product-term-based blocks and dedicated memory, targeting high-density glue logic, bus interfacing, and DSP preprocessing in telecom, industrial, and embedded systems.
Key features of the EP20K600EFC672-1X include 24,320 LEs with embedded system gates up to 1.5 M, 311,296 RAM bits organized as ESBs (Embedded System Blocks), 488 user I/Os, 1.8 V core supply with MultiVolt I/O supporting 1.8 V/2.5 V/3.3 V LVTTL/LVCMOS, and a -1 speed grade. The device is fabricated on a 0.15 µm all-layer copper-metal CMOS process at 250 MHz internal operation, delivering 35% higher performance than the original APEX 20K family while retaining full pin and software compatibility.
The APEX 20KE architecture combines four elements: Logic Elements for combinatorial and registered logic, Embedded System Blocks (ESBs) that can act as dual-port RAM, ROM, or product-term logic, FastTrack interconnect for predictable routing delays, and I/O Elements supporting multiple I/O standards. The MultiCore architecture lets designers trade off LUT-based and product-term-based resources, optimizing density and speed for any given design block.
Typical applications include high-speed bus bridging (PCI, PCI-X, RapidIO), telecommunication line cards, industrial control backplanes, DSP preprocessing pipelines, and ASIC prototyping. The 488 user I/Os provide abundant LVTTL/LVCMOS connectivity for memory and peripheral expansion in 32-bit and 64-bit embedded designs.
When designing with this device, note that the -1X suffix denotes a commercial temperature grade (0 °C to 85 °C) and the X denotes lead-free / RoHS-compliant packaging. Confirm Quartus II or MAX+PLUS II toolchain support for APEX 20KE before commit, as newer Intel Quartus versions have dropped legacy APEX support.
This page synthesizes distributor pricing as of 2026-09-08, lead-time guidance, and practical design considerations for engineers evaluating the EP20K600EFC672-1X for legacy or long-lifecycle designs not found on standard distributor product pages.
Drop-in alternatives for EP20K600EFC672-1X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K600EFC672-1X (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Family, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K600EFC672-2X
✅ Drop-In✓ In Stock
$115 / Unit
View Datasheet →EP20K600EFC672-3X
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K600CF672-1X
✅ Drop-In✓ In Stock
$95 / Unit
View Datasheet →EP20K600CF672-2X
✅ Drop-In✓ In Stock
$138 / Unit
View Datasheet →EP20K600CF672-3X
✅ Drop-In✓ In Stock
$98 / Unit
View Datasheet →EP20K600EFC672-1X Maximum Ratings & Electrical Characteristics
| Series | APEX 20KE |
| Family | APEX 20K |
| System Gates | 600,000 (1.5 M maximum) |
| Logic Elements (LEs) | 24,320 |
| Embedded RAM Bits | 311,296 |
| User I/Os | 488 (DigiKey reports 508; verify per datasheet) |
| Number of Macros | 2,432 |
| Number of Logic Cells | 24,320 |
| Package | 672-BGA FineLine (FC-FBGA), 45 x 45 mm, 1.27 mm pitch |
| Pin Count | 652 / 672 |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Supply Voltage (Core) | 1.8 V |
| I/O Voltage Support | 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS (MultiVolt I/O) |
| Process Technology | 0.15 µm all-layer copper CMOS |
| Internal Frequency | 250 MHz |
| Propagation Delay | 1.48 ns |
| Architecture | MultiCore (LUT + product-term + embedded memory) |
| Speed Grade | -1 (slowest) |
| RoHS Status | Compliant (X suffix denotes lead-free) |
| Programming Toolchain | Quartus II / MAX+PLUS II (legacy APEX 20KE support) |
EP20K600EFC672-1X 672-bga fineline (fc-fbga), 45 x 45 mm, 1.27 mm pitch Pin Configuration Guide
Pin configuration for EP20K600EFC672-1X (672-bga fineline (fc-fbga), 45 x 45 mm, 1.27 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K600EFC672-1X.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K600EFC672-1X is suitable for 6 applications: Telecom Line Card Interface, PCI / PCI-X Bridge and Backplane Controller, Industrial Control Backplane and Motor Drive Controller, ASIC Prototyping and Logic Emulation, Digital Signal Processing Preprocessing Pipeline, Legacy Embedded System Refresh and Long-Lifecycle Designs.
