EP2AGX65DF25I3G - Arria II GX FPGA, 65K LE, 252 I/O, 572-FCBGA | Intel
MPN: EP2AGX65DF25I3G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1442.71 | $1,442.71 |
| 10 | $1300 | $13,000.00 |
| 100 | $1150 | $115,000.00 |
| 500 | $1025 | $512,500.00 |
| 1,000 | $920 | $920,000.00 |
EP2AGX65DF25I3G Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows hardware designers to implement custom digital circuits after fabrication. FPGAs occupy the space between fixed-function ASICs and microcontrollers: unlike ASICs they require no mask costs and have short design cycles, and unlike microcontrollers they execute logic in dedicated parallel hardware rather than sequential software. Within the wider semiconductor taxonomy, FPGAs sit under programmable logic devices (PLDs), which sit under digital integrated circuits, which sit under semiconductors. The Arria II GX family specifically targets applications requiring both high-speed serial transceivers and moderate logic density.
Key features of the EP2AGX65DF25I3G include 252 general-purpose user I/Os, integrated PCIe hard IP blocks, embedded DSP blocks for high-throughput signal processing, and configuration support via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG interfaces. The device supports industrial temperature operation (-40C to +100C) per the I3 speed grade designation.
The architecture combines adaptive logic modules (ALMs) with embedded M9K and M144K memory blocks, allowing efficient implementation of FIFOs, shift registers, and large on-chip buffers. The integrated transceivers support protocols such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, and CPRI, enabling direct connectivity to backplanes and high-speed serial interfaces without external PHY devices.
Typical applications include wireless baseband processing, broadcast video bridging, industrial imaging and machine vision, test and measurement equipment, and PCIe endpoint cards. Designers choose the EP2AGX65DF25I3G when projects need 65K logic elements coupled with proven 3.75 Gbps transceivers in an industrial-grade, mid-power envelope.
When designing with this device, plan PCB layout for the FCBGA 572-ball footprint carefully - escape routing requires microvia/HDI stackups. Use Altera Quartus II (now Intel Quartus Prime) for synthesis, place-and-route, and timing closure. Verify transceiver reference clock jitter compliance early in the design cycle to avoid late-stage timing closure failures.
This page consolidates distributor pricing, same-brand drop-in alternatives, datasheet references, and practical design notes not found in a single source.
Drop-in alternatives for EP2AGX65DF25I3G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX65DF25I3G (same form factor and footprint) — differing in Speed Grade, Package, Operating Temperature, RoHS Status, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX65DF25C6G
✅ Drop-In✓ In Stock
$184.6758 / Unit
View Datasheet →EP2AGX65DF25I5G
✅ Drop-In✓ In Stock
$378 / Unit
View Datasheet →EP2AGX65DF25C5N
✅ Drop-In✓ In Stock
$198.95 / Unit
View Datasheet →EP2AGX65DF25C4G
✅ Drop-In✓ In Stock
$149.5 / Unit
View Datasheet →EP2AGX65DF25C5G
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP2AGX65DF25C6N
✅ Drop-In✓ In Stock
$89.4 / Unit
View Datasheet →EP2AGX65DF25I3G Maximum Ratings & Electrical Characteristics
| Family | Arria II GX |
| Logic Elements | 60,214 |
| Embedded Memory (bits) | 5,371,904 |
| User I/O Count | 252 |
| Package | 572-ball FCBGA (Flip-Chip BGA) |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Transceivers | Up to 12 |
| Transceiver Data Rate | Up to 3.75 Gbps |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | I3 |
| DSP Blocks | Yes (embedded multipliers) |
| PCIe Hard IP | Yes (Gen1/Gen2) |
| Configuration Modes | AS, PS, FPP, JTAG |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP2AGX65DF25I3G 572-ball fcbga (flip-chip bga) Pin Configuration Guide
Pin configuration for EP2AGX65DF25I3G (572-ball fcbga (flip-chip bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX65DF25I3G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX65DF25I3G is suitable for 6 applications: Wireless Baseband Processing, Broadcast Video Bridging and Processing, Industrial Imaging and Machine Vision, PCIe Endpoint Add-In Cards, Test and Measurement Instrumentation, Telecom Backplane Aggregation.
Wireless Baseband Processing
The EP2AGX65DF25I3G fits wireless baseband processing because 60,214 logic elements combined with embedded DSP blocks deliver the parallel arithmetic throughput required for LTE and WCDMA channel processing. Its 12 transceivers at up to 3.75 Gbps handle CPRI links to remote radio heads, while PCIe hard IP simplifies backhaul connectivity to baseband cards. Placed on a CPRI framer/modem daughter card, it replaces multiple discrete ASICs. The industrial temperature grade supports outdoor base-station enclosures, and Quartus Prime's DSP Builder accelerates FIR and FFT implementation versus hand-coded RTL.
Recommended
Broadcast Video Bridging and Processing
The EP2AGX65DF25I3G suits broadcast video bridging because its 252 user I/Os accommodate parallel video interfaces such as LVDS and TTL alongside serial 3G-SDI over transceivers. With 5,371,904 bits of embedded memory it can buffer multiple video frames on-chip without external SDRAM for short-format processing. Designers use it for SDI/HDMI protocol conversion, video format scaling, and multiviewer applications. Transceivers simplify connection to SFP modules for fiber transport. Industrial temperature grade enables deployment in production trucks and outdoor broadcast infrastructure.
