EP4CE40F23A7N - Cyclone IV E FPGA 39.6K LE | Intel (Altera)
MPN: EP4CE40F23A7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $170.14 | $170.14 |
| 10 | $158.32 | $1,583.20 |
| 25 | $147.9 | $3,697.50 |
| 100 | $132.55 | $13,255.00 |
| 500 | $118.4 | $59,200.00 |
EP4CE40F23A7N Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, multipliers, and (in Cyclone IV E) PLLs. FPGAs sit one level above general-purpose microcontrollers in the embedded-compute hierarchy: they trade deterministic software execution for massive parallel hardware flexibility, making them the workhorse for custom datapaths, interface bridging, and signal conditioning. Cyclone IV E specifically occupies the low-power, low-cost tier of the Altera/Intel FPGA lineup, sitting below Cyclone V and Stratix families in both logic density and transceiver count.
The EP4CE40F23A7N provides up to 328 general-purpose I/O pins, 4 general-purpose PLLs, embedded multipliers (18x18), and 1161 Kb of M9K block RAM. Configuration is supported via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes. An internal configuration bitstream controls all logic, routing, and I/O standards, enabling the device to implement custom bus bridges, motor-control datapaths, video pipelines, or glue logic with deterministic latency.
Cyclone IV E parts use a 60 nm TSMC process and are characterized for low static and dynamic power consumption, with the -A7 speed grade and the F23 package code denoting a 23 mm x 23 mm body size with 1.0 mm ball pitch. The device family is widely supported by the Quartus Prime design toolchain, which provides synthesis, place-and-route, timing closure, and on-chip debugging through SignalTap II logic analyzer. Designers can target this part with VHDL, Verilog, or SystemVerilog source code and validate designs on inexpensive Cyclone IV development kits.
Typical applications include industrial control and factory automation controllers, automotive infotainment and driver-assistance subsystems, machine vision and video processing front-ends, low-cost PCIe endpoint bridges, motor-control inverters, and consumer electronics requiring custom parallel interfaces. The wide industrial and automotive temperature options make the part well suited to harsh-environment designs where a microcontroller cannot meet throughput requirements.
When designing with this part, ensure the PCB can support the 484-ball FBGA with 1.0 mm pitch - this requires HDI stack-up with microvias, laser-drilled blind vias, or 4-layer minimum with via-in-pad for cost-effective assembly. Power delivery must include separate rails for VCCINT (1.2 V core), VCCIO (1.2 V-3.3 V I/O banks), VCCA (2.5 V PLL analog), and VCCD_PLL (1.2 V PLL digital). Decoupling must follow the Quartus Prime pin connection guidelines to meet in-rush current during configuration.
This page synthesizes distributor pricing as of 2026-09-10, a curated drop-in alternatives list drawn from the same Cyclone IV E family, and practical design notes that go beyond the manufacturer datasheet's typical application section.
Drop-in alternatives for EP4CE40F23A7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE40F23A7N (same form factor and footprint) — differing in Package, Speed Grade, Core Voltage, Embedded Multipliers (18x18), Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE40F23C8N
✅ Drop-In✓ In Stock
$52.95 / Unit
View Datasheet →EP4CE40F23I7N
✅ Drop-In✓ In Stock
$52.75 / Unit
View Datasheet →EP4CE40F23I8LN
✅ Drop-In✓ In Stock
$148 / Unit
View Datasheet →EP4CE30F23A7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP4CE55F23A7N
✅ Drop-In✓ In Stock
$134.4 / Unit
View Datasheet →EP4CE40F23A7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements | 39,600 |
| Embedded Memory Bits | 1,161,216 (1161 Kb) |
| Embedded Memory Blocks | M9K (9 Kbit) |
| Maximum User I/O Pins | 328 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V |
| Process Technology | 60 nm low-power CMOS |
| Package | 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch |
| Speed Grade | A7 |
| Operating Temperature (Automotive) | -40C to +125C (AEC-Q100) |
| Configuration Modes | AS, PS, FPP, JTAG |
| RoHS Status | Compliant (lead-free FBGA) |
EP4CE40F23A7N 484-ball fbga (f23), 23 x 23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4CE40F23A7N (484-ball fbga (f23), 23 x 23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE40F23A7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE40F23A7N is suitable for 6 applications: Industrial Motor Control & Servo Drives, Automotive Infotainment & Driver-Assistance Subsystems, Machine Vision & Video Processing Front-Ends, Industrial Communication Bridges & Protocol Converters, Low-Cost PCIe Endpoint & High-Speed Bridge Cards, Test & Measurement Instrumentation Front-Ends.
