EP2AGX260EF29C6 - Arria II GX 244K Logic Elements FPGA | Intel
MPN: EP2AGX260EF29C6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1798.74 | $1,798.74 |
| 10 | $1725 | $17,250.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1530 | $765,000.00 |
| 1,000 | $1450 | $1,450,000.00 |
EP2AGX260EF29C6 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs) within the integrated circuits taxonomy: FPGA -> PLD -> logic IC -> semiconductor. Unlike fixed-function ASICs, FPGAs can be reconfigured after the application is deployed, enabling hardware-level parallelism, rapid prototyping, and post-sale design updates. The Arria II GX family sits between Cyclone (low-cost) and Stratix (high-performance) in Intel's FPGA lineup.
Key features of the EP2AGX260EF29C6 include 244,188 logic elements, 12,038,144 bits of embedded memory, 612 embedded 18x18 multipliers for DSP, 12 transceiver channels supporting data rates up to 6.375 Gbps, and 372 general-purpose I/O pins. The device operates from a 0.9 V core supply and supports commercial temperature grades (0C to +85C). The 780-ball FC-FBGA package integrates flip-chip interconnect for high signal integrity at multi-gigabit speeds.
Architecturally, the Arria II GX uses 8-input adaptive logic modules (ALMs), each containing two combinational adaptive LUTs (ALUTs) and four dedicated registers. This structure delivers fine-grained logic utilization and efficient implementation of wide fan-in functions. The transceiver blocks integrate physical coding sublayer (PCS) and physical medium attachment (PMA) layers, supporting protocols such as PCIe Gen1/Gen2, Serial RapidIO, GPON, and CPRI. Hard memory controllers and PLLs reduce fabric utilization for common system tasks.
Typical applications include high-definition video processing, wireless baseband, military radar signal processing, ASIC prototyping, and high-speed serial interface bridging. The combination of transceiver bandwidth and DSP resources makes this device particularly well-suited for systems requiring real-time signal processing with multi-gigabit I/O.
When designing with this part, plan PCB layout for the FC-FBGA package using microvia and via-in-pad technology; signal integrity on transceiver channels depends on controlled-impedance routing and proper decoupling. Quartus II design software is required for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the Arria II GX family, and PCB-layout design notes not duplicated in the manufacturer datasheet.
Drop-in alternatives for EP2AGX260EF29C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX260EF29C6 (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Mounting Type, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX260EF29C5N
✅ Drop-In✓ In Stock
$1565 / Unit
View Datasheet →EP2AGX260EF29C5G
✅ Drop-In✓ In Stock
$2515 / Unit
View Datasheet →EP2AGX260EF29C4N
✅ Drop-In✓ In Stock
$1295 / Unit
View Datasheet →EP2AGX260EF29C4G
✅ Drop-In✓ In Stock
$1955.55 / Unit
View Datasheet →EP2AGX260EF29C5
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1870 / Unit
View Datasheet →EP2AGX260EF29C4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$339.5 / Unit
View Datasheet →EP2AGX260EF29C6 Maximum Ratings & Electrical Characteristics
| Family | Arria II GX |
| Logic Elements | 244,188 |
| Memory Bits | 12,038,144 bits |
| Embedded 18x18 Multipliers | 612 |
| LABs (Logic Array Blocks) | 10,260 |
| User I/O Pins | 372 |
| Transceiver Channels | 12 |
| Transceiver Data Rate (max) | 6.375 Gbps |
| Process Technology | 40 nm TSMC |
| Core Voltage | 0.9 V |
| Package | 780-ball FC-FBGA (EF29) |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount (flip-chip BGA) |
| Design Software | Quartus II |
EP2AGX260EF29C6 780-ball fc-fbga (ef29) Pin Configuration Guide
Pin configuration for EP2AGX260EF29C6 (780-ball fc-fbga (ef29) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX260EF29C6.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX260EF29C6 is suitable for 7 applications: High-Definition Video Processing, Wireless Baseband Signal Processing, ASIC Prototyping and Emulation, PCIe Gen2 Endpoint Card, Military Radar Signal Processing, High-Speed Serial Protocol Bridging, Industrial Machine Vision Systems.
High-Definition Video Processing
The EP2AGX260EF29C6's 244,188 logic elements and 612 18x18 multipliers deliver the parallelism required for real-time multi-stream HD/3G-SDI video processing at full frame rate. The 12,038,144 bits of embedded memory act as line buffers and frame stores without external SRAM, simplifying board layout. Its 12 transceiver channels handle SDI, HDMI, and DisplayPort bridging. This part replaces multiple ASSP video processors, reducing BOM cost in broadcast encoders and studio equipment.
Recommended
Wireless Baseband Signal Processing
The 612 DSP blocks in the EP2AGX260EF29C6 implement LTE and WiMAX baseband FFT/iFFT, channel estimation, and turbo decoding at line rate. Transceiver rates up to 6.375 Gbps connect to RF front-end ADCs/DACs via CPRI or OBSAI. The 40 nm process balances dynamic power and performance for 4G small cells. Quartus II DSP Builder accelerates model-based design from MATLAB/Simulink directly into RTL.
