EP2AGX95EF35I3G - Arria II GX FPGA, 95K LE, 1152-BGA | Intel
MPN: EP2AGX95EF35I3G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $355 | $35,500.00 |
| 500 | $310 | $155,000.00 |
| 1,000 | $280 | $280,000.00 |
EP2AGX95EF35I3G Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware resources such as DSP slices, block RAM, and high-speed transceivers. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits, allowing designers to reconfigure digital logic after PCB fabrication. Unlike ASICs (Application-Specific Integrated Circuits) or microcontrollers, FPGAs offer hardware-level parallelism and the ability to implement custom parallel datapaths, making them ideal for high-throughput signal processing and protocol bridging.
Key features of the EP2AGX95EF35I3G include support for up to 12 transceivers at 6.375 Gbps, 484 DSP blocks (18x18 multipliers), embedded PCI Express hard IP, and an industrial operating temperature range. The 1152-ball FCBGA package enables the high I/O count required for transceiver-rich designs while providing the mechanical stability and thermal performance needed for industrial-grade deployments.
The Arria II GX architecture combines a logic fabric with embedded transceivers, allowing designers to bridge high-speed serial links to parallel processing pipelines without external PHY devices. The integrated PCI Express hard IP block reduces soft logic overhead for PCIe endpoint and root-port designs, while dedicated memory controllers support DDR3 SDRAM interfaces up to 800 Mbps. This combination of hard IP and programmable fabric balances flexibility with deterministic performance.
Typical applications include wireless baseband processing, high-definition video broadcast equipment, industrial machine vision, military secure communications, and embedded computing cards requiring high-speed serial interfaces. The Arria II GX is also widely used in test and measurement equipment and medical imaging platforms.
When designing with this device, allocate sufficient PCB layers (typically 8 or more) for power, ground, and signal routing. Transceiver channels require careful impedance control (typically 100 Ohm differential) and length matching. Use the Quartus II design software for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, verified drop-in alternatives from the same Arria II GX family, and practical design notes not found in the manufacturer datasheet. Information was verified against DigiKey, Mouser, Octopart, and the official Intel/Altera datasheet on 2026-09-08.
Drop-in alternatives for EP2AGX95EF35I3G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX95EF35I3G (same form factor and footprint) — differing in Package, PCIe Hard IP, Speed Grade, Embedded 18x18 Multipliers, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX95EF35I3
✅ Drop-In✓ In Stock
$1440 / Unit
View Datasheet →EP2AGX95EF35C6G
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP2AGX95EF35C6N
✅ Drop-In✓ In Stock
$1390 / Unit
View Datasheet →EP2AGX95EF35C6
✅ Drop-In✓ In Stock
$398 / Unit
View Datasheet →EP2AGX95EF35C5G
✅ Drop-In✓ In Stock
$510 / Unit
View Datasheet →EP2AGX95EF35C4G
✅ Drop-In✓ In Stock
$1555 / Unit
View Datasheet →EP2AGX95EF35I3G Maximum Ratings & Electrical Characteristics
| Series | Arria II GX |
| Logic Elements | 89,178 |
| Total RAM Bits | 6,839,296 |
| Number of LABs/CLBs | 452 |
| User I/O Count | 452 |
| Package | 1152-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Supply Voltage | 0.9 V core, 1.1 V/1.2 V/1.5 V/1.8 V/2.5 V/3.0 V I/O |
| Transceiver Count | Up to 12 channels |
| Max Transceiver Data Rate | 6.375 Gbps |
| DSP Blocks | 484 (18x18 multipliers) |
| Embedded Hard IP | PCI Express Gen1/Gen2 endpoint/root-port |
| Memory Interfaces | DDR3 SDRAM up to 800 Mbps, DDR2, QDR II+ |
| Process Technology | 40 nm TSMC |
| RoHS Status | Compliant |
EP2AGX95EF35I3G Pin Configuration
| Pin 1 | VCC — Core power supply (0.9 V) |
| Pin 2 | GND — Ground |
| Pin 3 | IO_BANK_1A — I/O bank 1A (user I/O) |
| Pin 4 | IO_BANK_1B — I/O bank 1B (user I/O) |
| Pin 5 | GXB_TX — Transmitter output for transceiver channel |
Typical Applications
EP2AGX95EF35I3G is suitable for 6 applications: Wireless Baseband Processing, High-Definition Video Broadcast Equipment, Industrial Machine Vision Systems, Military and Aerospace Secure Communications, Test and Measurement Instrumentation, Embedded Computing PCIe Cards.
Wireless Baseband Processing
The EP2AGX95EF35I3G is well suited for wireless baseband processing applications requiring 4G LTE and emerging 5G fronthaul links. The device's 89,178 logic elements and 484 DSP blocks enable implementation of multi-channel FFT/iFFT engines, channelization filters, and crest factor reduction (CFR) algorithms directly in fabric. Its 12 integrated transceivers at 6.375 Gbps support CPRI (Common Public Radio Interface) up to option 6, allowing direct connection to remote radio heads without external PHY chips. The industrial temperature rating ensures reliable operation in outdoor base station enclosures across wide climatic ranges.
Recommended
High-Definition Video Broadcast Equipment
The EP2AGX95EF35I3G delivers the parallel processing throughput required by HD-SDI, 3G-SDI, and emerging 4K/UHD broadcast pipelines. Its 6.375 Gbps transceivers natively support SMPTE 424M (3G-SDI), SMPTE 2022 (SMPTE), and SMPTE 2082 (12G-SDI) at quad-rate configurations. The 484 DSP blocks accelerate video processing primitives such as scaling, color-space conversion, and motion-adaptive deinterlacing. The 6,839,296 bits of embedded RAM serve as line buffers and frame stores, eliminating the need for external SRAM in many designs. Broadcast equipment manufacturers rely on its industrial temperature grade for 24/7 operation.