Industrial Motor Control & Servo Drives
The EP4CE40F23A7N's 39,600 logic elements, 4 general-purpose PLLs, and 328 user I/O pins fit the deterministic-latency demands of field-oriented control (FOC) firmware for industrial servo and variable-frequency drives. The device handles PWM generation, quadrature encoder feedback, Hall-sensor decoding, and SPI/UART host interfacing in parallel without CPU offload. According to Cyclone IV reference designs, the 18x18 embedded multipliers accelerate Clarke/Park transforms and PI controllers at switching frequencies above 16 kHz. The 1161 Kb of M9K block RAM captures current-loop sample windows, and the A7 automotive speed grade with -40C to +125C operation allows deployment in cabinet-mounted industrial environments with elevated ambient temperature.
Recommended
Automotive Infotainment & Driver-Assistance Subsystems
The EP4CE40F23A7N's AEC-Q100 qualification and -40C to +125C automotive temperature range make it well suited for non-safety-critical in-vehicle subsystems such as digital instrument clusters, head-unit video pipelines, and surround-view camera multiplexing. The 328 GPIO support multiple MIPI-CSI/parallel camera inputs, LVDS display panels, and CAN/LIN transceivers simultaneously, while the 4 PLLs generate independent pixel clocks for each display. According to the Cyclone IV Device Handbook, the 60 nm low-power process delivers static-power figures suitable for always-on body electronics, and the part's existing automotive PCN documents support production programs through 2030+. For ASIL-rated safety functions (forward camera, radar), designers should migrate to Cyclone V or Arria V families.
Recommended
Machine Vision & Video Processing Front-Ends
The EP4CE40F23A7N's combination of 39,600 logic elements, embedded 18x18 multipliers, and 1161 Kb of M9K memory provides an effective platform for frame-rate conversion, color-space conversion, and Bayer demosaicing on industrial camera head-boards. According to the Cyclone IV Device Handbook, the LVDS I/O pairs support up to 840 Mbps per channel, allowing direct interface to CMOS image sensors without an external deserializer. The 328 GPIO comfortably absorb multi-camera MUX, JTAG debug, and a parallel RGB/HDMI output bridge on the same die. The F23 484-ball FBGA at 1.0 mm pitch matches HDI PCB stack-ups commonly used in compact camera modules and machine-vision smart cameras.
Recommended
Industrial Communication Bridges & Protocol Converters
The EP4CE40F23A7N's 4 PLLs and 328 GPIO make it a natural fit for protocol-conversion bridges between industrial buses such as EtherCAT, PROFINET, EtherNet/IP, Modbus TCP, and legacy serial interfaces. According to Cyclone IV reference designs, the on-chip MAC and TSE (Triple-Speed Ethernet) IP core reaches 10/100 Mbps without an external PHY-side controller, freeing logic elements for protocol stacks. The M9K blocks implement FIFO buffers for inter-bus packet translation, and the automotive temperature grade permits cabinet-free mounting next to motors and drives. Engineers can pair the device with an external Gigabit PHY (e.g., DP83867) for PROFINET IRT motion-control deployments.
Recommended
Low-Cost PCIe Endpoint & High-Speed Bridge Cards
The EP4CE40F23A7N integrates hardened PCIe Gen1 x4 endpoint IP through the soft PCIe MegaCore, supporting 2.5 Gbps lane rate for low-cost data-acquisition cards and PCIe-over-cable peripherals. According to the Cyclone IV Device Handbook PCIe chapter, the part meets the PCIe 1.1 specification with a minimal external coupling network, and the 1161 Kb of block RAM holds packet-header FIFO buffers. Designers can combine PCIe with a soft multi-gigabit transceiver (MGT) on adjacent I/O banks for custom serial protocols. The 484-ball FBGA package is footprint-compatible with the higher-density EP4CE75/EP4CE115 devices for upward migration.
