EP2SGX90FF1508I5 - Stratix II GX FPGA, 90.96k LEs, 622 MHz | Intel
MPN: EP2SGX90FF1508I5 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1695 | $16,950.00 |
| 100 | $1525 | $152,500.00 |
| 500 | $1380 | $690,000.00 |
| 1,000 | $1245 | $1,245,000.00 |
EP2SGX90FF1508I5 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured after manufacturing to implement arbitrary digital circuits. Stratix II GX FPGAs sit in the high-performance tier of the FPGA taxonomy: FPGA > SRAM-based FPGA > high-speed-transceiver FPGA > Stratix II GX family > power-management/system-on-chip-class devices, and they combine a logic fabric with embedded SERDES, memory blocks, DSP blocks, and PLLs. This places EP2SGX90FF1508I5 between discrete logic + PHY ICs and full SoC platforms.
Key features include up to 6.375 Gbps embedded transceivers with clock and data recovery (CRU), source-synchronous I/O for parallel high-speed interfaces, 4 to 20 transceiver channels depending on variant, dedicated on-chip memory (M512/M4K/M-RAM blocks), and embedded DSP blocks for high-throughput signal processing. The 1508-ball FineLine BGA package supports hundreds of user I/O pins with multiple I/O standards (LVDS, LVCMOS, HSTL, SSTL, PCI Express). Together these enable designers to consolidate what previously required an FPGA + separate PHY + external memory into a single device.
Architecturally, Stratix II GX uses a 90 nm process, an adaptive logic module (ALM) fabric, and dedicated transceiver hard IPs. Designers typically target the device with the Quartus II design software, leveraging IP cores for PCI Express, XAUI, Serial RapidIO, and DDR/DDR2 memory controllers. Compared to a discrete SERDES + FPGA solution, the integrated architecture reduces board complexity, BOM count, and signal-integrity risk on high-speed serial channels.
Typical applications include high-end communications line cards (10 Gbps optical transport, SONET/SDH framer, ATCA/AMC backplanes), PCI Express Gen1 endpoint/root complex designs, broadcast video processing (HD-SDI/3G-SDI routing and conversion), test and measurement instrumentation with high-speed digitizers, and radar / signal-intelligence front ends. The combination of logic density and 6.375 Gbps transceivers is especially well-suited to protocols that need both packet processing and bulk serial bandwidth.
When designing with EP2SGX90FF1508I5, plan power-rail decoupling carefully: separate 1.2 V core, 2.5 V/3.3 V PLL analog, and I/O voltage supplies must each be filtered with low-ESR bulk + ceramic capacitors placed close to the BGA balls. Transceiver channels require controlled-impedance (typically 100 Ω differential) routing with length matching within the SerDes tolerance budget. Thermal management of the FineLine BGA is dominated by the center-row ball array - a multi-layer PCB with stitched ground vias and a heatsink is recommended for typical 8-15 W dissipation.
This page synthesizes distributor availability, drop-in same-package alternatives, and practical layout guidance not all found in the manufacturer datasheet alone, giving procurement and design engineers a single decision-ready reference.
Drop-in alternatives for EP2SGX90FF1508I5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90FF1508I5 (same form factor and footprint) — differing in Package, Configuration Method, RoHS Status, Speed Grade, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX90FF1508I4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2210 / Unit
View Datasheet →EP2SGX90FF1508C5
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1350 / Unit
View Datasheet →EP2SGX90FF1508I4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$810 / Unit
View Datasheet →EP2SGX90FF1508C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1380 / Unit
View Datasheet →EP2SGX130GF1508I5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$372 / Unit
View Datasheet →EP2SGX90EF1508
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1750 / Unit
View Datasheet →EP2SGX90FF1508I5 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 90,960 |
| Total Logic Cells | 90,960 |
| CLBs (Configurable Logic Blocks) | 90,960 |
| Maximum User I/O Pins | 650 (for FF1508 package) |
| Maximum Clock Frequency | 622.08 MHz |
| Transceiver Channels | 4 to 20 (variant-dependent) |
| Max Transceiver Data Rate | 6.375 Gbps |
| Nominal Core Supply Voltage | 1.2 V |
| Operating Temperature Range | -40 °C to +85 °C (Industrial) |
| Temperature Grade Suffix | I5 (Industrial) |
| Package | 1508-ball FineLine BGA (FF1508), 40 mm |
| Package Code | BGA |
| Terminal Form | Ball |
| Number of Terminals | 1508 |
| Process Technology | 90 nm CMOS |
| Mounting Type | Surface Mount |
EP2SGX90FF1508I5 bga Pin Configuration Guide
Pin configuration for EP2SGX90FF1508I5 (bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90FF1508I5.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90FF1508I5 is suitable for 6 applications: 10 Gbps Optical Transport / SONET-SDH Framer, PCI Express Endpoint / Root Complex, Broadcast Video Routing (HD-SDI / 3G-SDI), Test & Measurement Instrumentation, Radar / Signal-Intelligence Front End, Industrial ATCA / AMC Backplane Aggregation.
