EP2SGX30DF780C3 - 33880 Logic Cells Stratix II GX FPGA | Altera
MPN: EP2SGX30DF780C3 β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $997.48 | $997.48 |
| 10 | $947.61 | $9,476.10 |
| 100 | $897.73 | $89,773.00 |
| 500 | $847.86 | $423,930.00 |
| 1,000 | $797.98 | $797,980.00 |
EP2SGX30DF780C3 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs belong to the broader hierarchy of programmable logic devices (PLD) -> programmable logic -> logic IC -> integrated circuit. The Stratix II GX family is positioned above Stratix II and below Stratix III in Altera's high-performance transceiver-equipped lineup, targeting applications that combine parallel logic fabric with multi-gigabit serial I/O.
Key features include 33,880 logic elements, 1694 LABs, 1.37 Mbits of embedded memory, embedded 3.125 Gbps transceivers, dedicated DSP blocks, a robust PLLs/distributed clock tree, and 361 user I/Os. The 1.2V core operates across a commercial junction temperature range of 0C to +85C as the C3 speed grade. The 'C3' suffix indicates a specific speed bin and a commercial temperature grade per the Stratix II GX nomenclature.
The architecture combines a 90nm low-k metal process with ALM-style adaptive logic modules and dedicated multiplier/accumulator blocks, which together deliver the high DSP throughput required by baseband, video, and packet-processing pipelines. Hard PCI Express hard IP blocks and external memory interfaces further accelerate system integration.
Typical applications include high-speed serial backplane switching, telecom line cards, baseband processing, military/aerospace signal processing, ASIC prototyping, and high-end industrial imaging. Choose this device when your design needs integrated multi-gigabit transceivers plus substantial parallel DSP and memory resources on a single die. When designing with this part, validate signal-integrity margins on the 1.0mm-pitch BGA and follow Altera's Stratix II GX pin connection guidelines; JTAG (IEEE 1149.1) is supported for boundary-scan test.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving procurement and FPGA engineers a single-source decision view.
Drop-in alternatives for EP2SGX30DF780C3 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX30DF780C3 (same form factor and footprint) β differing in Package, Operating Temperature, RoHS Status, Speed Grade, Transceivers.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX30CF780C3
β Drop-Inβ In Stock
$175.5 / Unit
View Datasheet βEP2SGX30CF780C3N
β Drop-Inβ In Stock
$195 / Unit
View Datasheet βEP2SGX30CF780C3NGB
β Drop-Inβ In Stock
$305 / Unit
View Datasheet βEP2SGX30CF780C4
β Drop-Inβ In Stock
$138 / Unit
View Datasheet βEP2SGX30CF780C4N
β Drop-Inβ In Stock
$379 / Unit
View Datasheet βEP2SGX30CF780C5
β Drop-Inβ In Stock
$248 / Unit
View Datasheet βEP2SGX30CF780C5N
β Drop-Inβ In Stock
$160 / Unit
View Datasheet βEP2SGX30DF780C3 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 33,880 |
| Logic Array Blocks (LABs) | 1694 |
| Total RAM Bits | 1,369,728 |
| User I/Os | 361 |
| Core Voltage | 1.2 V |
| Internal Frequency (max) | 816.9 MHz |
| Process Technology | 90 nm CMOS |
| Package | 780-BBGA, FC-FBGA (29 x 29 mm, 1.0 mm pitch) |
| Operating Temperature | 0 C to +85 C (Commercial, C3 speed grade) |
| Transceivers | Embedded multi-gigabit transceivers, up to 3.125 Gbps |
| DSP Blocks | Dedicated hard multiplier/accumulator blocks |
| Logic Family | CMOS |
| Mounting Type | Surface Mount (BGA) |
EP2SGX30DF780C3 780-bbga, fc-fbga (29 x 29 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP2SGX30DF780C3 (780-bbga, fc-fbga (29 x 29 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX30DF780C3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX30DF780C3 is suitable for 7 applications: High-Speed Serial Backplane Switching, Telecom Line Card Processing, Baseband Signal Processing, Military and Aerospace Signal Processing, ASIC Prototyping, High-End Industrial Imaging, Test and Measurement Instrumentation.
