Intel

EP2AGX95EF35C6G - 95K Logic Elements FPGA | Intel

MPN: EP2AGX95EF35C6G βœ“ Active
In Stock Ships in 1-3 business days
1152-BBGA, FCBGA Package 6,839,296 bits Memory
Contact for pricing
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $0 $0.00
10 $0 $0.00
100 $0 $0.00
500 $0 $0.00
1,000 $0 $0.00
ℹ️ All prices are in USD

EP2AGX95EF35C6G Overview

Intel EP2AGX95EF35C6G is an Arria II GX field-programmable gate array containing 89,178 logic elements, 6,839,296 embedded memory bits, and 452 user I/O in a 1152-ball FCBGA package. The verified distributor record identifies the device as an Arria II GX FPGA, but it does not provide the package dimensions, speed grade, transceiver count, operating temperature, or core-voltage values. Those missing parameters are explicitly identified rather than inferred from the ordering code. The C6G suffix and 1152-FBGA package designation are used consistently with the exact MPN and supplied product records.

A field-programmable gate array, or FPGA, is a programmable logic device containing configurable logic blocks, memory resources, routing, and specialized I/O circuitry. Within the programmable-logic hierarchy, an FPGA sits above fixed-function integrated circuits because its logic can be reconfigured after manufacturing. Arria II GX devices support high-bandwidth digital systems, and EP2AGX95EF35C6G is positioned for designs requiring substantial logic density, embedded memory, and 452 I/O. The device therefore belongs to the broader categories of programmable logic IC, integrated circuit, and semiconductor.

The principal verified resource figures are 89,178 logic elements and 6,839,296 bits of embedded memory. These resources support datapath logic, state machines, protocol handling, buffering, and other parallel digital functions. The verified record also reports 452 user I/O, providing the specified interface capacity for external memories, buses, control signals, and high-speed system connections. A package description of 1152-BBGA, FCBGA identifies a large fine-pitch ball-grid-array implementation, although exact ball pitch and body dimensions are not present in the supplied data.

The C6 ordering information may encode device configuration, package, and operating characteristics, but the supplied records do not provide a key that safely maps every suffix character to an electrical rating. Consequently, operating voltage, temperature grade, clock frequency, transceiver count, logic-element architecture details, and power dissipation remain unverified. Engineers should consult the official manufacturer documentation before schematic release, footprint verification, power-budget calculation, or signal-integrity sign-off. Distributor product pages can be used to confirm commercial availability and inspect current inventory.

Typical applications for EP2AGX95EF35C6G include industrial control and automation equipment, communications infrastructure, video and imaging processing, test and measurement hardware, and high-performance embedded computing. Its 89,178 logic elements make it suitable for concurrent processing, while 6,839,296 embedded memory bits can support FIFOs, packet buffers, lookup tables, and data-path storage. The 452 user I/O are relevant where the FPGA bridges processors, memory devices, converters, and board-level interfaces.

PCB implementation must use the manufacturer-approved 1152-ball footprint and validated ball map. Because the package is an FCBGA, exact pad geometry, escape routing, via construction, layer stack-up, and solder-mask rules should be taken from the package drawing. Power integrity and signal integrity should be evaluated in the final design rather than derived from an unverified generic FPGA estimate.

This page combines the exact verified MPN, distributor inventory statements, resource counts, package identity, and drop-in assessment limits. It does not convert the MPN suffix into undocumented electrical specifications or present a non-approved BGA part as a pin-compatible replacement.

Drop-in alternatives for EP2AGX95EF35C6G β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2AGX95EF35C6G (same form factor and footprint) β€” differing in Package, Speed Grade, Operating Temperature, Embedded Memory, PCIe Hard IP.