10 Gbps Optical Transport / SONET-SDH Framer
The EP2SGX90FF1508I5 fits 10 Gbps optical transport because its 6.375 Gbps embedded SERDES, combined with up to 20 transceiver channels, can drive SFP+ optics directly and aggregate multiple lower-speed clients into OC-192/STM-64 frames. Its 90,960 logic elements are sufficient for an OC-192 mapper, FEC encoder (Reed-Solomon or BCH), and overhead processor on a single die, replacing what previously required an FPGA + external PHY + framing chip. Placed between the line-side optics and the backplane SERDES, the part provides deterministic low-latency transport (<100 ns typical pipeline latency) without the jitter penalty of a discrete SERDES pair. This integration cuts board area and simplifies jitter budgeting, which is critical in long-haul and metro Ethernet deployments.
Recommended
PCI Express Endpoint / Root Complex
The EP2SGX90FF1508I5 is a strong PCI Express Gen1 (2.5 Gbps) endpoint / root complex candidate because each embedded transceiver natively supports the PCIe physical layer through the hard IP, eliminating a separate PHY IC. The 90,960 logic elements plus dedicated on-chip memory (M-RAM, M4K, M512) comfortably absorb the PCIe transaction layer, data link layer, and a DMA engine. When used as a PCIe root complex on an ATCA/AMC carrier card, designers benefit from deterministic latency and known-good SERDES performance tuned by the Quartus II PCIe compiler. Compared with FPGA + external PHY solutions, the integrated PCIe core reduces BOM, validation effort, and PCB layer count by 2-4 layers.
Recommended
Broadcast Video Routing (HD-SDI / 3G-SDI)
Broadcast video routers benefit from the EP2SGX90FF1508I5 because the 6.375 Gbps transceivers natively carry SMPTE 424M (3G-SDI) at 2.97 Gbps, while the abundant logic implements the SMPTE 259M/292M/424M crosspoint switch fabric, ancillary data processing, and audio embedding/de-embedding. A single device can replace a multi-chip crosspoint solution, supporting 64x64 or larger 3G-SDI matrices while embedding audio and metadata. Placed between the BNC connector block (with cable equalizers) and the output reclockers, the FPGA provides frame-accurate switching with sub-frame deterministic latency. Designers should note that 3G-SDI jitter budgets require careful PCB stack-up and 75 Ω controlled impedance on the BNC side.
Recommended
Test & Measurement Instrumentation
Test and measurement instruments such as high-speed digitizers, logic analyzers, and protocol analyzers use the EP2SGX90FF1508I5 because its transceivers capture multi-Gbps serial data streams while the 90,960 logic elements implement deep acquisition memory, triggering, and real-time protocol decoding. The device's 622 MHz fabric clock supports dense state-machine decoding of PCIe, SATA, XAUI, and Serial RapidIO traffic in a single FPGA. Placed between the probe front-end and the host interface (PCIe or USB 3.0), the FPGA buffers up to several megabytes of trace data on-chip before DMA to host memory, minimizing blind time between captures. Compared to discrete ASIC + FPGA designs, this integration reduces instrument cost and enables faster product refresh cycles.
Recommended
Radar / Signal-Intelligence Front End
Defense and commercial radar front ends exploit the EP2SGX90FF1508I5 for high-throughput digital beamforming, pulse compression, and Doppler processing, because the embedded SERDES stream digitized IF data directly into the FPGA while the 90,960 LEs plus DSP blocks implement FFT and channelization in real time. Industrial temperature grade (-40 to +85 °C) supports outdoor and shipborne installations where commercial-grade FPGAs would violate environmental specifications. Placed between the A/D converter array and the backplane Ethernet fabric, the FPGA performs real-time pulse compression with sub-microsecond latency, eliminating a separate beamformer ASIC. Designers must allocate 2-3 W per transceiver channel to total dissipation budgeting and use a thermal-enhanced PCB stack-up.
