EP4CE40F23C9L - Cyclone IV E FPGA 39.6K LE | Intel
MPN: EP4CE40F23C9L ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $70.2 | $702.00 |
| 100 | $60.95 | $6,095.00 |
| 250 | $55.4 | $13,850.00 |
| 500 | $48.8 | $24,400.00 |
EP4CE40F23C9L Overview
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that allows engineers to implement arbitrary digital logic, ranging from glue logic and state machines to complex pipelines and soft processors, by configuring an array of programmable logic elements and interconnect. Within the broader semiconductor taxonomy, FPGAs sit under programmable logic devices (PLD), which in turn fall under digital logic ICs and ultimately integrated circuits. The Cyclone IV E family specifically targets cost-sensitive, high-volume, low-power applications where the flexibility of an FPGA is required but the absolute performance of a high-end Stratix class device is not needed.
Key features of the EP4CE40F23C9L include up to 396 user I/Os, 4 PLLs for clock synthesis and management, dedicated hardware multipliers, embedded configuration memory, and the ability to be reconfigured in-system through JTAG or active serial interfaces. The 484-ball FBGA package measures 23 x 23 mm with a 1 mm ball pitch and a substrate height profile suitable for high-density PCB layouts. The device supports DDR/DDR2/QDR/DDR3 external memory interfaces and integrates advanced I/O features such as LVDS, RSDS, mini-LVDS, and SSTL signaling.
Architecturally, the Cyclone IV E family uses an SRAM-based LUT-driven fabric, which means the configuration bitstream must be loaded at power-up from external flash or a configuration controller. The EP4CE40F23C9L is offered in the 'C9' speed grade, which is the slowest (most economical) device grade in the Cyclone IV E family; faster speed grades (C8, C7, C6) provide higher Fmax at higher cost. The device supports hot-socketing and PCI Express hard IP blocks, simplifying interface implementation for embedded designs.
Typical applications include industrial control systems, video processing and image processing front-ends, telecommunications line cards, motor control, test and measurement instrumentation, and low-cost prototyping of ASIC designs. The wide temperature support and abundant logic resources make it a popular choice for mid-volume embedded designs where NRE cost must be minimized.
When designing with this FPGA, ensure that the Quartus II / Quartus Prime toolchain version supports the Cyclone IV E device family, verify that the PCB layout provides sufficient decoupling near each power pin, and confirm the configuration scheme (AS, PS, JTAG) and clock topology are consistent with the rest of the system.
Drop-in alternatives for EP4CE40F23C9L — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE40F23C9L (same form factor and footprint) — differing in Package, Speed Grade, RoHS Status, Core Voltage, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE40F23C8N
✅ Drop-In✓ In Stock
$52.95 / Unit
View Datasheet →EP4CE40F23C7N
✅ Drop-In✓ In Stock
$21.8 / Unit
View Datasheet →EP4CE40F23C6N
✅ Drop-In✓ In Stock
$76.8 / Unit
View Datasheet →EP4CE40F23A7N
✅ Drop-In✓ In Stock
$118.4 / Unit
View Datasheet →EP4CE40F19A7N
✅ Drop-In✓ In Stock
$298.75 / Unit
View Datasheet →EP4CE40F23C8N7N
✅ Drop-In✓ In Stock
$112.85 / Unit
View Datasheet →EP4CE40F23C9L Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements | 39,600 |
| Embedded Memory | 1,134 Kbits (113.4 Kbytes) |
| Logic Array Blocks (LABs) | 2,475 |
| User I/O Count (Max) | 328 |
| Total I/O Pins | 484 |
| Package | 484-ball FBGA (F23), 23x23 mm, 1.0 mm pitch |
| Process Technology | 60 nm low-power CMOS |
| Core Voltage | 1.2 V (nominal) |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Speed Grade | C9 (commercial, slowest grade) |
| Operating Temperature | Commercial (0C to +85C) |
| Lead-Free / RoHS | Yes (Pb-free termination) |
| Configuration Method | Active Serial (AS), Passive Serial (PS), JTAG |
EP4CE40F23C9L 484-ball fbga (f23), 23x23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4CE40F23C9L (484-ball fbga (f23), 23x23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE40F23C9L.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE40F23C9L is suitable for 6 applications: Industrial Motor Control, Video Processing & Display Controllers, Telecom Line Cards & Protocol Bridging, Test & Measurement Instrumentation, ASIC Prototyping & Emulation, Low-Cost Embedded Computing Platforms.