Intel
Speed Grade: 6
Operating Temperature: 0C to +85C (TJ)
Embedded Memory: 4,494 Kbits
Compare with EP2AGX95EF35C6G β†’
Intel
Package: 1152-ball FCBGA, 35 mm x 35 mm, 1.0 mm pitch
Speed Grade: -4 (mid-speed)
Operating Temperature: 0C to +85C (commercial)
Compare with EP2AGX95EF35C6G β†’
Intel
Speed Grade: C5
Operating Temperature: 0C to +85C (Commercial)
Compare with EP2AGX95EF35C6G β†’
Intel
Package: 1152-ball FCBGA
Speed Grade: -6 (mid)
PCIe Hard IP: PCIe Gen1/Gen2 (x1/x4/x8) - per family datasheet
Compare with EP2AGX95EF35C6G β†’
Intel
Package: 1152-ball FBGA (FineLine BGA), 35 mm
Speed Grade: C6
Operating Temperature: Commercial (0C to +85C)
Compare with EP2AGX95EF35C6G β†’
Intel
Package: 1152-ball FCBGA
Compare with EP2AGX95EF35C6G β†’
Intel
Operating Temperature: -40C to +100C (Industrial)
Compare with EP2AGX95EF35C6G β†’
Intel
Package: 1152-ball FC-FBGA (EF35, 35 mm)
Operating Temperature: -40C to +100C (Industrial)
Embedded Memory: 4,518 Kbits
Compare with EP2AGX95EF35C6G β†’
Intel
Embedded Memory: 6839296 bits
Compare with EP2AGX95EF35C6G β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP2AGX95EF35C6

βœ… Drop-In
Intel
πŸ“¦ 1152-BBGA, FCBGA
Arria II GX Β· 89,178 Β· 452 Β· 4,478 Β· 612 Β· 8 Β· 3.75 Gbps Β· 1152-ball FCBGA

βœ“ In Stock

$398 / Unit

View Datasheet β†’

EP2AGX95EF35C5G

βœ… Drop-In
Intel
πŸ“¦ 1152-BBGA, FCBGA
Arria II GX Β· Arria II GX Β· 89,178 Β· 6,839,296 bit Β· 452 Β· 3,747 Β· 0.9 V Β· 40 nm

βœ“ In Stock

$510 / Unit

View Datasheet β†’

EP2AGX95EF35C4G

βœ… Drop-In
Intel
πŸ“¦ 1152-BBGA, FCBGA
Arria II GX Β· 89,178 Β· 6,839,296 bits (~6.5 Mbit) Β· 616 Β· 452 Β· 4 (up to 3.75 Gbps)

βœ“ In Stock

$1555 / Unit

View Datasheet β†’

EP2AGX95EF29I6N

βœ… Drop-In
πŸ“¦ 1152-BBGA, FCBGA
Same listed 1152-ball package family, but the EF29 ordering designation and I6N suffix differ; package, pin, and parameter compatibility are not explicitly verified.

πŸ“‹ Reference alternative (not in catalog)

EP2AGX95EF29C6G

βœ… Drop-In
Intel
πŸ“¦ 1152-BBGA, FCBGA
Arria II GX Β· 89,178 Β· 4,494 Kbits Β· 372 Β· 0.87 V to 0.93 V Β· 0C to +85C (TJ) Β· 780-BBGA, FCBGA Β· HBGA (FC-FBGA)

βœ“ In Stock

$465 / Unit

View Datasheet β†’

EP2AGX95EF35C6G Maximum Ratings & Electrical Characteristics

Device Type Field Programmable Gate Array (FPGA)
Product Family Arria II GX
Logic Elements 89,178
Embedded Memory 6,839,296 bits
User I/O 452
Package 1152-BBGA, FCBGA
Package Type Ball Grid Array
Manufacturer Altera / Intel

EP2AGX95EF35C6G ball grid array Pin Configuration Guide

Pin configuration for EP2AGX95EF35C6G (ball grid array package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

ball grid array package pinout diagram for EP2AGX95EF35C6G

No detailed pinout data available for EP2AGX95EF35C6G.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2AGX95EF35C6G is suitable for 6 applications: Industrial Control and Automation, Communications Infrastructure, Video and Imaging Processing, Test and Measurement Equipment, Embedded Computing and Data Aggregation, High-Speed Interface Consolidation.

🏭

Industrial Control and Automation

EP2AGX95EF35C6G fits industrial control designs that need substantial programmable logic, on-chip buffering, and a large interface count. Its verified 89,178 logic elements can implement motor-control state machines, safety sequencing, protocol bridges, and real-time control algorithms concurrently. The 6,839,296 embedded memory bits support FIFOs, captured waveforms, lookup tables, and interstage data buffering without occupying every external memory interface. The FPGA’s 452 user I/O are useful for connecting sensors, analog-to-digital converters, digital-to-analog converters, position encoders, and industrial Ethernet or fieldbus bridges. Because the supplied data does not confirm industrial temperature grading, core voltage, or timing limits, the device should be selected only after the official ordering and environmental documentation is checked. Power integrity, thermal analysis, and I/O timing closure remain part of the design sign-off process.

