EP4CE40F23C8L - Cyclone IV E FPGA, 39.6K LEs, 484-FBGA | Intel (Altera)
MPN: EP4CE40F23C8L ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $96.33 | $96.33 |
| 10 | $91.5 | $915.00 |
| 100 | $85.2 | $8,520.00 |
| 500 | $78.4 | $39,200.00 |
| 1,000 | $72.1 | $72,100.00 |
EP4CE40F23C8L Overview
What is a Cyclone IV E FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as multipliers, memory blocks, and PLLs. Cyclone IV E sits in the low-power, low-cost tier of the Cyclone family, positioned below Cyclone V and above legacy Cyclone III devices. It belongs to the broader hierarchy of programmable logic devices (PLD), sitting alongside CPLDs in the digital logic ecosystem but offering dramatically higher logic density. The 'E' suffix designates the Enhanced logic-and-memory variant optimized for parallel processing and DSP workloads rather than high-speed serial transceivers.
Key features include 4 input/output banks supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), embedded RAM blocks up to 4 Kbits each, configurable JTAG boundary-scan, and Cyclone-specific configuration schemes including Active Serial and JTAG. The device supports up to 200 MHz internal operation in commercial temperature grades and offers configurable Multiplier blocks optimized for DSP functions. Configuration memory supports both compression and encryption for secure bitstream handling.
Architecture highlights include an 8-input adaptive logic module (ALM) that improves packing efficiency over the 4-input LUT structure used in earlier Cyclone generations, a dedicated 18x18 multiplier block array, and global clock networks supported by up to 8 dedicated clock pins. The PLLs feature dynamic reconfiguration and support spread-spectrum clocking. On-chip memory totals 1.16 Mbits organized as M9K blocks of 9 Kbits each.
Typical applications include industrial motor control, video processing pipelines, low-cost ASIC prototyping, embedded vision systems, and consumer electronics requiring moderate logic density without the cost of larger FPGAs. The wide temperature grade variants (denoted by the 'L' suffix) extend operation into industrial environments. Designers choose this device for parallel DSP, glue-logic consolidation, and small-to-medium state-machine implementations.
Design consideration: estimate board area carefully. The 484-FBGA has 1.0 mm ball pitch and requires at least 6 PCB layers with controlled-impedance routing for high-speed I/O signals. Always reference the Cyclone IV Device Family Pin Connection Guidelines for unused-pin termination, especially for differential pairs used in LVDS modes.
This page synthesizes distributor pricing, drop-in same-package alternatives, and PCB layout design notes not aggregated on any single distributor page.
Drop-in alternatives for EP4CE40F23C8L — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE40F23C8L (same form factor and footprint) — differing in Package, Speed Grade, Embedded Memory, Process Technology, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE40F23C8
✅ Drop-In✓ In Stock
$54.8 / Unit
View Datasheet →EP4CE40F23C8N
✅ Drop-In✓ In Stock
$52.95 / Unit
View Datasheet →EP4CE40F23C7N
✅ Drop-In✓ In Stock
$21.8 / Unit
View Datasheet →EP4CE40F23C7
✅ Drop-In✓ In Stock
$102 / Unit
View Datasheet →EP4CE40F23C6N
✅ Drop-In✓ In Stock
$76.8 / Unit
View Datasheet →EP4CE40F23C6
✅ Drop-In✓ In Stock
$71.4 / Unit
View Datasheet →EP4CE40F23C8L Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements | 39,600 |
| Embedded Memory | 1,161,216 bits (1.16 Mbit) |
| Embedded Multipliers (18x18) | 116 |
| General-Purpose PLLs | 4 |
| Maximum User I/O Pins | 328 |
| Process Technology | 60 nm (TSMC low-power) |
| Core Voltage | 1.2 V |
| Package | 484-pin FBGA (F23), 1.0 mm ball pitch, 23x23 mm |
| Speed Grade | 8 (industrial low-power process, 8-stage logic) |
| Configuration Schemes | Active Serial, Passive Serial, JTAG |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI, Differential LVDS |
| Global Clock Networks | 20 |
| Embedded RAM Block Size | 9 Kbits (M9K blocks) |
| RoHS Status | Compliant |
EP4CE40F23C8L 484-pin fbga (f23), 1.0 mm ball pitch, 23x23 mm Pin Configuration Guide
Pin configuration for EP4CE40F23C8L (484-pin fbga (f23), 1.0 mm ball pitch, 23x23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE40F23C8L.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE40F23C8L is suitable for 6 applications: Industrial Motor Control, Video Processing Pipelines, ASIC Prototyping and Emulation, Low-Cost ASIC Replacement and Glue Logic, Embedded Vision and Image Sensor Aggregation, Communications Protocol Bridging.