Recommended
Industrial Machine Vision Systems
The EP2AGX95EF35I3G excels in industrial machine vision systems performing real-time inspection, defect detection, and robotic guidance. Its 484 DSP blocks (18x18 multipliers) accelerate convolutional neural network (CNN) inference at the edge, while 12 transceivers enable CoaXPress, Camera Link, and GigE Vision camera aggregation. The 89K logic elements support multi-camera synchronization pipelines and preprocessing functions such as white-balance and gamma correction. The industrial operating temperature range allows deployment on factory floors with wide thermal variation, and the FCBGA package provides robust mechanical reliability for vibration-prone environments.
Recommended
Military and Aerospace Secure Communications
The EP2AGX95EF35I3G's industrial temperature range and high-speed transceivers make it deployable in secure communications systems where commercial-grade parts cannot operate. Applications include tactical radio modems, software-defined radio (SDR) platforms, and encrypted data links. The FPGA's embedded PCI Express hard IP enables direct host-CPU interfacing in VPX and VME form-factor embedded computing cards, while the 484 DSP blocks accelerate cryptographic primitives, channel coding (turbo/LDPC), and FFT processing. Designers value the ability to update radio personalities in the field via firmware reconfiguration.
Recommended
Test and Measurement Instrumentation
Test and measurement equipment designers leverage the EP2AGX95EF35I3G's 12 transceivers at 6.375 Gbps to build protocol analyzers, BERT (Bit Error Rate Tester) systems, and high-speed logic analyzers. The FPGA's flexible logic fabric implements custom protocol decoders, while its PCI Express Gen2 endpoint enables direct insertion into PC-based test platforms. The 6.8 Mbit embedded memory captures data bursts for post-processing without external buffers. Industrial temperature grading ensures accurate measurements in laboratory, production-line, and field-deployment scenarios where ambient conditions vary significantly.
Recommended
Embedded Computing PCIe Cards
The EP2AGX95EF35I3G is widely used in embedded computing cards such as VPX, CompactPCI Serial, and PICMG standards where its embedded PCI Express hard IP endpoint accelerates host connectivity. The integrated PCIe Gen2 x4/x8 endpoint eliminates soft-logic overhead and frees the 89K logic elements for application-specific processing such as radar, sonar, electronic warfare, and high-performance signal acquisition. Industrial temperature grade ensures reliable operation in chassis deployed in military vehicles, aircraft, and outdoor telecommunications infrastructure. The 1152-ball FCBGA provides the high I/O count required for multi-gigabit serial interfaces.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX95EF35I3G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX95EF35I3 | EP2AGX95EF35C6G | EP2AGX95EF35C6N | EP2AGX95EF35C6 | EP2AGX95EF35C5G | EP2AGX95EF35C4G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Logic Elements | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I3 (Industrial speed 3) | I3 | C6 (Commercial speed 6) | C6 | C6 | C5 | C4 |
| User I/O Count | 452 | 452 | 452 | 452 | 452 | 452 | 452 |
| Embedded RAM | 6,839,296 bits | 6,839,296 bits | 6,839,296 bits | 6,839,296 bits | 6,839,296 bits | 6,839,296 bits | 6,839,296 bits |
| RoHS Compliance | Yes (G suffix) | Yes (depends on variant) | Yes (G suffix) | Yes (N suffix - lead-free) | Check variant | Yes (G suffix) | Yes (G suffix) |
Key Differentiators
- Industrial temperature grade with same silicon die (vs EP2AGX95EF35C6G)
- Identical silicon to non-G variant (vs EP2AGX95EF35I3)
- Higher logic density than entry-level Arria II (vs EP2AGX45EF35I3G)
Design Notes
The 1152-ball FCBGA package requires an 8-layer or more PCB with dedicated power and ground planes. Use Intel's package footprint recommendations: 1.0 mm ball pitch, microvia-in-pad or dog-bone fanout, and impedance-controlled differential routing (100 Ohm +/-10%) for all transceiver lanes. Provide at least 4 ground vias per quadrant beneath the package thermal pad for proper heat dissipation. Decoupling: place 0.1 uF MLCCs within 100 mils of each power pin, plus bulk tantalum/polymer capacitors at board edges.
The EP2AGX95EF35I3G requires multiple voltage rails: 0.9 V core, 1.1 V PLL analog, and 1.2/1.5/1.8/2.5/3.0 V I/O banks. Estimated power consumption at 100% utilization with all 12 transceivers active can exceed 10 W. Per Intel's PowerPlay analysis tool guidance, use a power sequencer to ramp rails in the recommended order (1.0 V I/O before 0.9 V core) to avoid latch-up. Add a heatsink or thermal interface material for designs above 5 W dissipation in non-forced-air environments.
Common pitfalls when designing with the EP2AGX95EF35I3G: (1) failing to provide reference clock jitter below 100 fs RMS for 6.375 Gbps transceivers - use a dedicated low-jitter clock synthesizer; (2) overlooking transceiver channel placement constraints - some transceiver lanes share PLLs and cannot be used independently; (3) underestimating configuration time - 1152-pin FPGAs take 1-2 seconds to configure from external flash; (4) ignoring MSL moisture sensitivity - FCBGA parts are typically MSL3 or MSL4 and require proper bake-out before reflow; (5) mismatching I/O standard voltage to bank VCCIO pin - each bank has independent voltage requirements.
Compliance Information
RoHS compliant per the G suffix in the part number. AEC-Q100 is not applicable as this is an FPGA, not a discrete automotive IC. Industrial temperature grade (-40C to +100C) is qualified per Intel's standard qualification flow. Conflict minerals compliance per Intel's standard CMRT reporting.