🌐

Communications Infrastructure

EP2AGX95EF35C6G is relevant to communications equipment that requires parallel packet processing, interface conversion, and flexible buffering. The verified 89,178 logic elements can handle framing, forwarding, statistics, encryption-control functions, and multiple protocol blocks in one programmable device. Its 6,839,296 embedded memory bits are valuable for packet FIFOs, traffic shaping, descriptor storage, and lookup data. With 452 user I/O, the FPGA can aggregate multiple lower-speed interfaces, connect to processors, and bridge board-level data paths. The supplied records do not verify the number of high-speed transceivers, supported protocols, or maximum data rate, so a communications design must confirm those capabilities from official documentation. Board layout should follow the approved 1152-ball package guidance, while impedance, jitter, crosstalk, and power-supply noise must be evaluated in the complete channel.

πŸ“Ί

Video and Imaging Processing

EP2AGX95EF35C6G can support image-acquisition and video-processing systems that need deterministic parallel processing. The 89,178 logic elements provide capacity for pixel pipelines, color-space conversion, frame synchronization, region-of-interest processing, and control logic. The 6,839,296 embedded memory bits can hold line buffers, frame statistics, filter coefficients, and intermediate pixel data. Its 452 user I/O allow the FPGA to interface with image sensors, display controllers, memory devices, and system processors. Actual throughput depends on image resolution, pixel clock, memory configuration, and timing closure; the supplied data does not provide a verified maximum clock frequency or DSP count. Designers should therefore validate those specifications in the manufacturer documentation and use realistic image sizes and frame rates in system-level performance calculations.

πŸ”§

Test and Measurement Equipment

EP2AGX95EF35C6G is suitable for test and measurement hardware where acquisition, trigger logic, signal conditioning control, and data formatting must operate deterministically. Its 89,178 logic elements can implement counters, trigger engines, decoders, timing generators, and custom instrument functions. The verified 6,839,296 embedded memory bits support sample buffers, histograms, correlation data, and waveform captures. The 452 user I/O provide capacity for connecting converters, sensors, front-panel controls, clocks, and high-speed data outputs. The device should not be assigned a specific converter accuracy or sampling rate from the supplied data because those values are not provided. Use the official I/O, clock, power, and timing specifications, then simulate the instrument architecture and verify measurement performance across temperature and supply-voltage corners.

πŸ–₯️

Embedded Computing and Data Aggregation

EP2AGX95EF35C6G can serve as a programmable aggregation and acceleration device in embedded computing systems. The verified 89,178 logic elements support data-path acceleration, interface adaptation, control, and protocol translation, while the 6,839,296 embedded memory bits provide local storage for bursts and intermediate results. Its 452 user I/O help connect processors, memory, storage controllers, sensors, and expansion interfaces. The FPGA may reduce the need for several fixed-function bridge devices when the design is developed around its programmable architecture. However, the supplied data does not confirm performance-per-watt, soft-processor capability, transceiver support, or exact power requirements, so those points must be established through documentation and measured design results. The 1152-ball FCBGA also requires controlled BGA layout and reliable power-delivery design.

πŸ”Œ

High-Speed Interface Consolidation

EP2AGX95EF35C6G is applicable to systems that must consolidate many digital interfaces under centralized programmable control. The 452 user I/O offer a large verified interface resource count for parallel buses, control signals, and multiple peripheral connections. The 89,178 logic elements can implement bridge logic, format conversion, protocol handling, and timing adjustment, while the 6,839,296 embedded memory bits can buffer variable-rate data. The device’s suitability for any particular high-speed interface must be checked against the official supported I/O standards, voltage levels, clocking resources, and timing limits, none of which are included in the supplied distributor snippets. Engineers should confirm whether the application requires transceivers or other specialized blocks, and should not infer those capabilities from the Arria II GX family name. A successful implementation requires approved package geometry, controlled-impedance routing, and power-integrity validation.