Industrial Motor Control
The EP4CE40F23C8L's 116 hardware 18x18 multipliers and 39,600 logic elements make it well-suited for industrial motor control loops running field-oriented control (FOC) algorithms at 10-50 kHz PWM rates. The 328 user I/Os accommodate multi-axis encoder feedback (QEP interfaces), Hall sensors, and PWM outputs without external logic. Four general-purpose PLLs synthesize precise switching frequencies from a single crystal reference. Designers typically pair it with industrial-grade companion chips (EPCS configuration flash, isolated gate drivers) for high-voltage IGBT/SiC inverters. Compared to DSP+MCU dual-chip solutions, a single Cyclone IV E handles both the control loop and supervisory state machine, reducing BOM cost.
Recommended
Video Processing Pipelines
The EP4CE40F23C8L's 1.16 Mbits of embedded M9K memory and 39,600 logic elements support single-channel video processing pipelines (deinterlacing, scaling, color space conversion) up to 1080p30 resolution. The 328 I/Os accommodate parallel RGB/YUV interfaces plus control channels. M9K blocks buffer line-scan memory between pipeline stages with predictable timing. For multi-channel or higher-resolution designs, a Cyclone IV E part with larger memory (EP4CE115F23) is preferred. Compared to ASSPs, the FPGA enables proprietary video algorithms without external memory bandwidth bottlenecks.
Recommended
ASIC Prototyping and Emulation
Engineers use the EP4CE40F23C8L as a low-cost ASIC prototype target for designs originally targeted at 0.18-0.13 um ASIC processes. The 39,600 LEs map cleanly to mid-complexity ASIC gates, and 116 multipliers cover most DSP functions. Configuration via JTAG enables rapid design iteration cycles. For larger ASIC prototypes, multiple FPGAs are co-simulated over LVDS inter-FPGA links. Compared to high-end Virtex/Stratix parts, the Cyclone IV E delivers sufficient logic density at 10-20x lower unit cost, ideal for early-stage validation before ASIC tape-out.
Recommended
Low-Cost ASIC Replacement and Glue Logic
The EP4CE40F23C8L consolidates discrete glue logic, address decoding, and custom I/O expansion into a single programmable device. Engineers replace 3-5 standard-logic chips (74-series) plus a small CPLD with one Cyclone IV E, simplifying board layout and reducing BOM cost. The 4 general-purpose PLLs eliminate external clock generator ICs, while 328 I/Os handle board-level interconnect. Hot-socketing capability allows live insertion in backplane systems. Compared to multiple discrete ICs, a single FPGA reduces board area by 50-70% and simplifies EMC compliance.
Recommended
Embedded Vision and Image Sensor Aggregation
The EP4CE40F23C8L aggregates multiple MIPI-CSI or parallel image sensors into a unified processing pipeline, exploiting 328 I/Os to accept 2-3 sensor streams simultaneously. The 116 hardware multipliers accelerate Sobel, Laplacian, and other convolution kernels at 60 fps. M9K blocks buffer pixel rows between filter stages with single-cycle access. The device fits drone, robotics, and machine vision applications where 1080p image processing must run on a power budget under 2W. Compared to ASSP ISPs, the FPGA enables proprietary pre-processing algorithms without software overhead.
