EP4CE55F29C6 - Cyclone IV E FPGA, 55K LEs, 780-BGA | Intel
MPN: EP4CE55F29C6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $205.37 | $205.37 |
| 10 | $195.5 | $1,955.00 |
| 100 | $182.1 | $18,210.00 |
| 500 | $168.4 | $84,200.00 |
| 1,000 | $154.2 | $154,200.00 |
EP4CE55F29C6 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), routing interconnects, and I/O cells that designers program after manufacture to implement custom digital circuits. FPGAs occupy a unique position in the silicon hierarchy - more flexible than an ASIC or microcontroller, more deterministic than a software-defined CPU. The Cyclone IV E family sits between low-density CPLDs and high-end Stratix FPGAs, targeting cost-sensitive applications such as industrial control, video bridging, motor control, and I/O expansion.
Key features of the EP4CE55F29C6 include 4 phase-locked loops (PLLs) for clock synthesis, 156 embedded 18x18 multipliers for DSP and signal processing, support for external memory interfaces including DDR/DDR2 SDRAM and QDR II SRAM, and dedicated LVDS pairs on every I/O bank. Configuration is supported through JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes, with optional AES-128 bitstream encryption on security-sensitive builds.
The Cyclone IV E architecture combines an FPGA fabric with hard IP blocks such as memory controllers, multipliers, and PLLs. Compared with the previous Cyclone III generation, Cyclone IV E offers higher logic density, lower static power, and up to 150 MHz performance on internal logic with up to 200 MHz on external memory interfaces. The fabric uses 8-input adaptive logic modules (ALMs) and supports M9K memory blocks with true dual-port capability.
Typical applications include industrial machine vision and factory automation controllers, motor drive and encoder interfaces, video format conversion (HDMI/VGA/DisplayPort bridging), telecommunications line cards, USB/Ethernet interface bridges, embedded soft-core processors (NIOS II / RISC-V), and educational/development platforms. The 780-ball FBGA package supports high pin counts required by parallel external memory buses, multiple LVDS channels, and GPIO-heavy designs.
When designing with this device, careful attention must be paid to power sequencing, decoupling, and thermal dissipation. The 780-FBGA package has a junction-to-ambient thermal resistance in the range of typical high-density BGA packages, so sufficient PCB copper and airflow are required for high-utilization designs. Quartus II / Quartus Prime development tools are required for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical board-level design notes not consolidated on any single manufacturer or distributor page.
Drop-in alternatives for EP4CE55F29C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE55F29C6 (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Process Technology, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE55F29C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$138 / Unit
View Datasheet →EP4CE55F29C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$285 / Unit
View Datasheet →EP4CE55F29I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$154.8 / Unit
View Datasheet →EP4CE115F29C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$38.9 / Unit
View Datasheet →EP4CE40F29C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$77.51 / Unit
View Datasheet →EP4CE55F29C6 Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Series | Cyclone IV E |
| Logic Elements (LE) | 55,856 |
| Logic Array Blocks (LAB) | 47 |
| Embedded Memory | 2,396,160 bits (234 Kb) |
| Memory Blocks (M9K) | 156 |
| Embedded 18x18 Multipliers | 156 |
| User I/O Pins | 374 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm (low-power) |
| Operating Temperature | Commercial (0C to +85C) |
| Package | 780-ball FBGA (29 mm x 29 mm) |
| Mounting Type | Surface Mount (BGA) |
| Configuration Modes | AS, AP, PS, JTAG |
| Bitstream Encryption | AES-128 (optional) |
| RoHS Status | Compliant |
EP4CE55F29C6 780-ball fbga (29 mm x 29 mm) Pin Configuration Guide
Pin configuration for EP4CE55F29C6 (780-ball fbga (29 mm x 29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE55F29C6.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE55F29C6 is suitable for 6 applications: Industrial Machine Vision and Inspection, Motor Drive and Encoder Interface, Video Format Conversion and Bridging, Telecommunications Line Card Interface, Embedded Soft-Core Processor Platform, Development and Education Platform.
Industrial Machine Vision and Inspection
The EP4CE55F29C6 fits industrial machine vision with 55,856 LEs to host image-processing pipelines (Sobel, thresholding, blob detection) and 156 embedded 18x18 multipliers for real-time convolution. The 374 user I/Os accept parallel Camera Link or LVDS sensor data at up to 150 MHz DDR per pair, while the 234 Kb of embedded RAM buffers line-scan frames without external SRAM. The four PLLs derive pixel clocks, exposure strobes, and Ethernet PHY reference clocks from a single crystal. Built on the low-power 60 nm Cyclone IV E process, the device typically draws 1.5 to 2.5 W in vision pipelines, fitting into fan-less IP67 enclosures. Quartus Prime supports common vision reference designs and the OpenCV-to-HDL flow.