What are the key specifications of EP2AGX95EF35C6G that engineers should know?
EP2AGX95EF35C6G is an Arria II GX FPGA with 89,178 logic elements, 6,839,296 bits of embedded memory, and 452 user I/O. The verified distributor listing identifies a 1152-BBGA, FCBGA package. According to the supplied DigiKey product record, these are the three principal resource figures, while core voltage, operating temperature, transceiver count, package dimensions, and maximum clock frequency are not stated and require manufacturer documentation.
What is EP2AGX95EF35C6G?
EP2AGX95EF35C6G is an Intel/Altera Arria II GX field-programmable gate array for reconfigurable digital logic. It contains 89,178 logic elements and 6,839,296 bits of embedded memory and provides 452 user I/O. According to the supplied Mouser and DigiKey records, the component uses a 1152-BBGA, FCBGA package. An FPGA is a programmable logic IC whose logic and interconnections can be configured after manufacturing.
How many logic elements does EP2AGX95EF35C6G have?
EP2AGX95EF35C6G contains 89,178 logic elements. That verified resource count places the device above many smaller programmable-logic devices and supports combinational logic, registers, control functions, and parallel processing. The figure is taken from the exact EP2AGX95EF35C6G distributor record supplied for this product; designers should still check utilization, timing, and power in the target configuration before final selection.
How much embedded memory is in EP2AGX95EF35C6G?
EP2AGX95EF35C6G includes 6,839,296 bits of embedded memory. That capacity can support FIFOs, packet or data buffers, lookup tables, waveform storage, and other on-chip storage functions. The value is reported in the verified DigiKey snippet for the exact MPN. Effective usable depth and width depend on how the FPGA memory blocks are configured, so the final design must use the selected configuration and timing constraints.
How many user I/O does EP2AGX95EF35C6G provide?
EP2AGX95EF35C6G provides 452 user I/O according to the verified distributor data. This interface count makes the FPGA relevant for designs that connect processors, memory devices, converters, communications interfaces, and board-level control signals. The 452-I/O figure is a package and device-resource specification, not a guarantee that all pins can operate simultaneously at one unverified data rate.
What package does EP2AGX95EF35C6G use?
EP2AGX95EF35C6G uses a 1152-ball FCBGA package, described in the distributor record as 1152-BBGA, FCBGA. The exact package drawing must control pad diameters, ball pitch, solder-mask geometry, via construction, and escape routing. The supplied verified data does not provide dimensions or pitch, so those values are not guessed here; engineers should use the official package specification before PCB fabrication.
Where to download the EP2AGX95EF35C6G datasheet PDF?
The exact EP2AGX95EF35C6G datasheet should be downloaded from the manufacturer’s official support documentation or obtained through the linked authorized-distributor product page. The supplied records confirm the device family, resource counts, package, and ordering MPN, but they do not provide a manufacturer datasheet URL or document number. Do not rely on an unverified suffix interpretation when electrical limits, pin assignments, and timing data are required.
Where can I find the EP2AGX95EF35C6G pinout and ball map?
The pinout and ball map for EP2AGX95EF35C6G should be taken from the official Arria II GX package documentation associated with the 1152-ball FCBGA. The supplied distributor snippet does not expose individual ball assignments, and a 1152-ball device cannot be safely represented by a shortened pin list. Use the manufacturer package drawing and symbol together, then cross-check the exact MPN and package code before schematic or PCB release.
Is EP2AGX95EF35C6G in stock?
EP2AGX95EF35C6G availability is not confirmed by a usable inventory quantity or lead-time value in the supplied data. DigiKey search results state β€œBuy now, ships today,” while other distributor pages only identify the product and pricing information. Treat stock as order-dependent, request a current quotation, and confirm manufacturing status and delivery terms directly with the distributor before scheduling production.
What is the price of EP2AGX95EF35C6G?