Industrial Motor Control
The EP4CE40F23C9L's 39,600 logic elements and 4 PLLs make it well-suited for industrial motor control systems such as field-oriented control (FOC) loops for AC induction motors, PMSM servo drives, and stepper controllers. The device's hardware multipliers support real-time Park/Clarke transforms and PID loops at switching frequencies of 10-20 kHz, while the 328 user I/Os can drive multiple encoder interfaces (QEP, SSI, BiSS) and gate-driver PWM channels simultaneously. Compared to a discrete DSP+MCU solution, the EP4CE40F23C9L consolidates the control law, communication stack, and safety logic in a single FPGA, reducing BOM and PCB area. Designers should use Quartus Prime DSP Builder or hand-coded VHDL/Verilog with the 9x9-bit multiplier blocks for deterministic latency.
Recommended
Video Processing & Display Controllers
With 113.4 Kbits of embedded RAM and abundant LVDS I/O, the EP4CE40F23C9L can implement video processing pipelines including 1080p60 capture, scaling/deinterlacing, color-space conversion, and overlay composition. The 484-ball FBGA package provides sufficient I/Os for 24-bit RGB parallel video inputs plus LVDS panel outputs. The 4 PLLs allow independent clock domains for input video, memory, and output display. Typical designs route pixel data through line buffers sized in M9K BRAM blocks, then output via DDR2/QDR memory controllers implemented in soft IP. Compared to ASIC solutions, the FPGA enables rapid display-panel iteration without NRE cost.
Recommended
Telecom Line Cards & Protocol Bridging
The EP4CE40F23C9L is well matched to telecom line-card applications such as T1/E1 framer bridging, HDLC controllers, and low-density packet processors. Its 60 nm low-power process keeps dynamic power manageable in always-on networking equipment, and the multi-voltage I/O banks support LVCMOS 3.3 V, 2.5 V, 1.8 V, and SSTL signaling required to interface with legacy PHY devices. The PCI Express hard IP block enables simple root-complex or endpoint functionality in ATCA/AMC backplanes. Compared to an ASSP framer, the FPGA offers protocol flexibility and field upgradeability for evolving standards.
Recommended
Test & Measurement Instrumentation
The EP4CE40F23C9L is a popular choice for test-and-measurement instruments including logic analyzers, pattern generators, and protocol exercisers. The 39,600 LEs can host up to several hundred channels of parallel pattern logic, while the 328 user I/Os and 4 PLLs provide flexible clock distribution for multi-rate stimulus. The SRAM-based configuration enables frequent bitstream updates during firmware development, accelerating bring-up. Compared to a microcontroller-based tester, the FPGA delivers deterministic, multi-channel parallel test capability needed for high-pin-count digital validation.
Recommended
ASIC Prototyping & Emulation
The EP4CE40F23C9L provides 39,600 logic elements that map to hundreds of thousands of ASIC gates when used as an FPGA prototype vehicle. Engineering teams use multiple EP4CE40F23C9L devices on a multi-FPGA prototyping board (with explicit partitioning) to validate ASIC RTL before tape-out. The Quartus II / Quartus Prime toolchain offers design-partitioning flows that distribute logic across FPGAs while preserving timing closure. Compared to software simulation, FPGA prototyping runs at MHz-real-time, enabling firmware co-development and real-world I/O validation.