Recommended
Industrial ATCA / AMC Backplane Aggregation
ATCA and AMC carrier cards aggregate multiple fabric channels (10G-KR, 10G-XAUI, PCI Express) on the EP2SGX90FF1508I5 because its multi-protocol SERDES, large logic capacity, and 650 user I/Os handle several fabric interfaces and switching fabrics on a single device. Industrial temperature grade supports the ATCA thermal envelope and PICMG 3.x specification, while the 1508-ball BGA exposes enough I/O for dual-star or dual-dual-star topologies. Placed between the backplane connectors and the payload mezzanine, the FPGA implements switching, clock distribution, and intelligent platform management. Compared to multi-FPGA aggregation designs, the single EP2SGX90 reduces backplane trace lengths, simplifying signal-integrity compliance.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90FF1508I5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90FF1508I4 | EP2SGX90FF1508C5 | EP2SGX90FF1508I4N | EP2SGX90FF1508C5N | EP2SGX130GF1508I5 | EP2SGX90EF1508 |
|---|---|---|---|---|---|---|---|
| Package | 1508-ball FineLine BGA (FF1508, 40 mm) | 1508-ball FineLine BGA (FF1508, 40 mm) - same | 1508-ball FineLine BGA (FF1508, 40 mm) - same | 1508-ball FineLine BGA (FF1508, 40 mm) - same | 1508-ball FineLine BGA (FF1508, 40 mm) - same | 1508-ball FineLine BGA (GF1508, 40 mm) - same family | 1508-ball FineLine BGA (EF1508, 40 mm) - same family |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 90,960 | 90,960 (identical) | 90,960 (identical) | 90,960 (identical) | 90,960 (identical) | 132,960 (+46%) | 90,960 (identical) |
| Speed / Temperature Grade | I5 (Industrial, -40 to +85 °C, fastest speed bin) | I4 (Industrial, -40 to +85 °C, slower speed bin) | C5 (Commercial, 0 to +85 °C, fastest speed bin) | I4 (Industrial, slower speed bin, lead-free) | C5 (Commercial, fastest speed bin, lead-free) | I5 (Industrial, fastest speed bin) | Enhanced config variant (temperature bin varies) |
| Embedded SERDES | Yes (6.375 Gbps, 4-20 channels) | Yes (identical) | Yes (identical) | Yes (identical) | Yes (identical) | Yes (6.375 Gbps, more channels) | Yes (identical) |
| Nominal Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Max User I/O Pins | 650 (for FF1508) | 650 | 650 | 650 | 650 | 650 | 650 |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
| RoHS / Lead-Free | Verify per date code (legacy Altera, may require N-suffix variant) | Verify per date code | Verify per date code | Yes (N suffix = lead-free RoHS) | Yes (N suffix = lead-free RoHS) | Verify per date code | Verify per date code |
Key Differentiators
- Embedded 6.375 Gbps SERDES on the silicon die (vs EP2S90F1508I5 (Stratix II non-GX))
- Industrial temperature grade (-40 to +85 °C) with fastest speed bin (vs EP2SGX90FF1508C5 (commercial grade))
- 90,960 logic elements with 650 user I/O on a single 1508-ball BGA (vs EP2SGX60FF1152 (lower-density variant))
Design Notes
Estimated: the EP2SGX90FF1508I5 requires four separate power rails - 1.2 V VCCINT (core), 2.5 V or 3.3 V VCCPD (pre-drive), 3.3 V VCCIO (I/O banks), and 1.2 V/2.5 V VCCA_PLL (PLL analog). Decoupling must use 4.7 uF bulk + 0.1 uF + 1 nF ceramics placed within 5 mm of each BGA ball group; total core current can exceed 8 A under heavy SERDES activity, requiring at least 4 power planes in the PCB stack-up.
Transceiver channels need 100 Ω differential controlled impedance with intra-pair length matching within 150 um and inter-pair within 1.5 mm; the 1508-ball FineLine BGA escape routing requires microvia-in-pad (stacked vias on 0.8 mm pitch) and a minimum 6-layer stack-up. Pin 1 indicator is the beveled corner of the BGA substrate - match it to the package diagram in the Stratix II GX handbook before layout finalization.
Estimated: with 4-20 active SERDES channels at 6.375 Gbps plus heavy logic utilization, total device power can exceed 10 W; the FineLine BGA has theta_JA around 8-10 C/W with a properly heatsinked thermal pad, so a 1 square-inch copper spreader plus a low-profile heatsink is recommended to keep junction below 100 °C at 85 °C ambient.
Do not mix I5 (industrial) and C5 (commercial) speed bins in a temperature-critical design; the C5 part is only specified to 0 °C minimum and will fail at industrial cold-start conditions. Also avoid leaving unused SERDES channels floating - each unused TX pair must be AC-coupled to ground per the Stratix II GX handbook to prevent reflection damage to the output driver.
Use the Quartus II pin planner with I/O assignment rules to pre-place SERDES channels on the BGA ball map before PCB layout begins - moving SERDES assignments after PCB layout is impossible without re-spinning the board. Validate transmit pre-emphasis and receive equalization settings with the BitCaster or high-end oscilloscope during prototype bring-up, as channel loss varies significantly with PCB stack-up choice.
Compliance Information
Compliance status depends on date code; the N-suffix variants (e.g., EP2SGX90FF1508I4N) are explicitly lead-free / RoHS-compliant per legacy Altera part-number conventions. AEC-Q100 is not applicable because this is an FPGA, not an automotive-grade IC. Verify each shipment's RoHS/REACH certificates with the distributor before placing production orders.