A dependable current price for EP2AGX95EF35C6G cannot be stated from the supplied records because no price value or quantity-tier table is provided. Mouser and DigiKey pages may expose live pricing when opened, but distributor availability and breaks can change. Request a quote as of 2026-09-08 for quantities of 1, 10, 100, 500, and 1,000 pieces, including any minimum-order and lead-time conditions.
What is the lead time for EP2AGX95EF35C6G?
The lead time for EP2AGX95EF35C6G is not provided as a verified numeric value. The available distributor snippets identify the FPGA and one DigiKey result says it ships today, but that statement does not establish a stable lead time for every order quantity. For procurement, confirm current stock, factory lead time, cancellation terms, and date-code requirements directly with an authorized distributor on 2026-09-08.
What is the best drop-in replacement for EP2AGX95EF35C6G?
No drop-in replacement for EP2AGX95EF35C6G can be recommended from the supplied cross-reference data because no candidate has verified same-package and pin-to-pin compatibility. The only same-device records repeat EP2AGX95EF35C6G, and generic cross-reference search pages do not establish a replacement. Do not substitute a merely similar FPGA; require an exact 1152-ball footprint, compatible ball map, supported configuration, and validated electrical and timing characteristics.
Is EP2AGX95EF35C6G the same as EP2AGX95EF35C6?
EP2AGX95EF35C6G and EP2AGX95EF35C6 are distinct ordering codes even though both appear in the site’s MPN list. The supplied data confirms the exact EP2AGX95EF35C6G record and its 1152-BBGA, FCBGA package, but it does not provide a compatibility statement for the non-G variant. Treat the suffix difference as potentially significant and verify the official ordering table, package code, temperature grade, and device configuration before considering interchangeability.
EP2AGX95EF35C6G vs EP2AGX95EF35C5Gβ€”which is better for a new design?
EP2AGX95EF35C6G and EP2AGX95EF35C5G cannot be compared responsibly from the supplied data because only the C6G record has verified resource and package figures. The C5G suffix is not enough evidence of speed, temperature, voltage, or pin compatibility. Use the manufacturer’s ordering information and timing documentation to determine which grade meets the target design; do not select either device solely from its MPN pattern.
What Intel or Altera equivalent is cross-brand drop-in compatible with EP2AGX95EF35C6G?
No cross-brand drop-in equivalent is established by the supplied verified data. The target is a high-pin-count 1152-ball Arria II GX FPGA, and the cross-reference results do not identify a different manufacturer with an identical ball map, package, and electrical characteristics. A same-package FPGA from another family may require a PCB redesign and timing closure; therefore no such part is presented here as a drop-in replacement.
When should I choose EP2AGX95EF35C6G for an industrial design?
Choose EP2AGX95EF35C6G when a design needs the verified combination of 89,178 logic elements, 6,839,296 embedded memory bits, and 452 user I/O in a 1152-ball FCBGA package. It is a strong candidate for industrial control, communications, imaging, and test equipment after timing, power, temperature, and footprint validation. The supplied data does not confirm an industrial temperature rating, so obtain that rating from the official ordering documentation before selection.
Can EP2AGX95EF35C6G support communications and video processing?
EP2AGX95EF35C6G can be considered for communications and video processing because it provides 89,178 logic elements, 6,839,296 embedded memory bits, and 452 user I/O. Those resources support parallel datapaths, buffering, protocol logic, and interface aggregation. The supplied data does not verify transceiver count, data rate, DSP blocks, or maximum clock frequency, so those capabilities must be confirmed in the manufacturer documentation and design simulation before commitment.
What should I check before designing EP2AGX95EF35C6G into a PCB?
Before designing EP2AGX95EF35C6G, verify the official 1152-ball ball map, package dimensions, ball pitch, recommended land pattern, power rails, decoupling network, configuration interface, and supported I/O standards. Confirm core voltage, operating temperature, clock limits, and transceiver capability because they are absent from the supplied verified data. Use manufacturer reference designs and the final FPGA configuration to perform timing, power, thermal, and signal-integrity closure.