Recommended
ASIC Prototyping and Emulation
With 244,188 logic elements, the EP2AGX260EF29C6 emulates ASIC RTL at near-ASIC clock rates. Two or more devices can be tiled via transceivers to extend capacity to multi-million-gate ASIC prototypes. The Arria II GX architecture minimizes compile time versus larger FPGAs, accelerating verification cycles. Quartus II supports standard ASIC flows including SDC constraints and gate-level netlists from Synopsys Design Compiler.
Recommended
PCIe Gen2 Endpoint Card
The EP2AGX260EF29C6 hard IP supports PCIe Gen1 (2.5 Gbps) and Gen2 (5 Gbps) with x1/x2/x4 lane configurations, eliminating soft PCIe cores and saving fabric. 12 transceivers permit multiple PCIe endpoints or combo cards with PCIe + SATA + GbE. The 780-ball FC-FBGA EF29 package fits standard PCIe card form factors with adequate BGA escape routing. Quartus II PCIe Compiler generates the complete TLP and config-space logic.
Recommended
Military Radar Signal Processing
The 244K logic elements and 612 DSP blocks of the EP2AGX260EF29C6 execute pulse-Doppler and SAR processing in real time at multi-MHz sample rates. The 12 transceivers digitize and aggregate multiple ADC data streams at up to 6.375 Gbps. Extended-temperature Arria II GX variants exist for harsh-environment radar systems. Pin-compatible industrial-temperature speed grades (I3/I5) are drop-in options for defense applications.
Recommended
High-Speed Serial Protocol Bridging
The 12 transceiver channels at 6.375 Gbps enable protocol bridging between SATA, Serial RapidIO, GPON, CPRI, and custom serial interfaces in one device. The hard PCS and PMA layers reduce latency versus soft SERDES implementations. 12 Mb of embedded memory provides packet buffering without external SRAM. Industrial-grade variants of the same die operate in telecom outdoor units and base-station backhaul equipment.
Recommended
Industrial Machine Vision Systems
The EP2AGX260EF29C6 processes multi-camera machine-vision pipelines including image preprocessing, blob detection, and pattern recognition on the factory floor. 244K logic elements support 8 to 16 simultaneous CameraLink or CoaXPress streams. The 12 transceivers aggregate multiple CoaXPress links at 6.25 Gbps. Industrial-temperature variants extend operating range for harsh manufacturing environments.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX260EF29C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX260EF29C5N | EP2AGX260EF29C5G | EP2AGX260EF29C4N | EP2AGX260EF29C4G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FC-FBGA (EF29) | 780-ball FC-FBGA (EF29) - same | 780-ball FC-FBGA (EF29) - same | 780-ball FC-FBGA (EF29) - same | 780-ball FC-FBGA (EF29) - same |
| Logic Elements | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 |
| Memory Bits | 12,038,144 | 12,038,144 | 12,038,144 | 12,038,144 | 12,038,144 |
| DSP 18x18 Multipliers | 612 | 612 | 612 | 612 | 612 |
| Speed Grade | C6 (commercial) | C5 (faster) | C5 (faster, Pb-free) | C4 (fastest) | C4 (fastest, Pb-free) |
| Transceiver Channels | 12 | 12 | 12 | 12 | 12 |
| User I/O Pins | 372 | 372 | 372 | 372 | 372 |
Key Differentiators
- Drop-in same-package speed-grade upgrade available (vs EP2AGX260EF29C5N)
- Largest Arria II GX device in 780-ball EF29 package (vs EP2AGX190EF29C6G)
- Industrial-temperature drop-in option exists (vs EP2AGX260EF29I3N)
Design Notes
The 780-ball FC-FBGA EF29 package requires a multilayer PCB with microvia or via-in-pad technology to escape the dense ball array. Use 1 oz copper outer layers with low-loss dielectric (e.g., FR-4 Megtron 6) for the transceiver channels. Maintain 100 ohm differential impedance on transceiver pairs and 50 ohm single-ended on general-purpose I/O. Provide at least 4 GND balls per power ball to limit return-path inductance.
Estimated: power-supply decoupling requires at least 20 low-ESR ceramic capacitors (0.1uF and 10uF) within 100 mils of each power ball. Core supply (VCC) is 0.9 V and may draw up to 5 A under heavy DSP utilization. Use a dedicated LDO or DC-DC regulator with remote sensing at the package balls; shared supplies with other ICs will inject switching noise into the FPGA core and degrade timing margin.
Transceiver channels operating above 5 Gbps require pre-emphasis and equalization settings to be configured in the Quartus II ALT2GX megafunction. AC-coupling capacitors (100 nF) must be placed within 250 mils of each transmitter ball. Use IBIS-AMI models for channel simulation; the Arria II GX handbook Chapter 12 lists recommended pre-emphasis and VOD values per protocol. Avoid routing transceiver signals over power-plane splits.
Do not confuse EP2AGX260EF29C6 (commercial temperature, speed grade 6) with EP2AGX260EF29I3N (industrial temperature, speed grade 3); the temperature and speed grade are inverted and dropping an industrial-rated part into a commercial-only PCB does not always meet timing. Also note that 'EF29' is the package code, not a die revision - all EF29 Arria II GX 260 devices share the same die.
Compliance Information
RoHS/REACH status was not in the verified web data; for Pb-free confirmation use EP2AGX260EF29C5G or EP2AGX260EF29C4G (G suffix indicates Pb-free/Green packaging). The Arria II GX family is not AEC-Q100 qualified - use industrial variants only for non-automotive extended-temperature environments.