Recommended
Low-Cost Embedded Computing Platforms
The EP4CE40F23C9L supports soft-core processor implementations such as Nios II / Nios V, allowing single-chip embedded systems with custom peripherals. The 113.4 Kbits of block RAM plus 4 PLLs are sufficient to host a Nios V/m processor, on-chip peripherals (UART, SPI, I2C, timers), and user logic in one device. Industrial temperature variants of the same die enable harsh-environment deployment. Compared to a discrete MCU, the FPGA-based soft-core platform offers reconfigurable peripheral sets and post-deployment logic updates.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE40F23C9L — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE40F23C8N | EP4CE40F23C7N | EP4CE40F23C6N | EP4CE40F23A7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F23, 23x23 mm) | 484-ball FBGA (F23, 23x23 mm) - same | 484-ball FBGA (F23, 23x23 mm) - same | 484-ball FBGA (F23, 23x23 mm) - same | 484-ball FBGA (F23, 23x23 mm) - same |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 |
| Embedded Memory | 1,134 Kbits | 1,134 Kbits | 1,134 Kbits | 1,134 Kbits | 1,134 Kbits |
| Speed Grade | C9 (slowest) | C8 | C7 | C6 (fastest) | A7 (industrial) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| User I/Os (max) | 328 | 328 | 328 | 328 | 328 |
| PLLs | 4 | 4 | 4 | 4 | 4 |
| Approx. Unit Price (qty 1) | $78.50 | ~$82.00 | ~$95.00 | ~$115.00 | ~$105.00 |
Key Differentiators
- Slowest speed grade (C9) = lowest cost in the Cyclone IV E F23 family (vs EP4CE40F23C8N)
- Commercial temperature grade is sufficient for indoor / climate-controlled deployments (vs EP4CE40F23A7N)
- Mid-range density (39,600 LE) - sufficient for most single-chip FOC, video, and protocol-bridging designs without oversizing (vs EP4CE115F23C8N)
Design Notes
The EP4CE40F23C9L requires multiple power rails: 1.2 V VCCINT (core), 2.5 V VCCAUX (PLL/auxiliary), 3.3 V or lower VCCIO (I/O banks), and 3.3 V VCCPD (pre-driver). Estimated: at 39,600 LEs fully utilized and 200 MHz operation, dynamic current on VCCINT can exceed 1 A; static current on VCCAUX is ~150 mA typical. Use a power-sequencer or ensure VCCINT ramps before VCCIO per Intel's power-on sequencing requirements to avoid I/O latch-up. Bulk decoupling: at least 4 x 100 uF bulk + per-pin 0.1 uF + 10 nF ceramics.
Estimated thermal dissipation: at moderate utilization (~70% LEs) and 100 MHz toggle rate, the EP4CE40F23C9L dissipates approximately 1.5-2.0 W. The 484-ball FBGA package has theta_JA around 18-22 C/W with adequate PCB thermal vias under the package. For industrial-grade operation up to 100C ambient, ensure at least 6 thermal vias (0.3 mm drill, 1 oz plating) per BGA ball row under the die shadow. Use thermal simulation in the Quartus Prime PowerPlay tool early in the design cycle.
The 484-ball FBGA has 1.0 mm pitch, requiring microvia or via-in-pad PCB technology (typical 4-layer stack-up with HDI). Maintain 50 ohm controlled-impedance routing for high-speed LVDS/SSTL pairs. Place configuration flash (EPCS16 / EPCQ16) as close to the FPGA's dedicated configuration pins as possible to minimize trace lengths. Provide a JTAG header even if production configuration is via AS mode - field updates via JTAG save expensive rework.
Common pitfalls: (1) Exceeding the maximum LVDS pair count - the EP4CE40F23C9L supports a limited number of true LVDS pairs in each I/O bank, exceeding this limit causes signal-integrity failures. (2) Forgetting CONFIG_DONE pull-up - the CONFIG_DONE pin requires an external pull-up to 3.3 V; absent this, the device cannot signal successful configuration. (3) Mixing C-speed grade timing models - C9 timing is the worst case; if you upgrade to C8/C7/C6, re-run timing closure. (4) Not enabling the CRC error-check feature in the device options.
Compliance Information
RoHS compliant per Intel product page (Pb-free 'L' termination suffix). Halogen-free status not explicitly stated in the verified data; marked unknown. Not AEC-Q100 qualified (FPGAs are typically not AEC-Q100 qualified).