Recommended
Test & Measurement Instrumentation Front-Ends
The EP4CE40F23A7N's 4 PLLs and 328 GPIO support multi-channel arbitrary waveform generation, digital pattern generation, and protocol-aware logic-analyzer capture. According to the Cyclone IV Device Handbook, the LVDS I/O pairs handle sampling rates up to 840 Mbps, suitable for entry-class oscilloscope and logic-analyzer front-ends up to 100 MHz analog bandwidth. The 1161 Kb of M9K memory stores deep acquisition windows, and the SignalTap II on-chip logic analyzer allows real-time non-intrusive design debug without external probing. The F23 484-ball FBGA at 1.0 mm pitch integrates into mixed-signal PCBs with BGA-assembly-friendly HDI stack-ups.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE40F23A7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE40F23C8N | EP4CE40F23I7N | EP4CE40F23I8LN | EP4CE30F23A7N | EP4CE55F23A7N |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Family | Cyclone IV E | Cyclone IV E - same | Cyclone IV E - same | Cyclone IV E - same | Cyclone IV E - same | Cyclone IV E - same |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 28,848 (-27%) | 55,296 (+40%) |
| Embedded Memory | 1161 Kb | 1161 Kb | 1161 Kb | 1161 Kb | 594 Kb (-49%) | 2340 Kb (+102%) |
| Maximum User I/O | 328 | 328 | 328 | 328 | 328 (same F23 package) | 328 (same F23 package) |
| Speed Grade | A7 (automotive) | C8 (commercial, faster) | I7 (industrial) | I8L (industrial, low-voltage) | A7 (automotive) | A7 (automotive) |
| Operating Temperature Range | -40C to +125C (automotive) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +125C (automotive) | -40C to +125C (automotive) |
| AEC-Q100 Qualification | Yes | No | No (industrial only) | No (industrial only) | Yes | Yes |
| Process Node | 60 nm low-power | 60 nm low-power | 60 nm low-power | 60 nm low-power | 60 nm low-power | 60 nm low-power |
Key Differentiators
- Only same-package part with full automotive AEC-Q100 qualification (vs EP4CE40F23I7N)
- Larger logic capacity than EP4CE30 in the same F23 footprint (vs EP4CE30F23A7N)
- Smaller and cheaper than the EP4CE55 family member in the same package (vs EP4CE55F23A7N)
Design Notes
The 484-ball FBGA package with 1.0 mm ball pitch requires HDI PCB stack-up. According to the Cyclone IV Device Handbook pin connection guidelines, a 4-layer board with microvia-in-pad and laser-drilled blind vias is the minimum for reliable assembly. Larger PCB manufacturers recommend 6 layers with sequential lamination for production. Provide a continuous ground plane under the BGA and stitch vias around the perimeter to control return-current paths for the LVDS pairs.
The EP4CE40F23A7N requires four distinct power rails: VCCINT (1.2 V core), VCCIO (1.2 V to 3.3 V I/O banks, one rail per bank group), VCCA (2.5 V PLL analog), and VCCD_PLL (1.2 V PLL digital). According to the Cyclone IV pin connection guidelines, VCCA must be powered up before or simultaneously with VCCD_PLL, and decoupling must include 0.1 uF and 10 uF ceramic capacitors within 100 mil of each ball. In-rush current during configuration can exceed 1 A on VCCINT; the regulator must support transient loads with adequate output capacitance.
Do not leave MSEL[3:0] floating - these four balls select the configuration mode (AS, PS, FPP, JTAG) and must be tied to VCCIO or GND through a 1 kohm resistor. According to the Cyclone IV Device Handbook configuration chapter, a floating MSEL causes the device to enter an undefined state at power-up. Likewise, the nCONFIG pin must be held high through a 10 kohm pull-up to VCCIO to prevent spurious reconfiguration from line transients in industrial environments.
Estimated: at full utilization with all 39,600 LEs switching at 50 MHz and an activity factor of 12.5%, the EP4CE40F23A7N dissipates approximately 1.2 W in still air. According to Cyclone IV thermal guidelines, the F23 FBGA package has theta_JA of approximately 13 C/W with adequate PCB copper, so junction temperature rise above ambient is roughly 16 C. The A7 automotive speed grade supports junction temperatures up to 125 C, leaving ample margin in industrial-cabinet environments. For sealed enclosures, derate logic utilization by 15-20% to keep junction below 100 C.
Compliance Information
RoHS-compliant lead-free FBGA package. AEC-Q100 qualified over -40C to +125C junction temperature per Cyclone IV automotive-grade documentation. Halogen-free status was not explicitly stated in the verified web data.