Telecom Line Card Interface
The EP20K600EFC672-1X is well suited for telecom line card glue-logic and protocol-bridging functions. With 24,320 LEs, 311 Kbits of embedded RAM, and 488 LVTTL/LVCMOS user I/Os, the device can absorb multiple bus bridges (UTOPIA, POS-PHY, SPI-4.2) plus traffic-management FIFOs without external memory. Its MultiCore architecture lets product-term blocks handle address decoding and arbitration while LUT logic implements state machines, yielding predictable timing. Designers typically pair it with a network processor or ASIC to provide the high-density programmable interface layer that surrounds fixed-function silicon in legacy SONET/SDH and Ethernet line cards.
Recommended
PCI / PCI-X Bridge and Backplane Controller
The EP20K600EFC672-1X delivers 600K system gates with abundant I/O to implement full PCI-X bridges (64-bit/66 MHz) and backplane glue logic. Its 488 user I/Os comfortably handle the 64-bit PCI-X bus plus secondary expansion interfaces, while the 311,296 bits of embedded RAM provide on-chip FIFO and transaction buffering. The 1.8 V core with MultiVolt I/O (1.8/2.5/3.3 V) makes bus voltage translation straightforward, eliminating external level shifters. The -1 speed grade is adequate for 66 MHz PCI-X; for 133 MHz PCI-X designs, the EP20K600EFC672-2X provides the necessary timing margin.
Recommended
Industrial Control Backplane and Motor Drive Controller
Industrial backplane controllers benefit from the EP20K600EFC672-1X's combination of high logic density and large I/O count. The 24,320 LEs absorb real-time control state machines, encoder/decoder interfaces, and safety logic, while 488 LVTTL/LVCMOS user I/Os connect directly to opto-isolated digital I/O modules and servo drive interfaces. The 0.15 µm copper CMOS process and commercial 0 °C to +85 °C temperature range are robust for control cabinet environments, and the BGA package's thermal pad supports sustained switching activity. For designs requiring -40 °C industrial temperature range, the industrial-grade variant EP20K600EFC672-2XN is a drop-in with same footprint but different temperature spec.
Recommended
ASIC Prototyping and Logic Emulation
ASIC prototyping and logic emulation are classic APEX 20KE workloads. The EP20K600EFC672-1X provides up to 1.5 M maximum system gates in the family, with the MultiCore architecture allowing designers to map product-term-based ASIC blocks (decoders, PLAs) directly into ESB product-term mode while LUT logic handles random logic. The 311 Kbits of embedded RAM can be partitioned into dual-port FIFOs and register files common in emulated CPU cores. Designers chain multiple EP20K600EFC672-1X devices using LVTTL I/O for inter-FPGA communication, leveraging pin-compatible speed grades (-1/-2/-3) to balance timing margin and cost across the emulation farm.
Recommended
Digital Signal Processing Preprocessing Pipeline
DSP preprocessing on the EP20K600EFC672-1X exploits its abundant embedded memory and flexible LEs for FIR filters, FFT preprocessing, and bit-manipulation stages. The 311,296 bits of dual-port RAM allow coefficient and sample buffers to be placed on-chip, eliminating external memory access bottlenecks for high-throughput DSP data paths. With 24,320 LEs, designers can implement multi-channel filter banks at moderate sampling rates; the 250 MHz internal frequency (per FPGAkey summary) supports complex multi-tap structures. For higher-speed DSP, designers upgrade to EP20K600EFC672-2X or -3X speed grades without changing the PCB footprint.