Recommended
Communications Protocol Bridging
The EP4CE40F23C8L bridges legacy industrial protocols (RS-485, CAN, UART, SPI) to Ethernet or USB, using its abundant I/O count and embedded multipliers for protocol encoding/decoding. The 4 PLLs synthesize multiple baud-rate clocks from a single reference, eliminating external baud-rate generators. M9K blocks buffer packet payloads. Typical designs implement Modbus-RTU to Modbus-TCP gateways, CAN-to-Ethernet bridges, or SPI-to-UART multiplexers. Compared to microcontroller-based bridges, the FPGA delivers deterministic latency and parallel protocol handling without RTOS overhead.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE40F23C8L — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE40F23C8 | EP4CE40F23C8N | EP4CE40F23C7N | EP4CE40F23C7 | EP4CE40F23C6N | EP4CE40F23C6 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-pin FBGA (F23) | 484-pin FBGA (F23) - same | 484-pin FBGA (F23) - same | 484-pin FBGA (F23) - same | 484-pin FBGA (F23) - same | 484-pin FBGA (F23) - same | 484-pin FBGA (F23) - same |
| Logic Elements | 39,600 | 39,600 - same | 39,600 - same | 39,600 - same | 39,600 - same | 39,600 - same | 39,600 - same |
| Embedded Memory | 1,161,216 bits | 1,161,216 bits - same | 1,161,216 bits - same | 1,161,216 bits - same | 1,161,216 bits - same | 1,161,216 bits - same | 1,161,216 bits - same |
| 18x18 Multipliers | 116 | 116 - same | 116 - same | 116 - same | 116 - same | 116 - same | 116 - same |
| Speed Grade | 8 | 8 - same | 8 - same | 7 (faster) | 7 (faster) | 6 (fastest) | 6 (fastest) |
| RoHS Lead-Free | Yes (L suffix) | No (lead) | Yes (N suffix) | Yes (N suffix) | No (lead) | Yes (N suffix) | No (lead) |
| Operating Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
Key Differentiators
- RoHS lead-free compliance with identical die and pinout (vs EP4CE40F23C8)
- Slowest speed grade 8 for low-power designs (vs EP4CE40F23C6N)
- Lowest unit cost among same-density Cyclone IV E variants (vs EP4CE115F23C8N)
Design Notes
Estimated: The 484-FBGA with 1.0 mm ball pitch requires a 6-layer PCB stackup minimum, with at least one dedicated ground plane directly beneath the BGA for return-current control. Place at least 8 ground vias in the BGA thermal/ground pad array to suppress ground bounce. Use 50 ohm controlled-impedance routing for LVDS pairs and 60 ohm for LVTTL single-ended signals. Always reference the Altera Cyclone IV Device Family Pin Connection Guidelines for unused-pin termination - unused I/O banks must be tied to a defined logic level via the Quartus pin-setting file.
Estimated: Core supply (VCCINT) requires 1.2 V at up to 500 mA during typical operation, plus PLL analog supply (VCCA) at 2.5 V and I/O supply (VCCIO) configurable from 1.2 V to 3.3 V per bank. Place 100 nF decoupling capacitors within 2 mm of every VCC pin and 10 uF bulk capacitors at each supply rail entry point. Power-on sequencing: VCCINT must ramp before VCCIO per Altera recommendations; failure to sequence may cause I/O latch-up. Use a TI TPS54331 or equivalent switching regulator with enable sequencing for reliable cold-start.
Estimated: Configuration mode pins (MSEL0/MSEL1/MSEL2) must be tied to fixed logic levels matching the desired configuration scheme - floating MSEL pins cause configuration failure. JTAG chain integrity requires TDI to TDO daisy-chain with no stubs; add 4.7 kohm pull-ups on TCK, TMS, and TDI. Do not exceed the maximum I/O bank count of 4 - assigning VCCIO levels across banks requires careful power-domain planning. For AS mode, choose an EPCS flash sized at least 2x the bitstream length for compression overhead margin.
Estimated: The 484-FBGA package has a theta_JA of approximately 15 C/W with a standard JEDEC 4-layer test board. At full utilization (~70% LEs active, all multipliers running at 200 MHz), power dissipation can reach 1.5-2 W, producing 22-30 C junction temperature rise above ambient. For sealed enclosures without forced airflow, consider a copper heat spreader bonded to the BGA top with thermal interface material. Industrial applications above 60 C ambient should derate to 50% utilization or switch to industrial-temperature variants.
Compliance Information
RoHS compliance confirmed by 'L' suffix in MPN per Altera/Intel product numbering convention. AEC-Q100 not applicable for commercial-grade FPGA. Halogen-free status not explicitly stated in retrieved web data - set to unknown pending datasheet verification.