High-Speed Serial Backplane Switching
The EP2SGX30DF780C3 fits high-speed serial backplane designs because its integrated 3.125 Gbps transceivers, combined with 33,880 logic elements and 1.37 Mbits of embedded RAM, support multi-lane SERDES aggregation and on-chip packet buffering. Used as a switch-fabric port card, the device drives 8-12 transceiver lanes at line rate while the ALM-based DSP fabric handles PCS framing and rate adaptation. Trade-off: the 90nm process dissipates more power than modern 28nm/14nm FPGAs, so designers must budget adequate forced-air cooling on the chassis.
Recommended
Telecom Line Card Processing
In telecom line cards, the EP2SGX30DF780C3 provides 33,880 logic elements, dedicated DSP blocks, and embedded transceivers in a single device, enabling channelized framer, mapper, and forward-error-correction functions. The 1.37 Mbit embedded RAM supports packet queuing and elastic buffering at line rate. The 780-BBGA package delivers 361 user I/Os for SGMII/SFI backplane interconnection. Trade-off: telecom customers should plan a lifecycle roadmap to Cyclone V GX or Stratix 10 because Stratix II GX is in last-time-buy.
Recommended
Baseband Signal Processing
The EP2SGX30DF780C3's hard multiplier/accumulator DSP blocks and ALM-based fabric make it a strong fit for baseband processing such as LTE PHY, OFDM FFT/iFFT, and channel estimation. The 1694 LABs and 1.37 Mbit RAM deliver the FIR filter tap count and coefficient storage required for 20 MHz LTE downlink. Place between the ADC and the upper-MAC processor with the embedded 3.125 Gbps transceivers carrying digitized RF to the device. Trade-off: 90nm power dissipation limits density per watt versus modern 28nm Cyclone V / Stratix 10 devices.
Recommended
Military and Aerospace Signal Processing
Defense and aerospace customers value the EP2SGX30DF780C3 for radar, EW, and SIGINT applications requiring integrated multi-gigabit transceivers plus substantial parallel DSP in a single BGA package. The 780-BBGA 29x29mm footprint with 1.0mm pitch accommodates high-density PCB layouts in chassis-constrained platforms. Designers pair the device with high-speed ADCs/DACs over LVDS or LVDS-extended links. Trade-off: military/aerospace customers requiring MIL-PRF-38535 or DSCC SMD part numbers must verify against the specific VID block; industrial-grade 'I' suffix variants may be required.
Recommended
ASIC Prototyping
For ASIC prototyping, the EP2SGX30DF780C3 provides 33,880 logic elements, 1.37 Mbit embedded RAM, and 361 user I/Os on a single die - sufficient to prototype mid-complexity ASICs up to ~5-10M ASIC gates when targeting multi-FPGA partitioning. The Quartus II toolchain supports industry-standard synthesis flows, and JTAG (IEEE 1149.1) boundary-scan accelerates bring-up. Design teams pair it with other Stratix II GX devices for multi-FPGA prototyping of larger ASICs. Trade-off: very large ASIC prototypes may require multiple FPGAs plus high-pin-count interconnect.
Recommended
High-End Industrial Imaging
The EP2SGX30DF780C3 is used in high-end industrial imaging systems such as machine-vision cameras, medical imaging pre-processors, and high-speed line-scan camera interfaces. The embedded 3.125 Gbps transceivers accept CoaXPress or Camera Link HS data streams, while the ALM/DSP fabric performs Bayer demosaicing, color correction, and JPEG/H.264 compression in real time. The 780-BBGA package mounts on a 1.0mm-pitch PCB for compact camera-head electronics. Trade-off: industrial camera designers should validate sensor-to-FPGA latency budgets against the 90nm fabric timing.