Recommended
Industrial Imaging and Machine Vision
The EP2AGX65DF25I3G is well-matched to industrial machine vision because 60,214 logic elements can implement multi-tap image preprocessing pipelines (debayering, filtering, region-of-interest extraction) in real time, while 12 transceivers support Camera Link HS or CoaXPress over fiber. Industrial temperature grade tolerates factory floor thermal stress, and embedded DSP blocks accelerate convolution kernels for defect detection. It is typically paired with external SDRAM for frame buffering and a GigE Vision or USB3 Vision host interface for downstream processing.
Recommended
PCIe Endpoint Add-In Cards
The EP2AGX65DF25I3G integrates PCIe Gen1/Gen2 hard IP, allowing designers to build Gen2 x4 or x8 endpoint cards without external PHY silicon. Its 60,214 logic elements accommodate DMA engines, register interfaces, and protocol state machines, while transceivers connect to external SFP+ cages or backplanes for additional I/O. The 572-ball FCBGA package fits standard PCIe card form factors with HDI stackup. Industrial temperature grade suits server-room and telecom-card deployments where ambient temperatures exceed consumer thresholds.
Recommended
Test and Measurement Instrumentation
The EP2AGX65DF25I3G fits test and measurement equipment because its high logic density allows integration of protocol-aware triggering, deep memory capture buffers, and high-speed serial data analysis in one device. Transceivers up to 3.75 Gbps handle protocols like XAUI, Serial RapidIO, and PCIe for protocol-aware test cards. Industrial temperature grade supports bench and field-instrument deployments. Designers use the Quartus Prime SignalTap logic analyzer for real-time verification, which reduces validation time versus external logic analyzers.
Recommended
Telecom Backplane Aggregation
The EP2AGX65DF25I3G is appropriate for telecom backplane aggregation cards because its 12 transceivers aggregate multiple lower-speed backplane links into a single high-speed uplink via Interlaken or Serial RapidIO. The 5,371,904 bits of embedded memory handle packet buffering and queue management on-chip, reducing external memory requirements. Industrial temperature grade suits CO (central office) deployments. Designers pair it with a network processor or SoC for control-plane coordination, using PCIe or SPI as the management interface.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX65DF25I3G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX65DF25C6G | EP2AGX65DF25I5G | EP2AGX65DF25C5N | EP2AGX65DF25C4G |
|---|---|---|---|---|---|
| Package | 572-ball FCBGA (DF25) | 572-ball FCBGA (DF25) - same | 572-ball FCBGA (DF25) - same | 572-ball FCBGA (DF25) - same | 572-ball FCBGA (DF25) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 60,214 | 60,214 | 60,214 | 60,214 | 60,214 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I3 | C6 (faster) | I5 (faster) | C5 (faster) | C4 |
| Embedded Memory (bits) | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 |
| User I/O Count | 252 | 252 | 252 | 252 | 252 |
| Transceiver Data Rate | Up to 3.75 Gbps | Up to 3.75 Gbps | Up to 3.75 Gbps | Up to 3.75 Gbps | Up to 3.75 Gbps |
Key Differentiators
- Industrial temperature grade in same package (vs EP2AGX65DF25C6G)
- I3 speed grade offers timing margin headroom vs I5 (vs EP2AGX65DF25I5G)
- Mid-density 60K LE offers cost balance (vs EP2AGX125DF25I3G)
Design Notes
The 572-ball FCBGA package requires microvia HDI PCB stack-ups (typically 6-10 layers with 1+1+1 or 2+2+2 microvia build-up). Standard 4-layer through-hole boards cannot escape this package. Use 1.0 mm ball pitch escape routing with via-in-pad or dog-bone fanouts, and follow Intel/Altera's Arria II GX pin connection guidelines for power pin decoupling. Place decoupling capacitors on the bottom side of the board as close to the BGA balls as possible.
Estimated: At maximum junction temperature of 100C and ambient of 55C inside an enclosed chassis, allowable junction-to-ambient thermal rise is 45C. With a typical Arria II GX junction-to-ambient theta_JA of approximately 12-15 C/W for the FCBGA package (depends on airflow and PCB copper), the device can dissipate roughly 3-4 W. Use a heatsink or thermal interface material if the design operates near full transceiver utilization. Consult the Arria II GX thermal management user guide for application-specific derating curves.
Do not assume the I3 speed grade timing applies to other speed grades in the same package - all timing constraints must be re-derived per speed grade when migrating. Also, configuration mode selection (AS/PS/FPP/JTAG) requires correct MSEL pin strapping on power-up; incorrect strapping causes silent boot failures. Always verify the Quartus Prime programming file format matches the chosen configuration mode (e.g., .pof for AS, .sof for JTAG).
Transceiver reference clock jitter directly impacts link margin; use a low-jitter clock source compliant with the Arria II GX transceiver specification (typically <1 ps RMS for 3.75 Gbps operation). Matched-length differential routing (within 5 mils) is required for all transceiver channels. Use IBIS-AMI models for channel simulation before PCB fabrication to avoid respins.
Compliance Information
RoHS compliant per Intel/Altera product page. Industrial temperature grade, lead-free FCBGA package. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC in the AEC-Q100 sense.