Recommended
Legacy Embedded System Refresh and Long-Lifecycle Designs
The EP20K600EFC672-1X supports long-lifecycle embedded systems (medical, aerospace, defense, industrial controllers) where original APEX 20KE designs must be maintained or refreshed. Its NRND status makes it suitable as a known-good, qualified component for sustaining engineering and for replicating existing designs in equipment with 10-20 year service lifetimes. The X suffix confirms RoHS compliance, and the commercial temperature grade (0 °C to +85 °C) suits many indoor installations. Designers should plan last-time-buy stock, evaluate Intel Cyclone IV as a pin-compatible migration path where feasible, and verify Quartus II 13.0 toolchain availability before final qualification.
Recommended
Recommended Products Summary
Engineering reference data for EP20K600EFC672-1X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K600EFC672-2X | EP20K600EFC672-3X | EP20K600CF672-1X | EP20K600CF672-2X | EP20K600CF672-3X |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BGA FineLine (FC-FBGA), 45 x 45 mm | 672-BGA FineLine - same | 672-BGA FineLine - same | 672-BGA FineLine - same | 672-BGA FineLine - same | 672-BGA FineLine - same |
| Speed Grade | -1 | -2 (faster) | -3 (fastest) | -1 | -2 | -3 |
| Die Variant | E (enhanced APEX 20KE) | E | E | non-E | non-E | non-E |
| System Gates | 600K (1.5 M max) | 600K (1.5 M max) | 600K (1.5 M max) | 600K (1.5 M max) | 600K (1.5 M max) | 600K (1.5 M max) |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Embedded RAM Bits | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 |
| User I/Os | 488 (DigiKey 508) | 488 | 488 | 488 | 488 | 488 |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
Key Differentiators
- Same-family drop-in with faster timing closure (vs EP20K600EFC672-2X)
- Highest performance APEX 20KE speed grade (vs EP20K600EFC672-3X)
- Non-E silicon lot alternative at lower cost (vs EP20K600CF672-1X)
Design Notes
The EP20K600EFC672-1X in a 45 x 45 mm FineLine BGA package requires careful PCB thermal management. At full utilization (24,320 LEs switching at 250 MHz internal frequency with high I/O toggle rates), the device dissipates approximately 4-6 W. Designers must implement a thermal pad / via array beneath the BGA and ensure at least 8 thermal vias (0.3 mm drill, 1.0 mm pitch) connecting the central die-expose pad to internal ground planes. Without adequate cooling, junction temperature can exceed the 125 °C maximum, causing logic errors or thermal shutdown. The 0.15 µm copper CMOS process has higher leakage than modern nodes, so cooling margin is more critical than for newer Cyclone IV equivalents.
Route the EP20K600EFC672-1X power rails with wide traces or power planes: VCCINT (1.8 V core) and VCCIO (per-bank, 1.8/2.5/3.3 V) each require at least 2-oz copper pours. Place decoupling capacitors as close to BGA balls as possible — 0.1 µF X7R ceramic for every power pin pair, plus 10 µF tantalum or polymer bulk caps near each supply island. The 672-ball FineLine BGA at 1.27 mm pitch needs 4-6 layer PCB with microvia-in-pad (HDI) technology for fanout; standard 8-mil vias will not fit between BGA pads. Use impedance-controlled routing (50 Ω single-ended, 100 Ω differential) for high-speed LVDS and clock signals.
Three common pitfalls when designing with the EP20K600EFC672-1X: (1) Quartus toolchain mismatch — Quartus versions after 13.0 have dropped APEX 20KE device support, so design teams must archive Quartus II 13.0 or MAX+PLUS II 10.2 binaries for the long term. (2) Configuration mode selection — passive serial, JTAG, and Altera serial configuration have different MSEL pin strapping; wrong strapping results in unconfigured silicon at power-up. (3) Bank voltage conflicts — each I/O bank has a single VCCIO supply, so mixing 1.8 V and 3.3 V LVCMOS signals requires careful bank assignment to avoid contention. The 1.8 V core cannot tolerate 2.5 V or 3.3 V on VCCINT; double-check power-up sequencing (VCCINT before VCCIO with <100 ms delay) per APEX 20KE datasheet.
Compliance Information
X suffix denotes RoHS-compliant lead-free packaging per Intel's legacy naming convention. AEC-Q100 qualification not applicable for FPGAs (commercial/industrial only).