Recommended
Test and Measurement Instrumentation
In test and measurement equipment such as oscilloscopes, logic analyzers, and protocol testers, the EP2SGX30DF780C3 provides 33,880 logic elements and 361 I/Os for capture memory, triggering logic, and protocol decoding. The 1.37 Mbit embedded RAM supports deep sample-buffer memory, while the integrated 3.125 Gbps transceivers enable protocol-analyzer front-ends for PCIe Gen1, SATA, and GbE. Trade-off: T&M instrument designers targeting multi-gigabit serial compliance testing should verify jitter margin against the device's transceiver specification in the datasheet.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX30DF780C3 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX30CF780C3 | EP2SGX30CF780C3N | EP2SGX30CF780C3NGB | EP2SGX30CF780C4 | EP2SGX30CF780C4N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-BBGA, FC-FBGA (29 x 29 mm, 1.0 mm pitch) | 780-BBGA, FC-FBGA (29 x 29 mm) - same | 780-BBGA, FC-FBGA (29 x 29 mm) - same | 780-BBGA, FC-FBGA (29 x 29 mm) - same | 780-BBGA, FC-FBGA (29 x 29 mm) - same | 780-BBGA, FC-FBGA (29 x 29 mm) - same |
| Logic Elements | 33,880 | 33,880 (same die) | 33,880 (same die) | 33,880 (same die) | 33,880 (same die) | 33,880 (same die) |
| Speed Grade | C3 | C3 (same) | C3 (same) | C3 (same) | C4 (slower) | C4 (slower) |
| Temperature Grade | Commercial (0 C to +85 C) | Commercial | Commercial | Commercial | Commercial | Commercial |
| Transceiver Count | Full count for F780 footprint (D variant) | Reduced (C variant) | Reduced (C variant) | Reduced (C variant) | Reduced (C variant) | Reduced (C variant) |
| Process Technology | 90 nm CMOS | 90 nm CMOS (same) | 90 nm CMOS (same) | 90 nm CMOS (same) | 90 nm CMOS (same) | 90 nm CMOS (same) |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
Key Differentiators
- Full transceiver count for the F780 footprint (vs EP2SGX30CF780C3)
- Faster C3 speed grade (vs EP2SGX30CF780C4 / CF780C5)
- Same 780-BBGA footprint as the rest of the EP2SGX30 family (vs EP2SGX30CF780C3NGB)
Design Notes
Estimated: at full transceiver utilization (8-12 lanes at 3.125 Gbps) and 50% logic utilization, the 90nm EP2SGX30DF780C3 can dissipate 8-12 W. With 0 CFM airflow on a 4-layer JEDEC test board, the device can exceed 100 C junction temperature at commercial ambient. Provide a minimum 100 LFM forced-air and a thermal pad connected to the BGA's central ground balls; for sealed enclosures, plan a heatsink and chassis thermal validation.
The 780-BBGA 29x29mm package uses a 1.0mm ball pitch - this is a fine-pitch BGA that demands laser-drilled microvias, 0.5oz copper plating in the via barrel, and via-in-pad for inner-row balls. Use the manufacturer's BGA breakout reference design and verify the PCB fab house supports 1.0mm-pitch BGA assembly with X-ray or CT inspection. Impedance-controlled traces are mandatory for all transceiver lanes; differential 100 ohm +/-10% with intra-pair skew below 1 ps.
Embedded 3.125 Gbps transceivers require controlled-impedance differential routing with continuous reference planes. Use the Altera Stratix II GX High-Speed Board Design Guidelines and run the Quartus II IBIS-AMI simulations before tape-out. For multi-gigabit backplanes, add pre-emphasis and equalization per the device's transceiver settings; budget at least 0.5 UI of eye opening at the receiver for production margin. Decouple each VCC and GND pair with 0.1 uF and 10 uF capacitors placed within 100 mil of the ball.
Do not configure an EP2SGX30DF780C3 with an old Quartus II version that lacks support for the Stratix II GX family - use Quartus II 13.0 SP1 or later. Validate the configuration scheme (Passive Serial, Fast Passive Parallel, JTAG, or Active Serial) against the EPCS or EPCQ flash device's voltage compatibility. The 1.2V core must be powered only after the 2.5V/3.3V I/O supplies reach regulation, otherwise the I/Os back-power the core through ESD clamps and latch-up can occur.
Follow the Stratix II GX pin connection guidelines: tie all unused user I/Os to a defined logic state through Quartus II settings (do not leave them floating). Use the dedicated PLL supply pins (VCCA_PLL) with their own filtered 1.2V rail derived from a ferrite bead; noisy PLL rails cause deterministic jitter on the transceiver clocks. Place the configuration flash as close as practical to the device's DCLK/DATA/nCONFIG/nSTATUS pins to minimize boot glitches.
Compliance Information
RoHS compliance not specified in the verified web data; the lead-free N-suffix variants in the same family indicate that lead-free versions exist - [DATA_NEEDED] for this specific MPN. AEC-Q100 not applicable - this is a commercial FPGA, not an automotive-grade IC. Military/aerospace customers requiring DSCC SMD part numbers must confirm with Altera/Intel field sales.