Engineering reference data for EP2AGX95EF35C6G β€” comparison, design guidance, and compliance information.

Selection Guide

Choose EP2AGX95EF35C6G when the design requires the verified Arria II GX resource set of 89,178 logic elements, 6,839,296 embedded memory bits, and 452 user I/O in a 1152-ball FCBGA package. It is appropriate for industrial control, communications, imaging, test, and embedded aggregation after official timing, power, temperature, and pinout validation. Prefer the exact C6G ordering code for a new design when the manufacturer’s ordering guide confirms all system requirements. The listed same-family alternatives are not established drop-in replacements because the supplied cross-reference data does not verify suffix-level electrical and pin compatibility. A different BGA device should be considered only after confirming package, ball map, configuration, timing, power, and software support.

Comparison with Alternatives

Parameter This Product EP2AGX95EF35C6 EP2AGX95EF35C5G EP2AGX95EF35C4G EP2AGX95EF29I6N EP2AGX95EF29C6G
Brand Intel Intel Intel Intel Intel Intel
Package 1152-BBGA, FCBGA 1152-BBGA, FCBGA 1152-BBGA, FCBGA 1152-BBGA, FCBGA 1152-BBGA, FCBGA 1152-BBGA, FCBGA
Ordering Suffix C6G C6 C5G C4G I6N C6G
Verified Drop-In Status Target MPN Candidate only; compatibility not explicitly verified Candidate only; compatibility not explicitly verified Candidate only; compatibility not explicitly verified Candidate only; compatibility not explicitly verified Candidate only; compatibility not explicitly verified

Key Differentiators

  • Verified Arria II GX resource combination (vs EP2AGX95EF35C5G)
  • Exact 1152-ball package identity (vs EP2AGX95EF29I6N)
  • Explicit target ordering code and resource data (vs EP2AGX95EF35C4G)

Design Notes

Use the official EP2AGX95EF35C6G package drawing rather than a generic BGA footprint. The verified record confirms a 1152-ball FCBGA, but does not state ball pitch, body dimensions, pad diameter, or escape rules. Confirm land pattern, solder-mask definition, via-in-pad policy, and layer stack-up with the manufacturer’s reference design. BGA escape routing and via construction should be reviewed for manufacturability before Gerber release.

The supplied data confirms 89,178 logic elements, 6,839,296 embedded memory bits, and 452 user I/O, but does not provide core voltage, rail current, or power dissipation. Do not calculate a power budget from the generic Arria II GX family name. Obtain the exact voltage and current limits, define rail sequencing, and validate decoupling against the official reference design and selected FPGA configuration.

The 452 user I/O make controlled-impedance routing, return-path continuity, and clock-distribution planning important. The supplied record does not confirm maximum clock frequency, supported I/O standards, transceiver count, or data rate. Use the manufacturer’s I/O and timing documentation to select termination, establish layer transitions, and constrain the FPGA design. Measure or simulate the final channels when routing sensitive clocks or high-speed data.

Do not treat another EP2AGX95 ordering code as drop-in compatible solely because it is listed in the site MPN catalog. C6G, C6, C5G, C4G, EF29, and related suffixes can represent distinct package, grade, or configuration information. The supplied data does not provide a pin-compatibility table or a manufacturer cross-reference statement. Verify the official ordering guide, ball map, device ID, voltage, temperature, and configuration requirements before substitution.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

No verified RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 statements are present in the supplied data. Do not assume compliance status.

Related Searches

EP2AGX95EF35C6G datasheet EP2AGX95EF35C6G FPGA specifications EP2AGX95EF35C6G 89,178 logic elements EP2AGX95EF35C6G 1152-ball FCBGA Arria II GX FPGA industrial control EP2AGX95EF35C6G communications processing EP2AGX95EF35C6G vs EP2AGX95EF35C5G drop-in replacement for EP2AGX95EF35C6G buy EP2AGX95EF35C6G FPGA EP2AGX95EF35C6G price and stock What is EP2AGX95EF35C6G used for? EP2AGX95EF35C6G pinout ball map EP2AGX95EF35C6G equivalent FPGA 1152-ball Intel FPGA BGA design FPGA with 452 user I/O Arria II GX

Related Components & Terms

Intel Altera EP2AGX95EF35C6G EP2AGX95EF35C6 EP2AGX95EF35C5G EP2AGX95EF35C4G Arria II GX Field Programmable Gate Array FPGA programmable logic IC integrated circuit logic elements embedded memory user I/O 1152-ball FCBGA BGA package family fine-pitch ball grid array industrial automation communications infrastructure video processing test and measurement power integrity signal integrity RoHS REACH
Quick Quote RFQ
Fill in complete details β€” our sales team will respond within 24 hours
Part Number Manufacturer Package QTY Target Price Extended
Total: $0.00 USD
βœ“
Quote submitted!

We will respond to your email within 24 hours

1
RFQ Submitted
2
Quote Received
3
Order Placed
4
Payment
5
Shipped
6
Delivered
View RFQ Details