Recommended
Motor Drive and Encoder Interface
In motor control, the EP4CE55F29C6 implements field-oriented control (FOC) loops, encoder quadrature decoders, and PWM generation in a single device. Its 156 dedicated 18x18 multipliers handle Park/Clarke transforms and PID calculations at 50 to 100 kHz loop rates. The 4 PLLs multiply the encoder reference clock to independent rates for resolver excitation and PWM switching. Up to 374 I/Os interface incremental encoders, Hall sensors, SPI-connected gate drivers, and CAN/Ethernet supervisory uplinks. The 60 nm low-power Cyclone IV E process keeps junction temperature manageable in sealed inverter enclosures at continuous 20 kHz switching frequencies.
Recommended
Video Format Conversion and Bridging
The EP4CE55F29C6 bridges HDMI/DVI/VGA/DisplayPort streams in industrial displays and video walls. Its 374 I/Os accept up to 24-bit parallel RGB, two LVDS channels, and a DDR2 memory controller for frame buffering. The 234 Kb of internal RAM caches scaling coefficients and one-line video buffers, while external DDR2 SDRAM stores 1080p frames at 60 Hz. Color space conversion, gamma correction, and on-screen-display overlay are implemented in fabric at pixel clock rates up to 148.5 MHz. The 60 nm low-power process keeps typical consumption under 2 W for dual-input switchable display controllers.
Recommended
Telecommunications Line Card Interface
The EP4CE55F29C6 implements serializer/deserializer framer logic, TDM time-slot switching, and low-speed protocol glue on telecom line cards. With 55,856 LEs, designers can host 32 to 64 channels of HDLC or GFP framing alongside IMA aggregation logic. The 4 PLLs derive 8 kHz frame clocks from 19.44 MHz or 77.76 MHz network references. Embedded memory supports 256 ms of jitter buffer per channel at E1/T1 rates. Up to 374 I/Os connect to TDM backplanes, framer ASICs, and Ethernet MAC PHYs, while the 60 nm low-power Cyclone IV E process keeps per-card power under 3 W in CO deployments.
Recommended
Embedded Soft-Core Processor Platform
The EP4CE55F29C6 hosts NIOS II or RISC-V soft-core processors with substantial peripheral logic in industrial IoT gateways. With 55,856 LEs, designers implement a 32-bit NIOS II/f core alongside Ethernet MAC, SD card controller, LCD interface, and Modbus/Profibus protocol stacks. The 234 Kb of embedded RAM serves as instruction and data cache, while external DDR2 SDRAM supports 64 to 128 MB working memory. The 4 PLLs derive CPU clocks, peripheral bus clocks, and PHY reference clocks independently. The 60 nm low-power process typically yields 1.0 to 1.5 W active power, enabling fan-less IoT edge nodes.
Recommended
Development and Education Platform
The EP4CE55F29C6 powers university FPGA curricula and reference design boards such as the Altera/Intel DE2-115 family derivatives. With 55,856 LEs it is large enough to host complete RISC-V SoCs, RISC-V Linux boot flows, video pipelines, and student projects, yet small enough to fully utilize within a single semester. The 374 I/Os expose every common peripheral: VGA, HDMI, audio CODEC, USB, Ethernet, SDRAM, and GPIO headers. The 4 PLLs support independent clock domains for laboratory experiments. Quartus Prime Web Edition is free for academic users, making the part a standard pedagogical reference. Lifecycle-active status ensures multi-year curriculum continuity.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE55F29C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE55F29C7N | EP4CE55F29C8N | EP4CE55F29I7N | EP4CE115F29C8N | EP4CE40F29C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (F29) | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 114,480 | 39,600 |
| User I/Os | 374 | 374 | 374 | 374 | 374 | 374 |
| Embedded Memory | 2,396,160 bits (234 Kb) | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 3,981,312 bits | 1,134,000 bits |
| 18x18 Multipliers | 156 | 156 | 156 | 156 | 266 | 116 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Speed Grade | C6 (commercial, fastest) | C7 | C8 | I7 (industrial temp) | C8 | C6 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | 0C to +85C |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Higher logic density than EP4CE40 sibling with same package (vs EP4CE40F29C6N)
- Faster speed grade than C7/C8 alternatives (vs EP4CE55F29C7N)
- Lower power than comparable Stratix III devices (vs EP3SL70F780C4)
Design Notes
Cyclone IV E devices require four supply rails: VCCINT (1.2 V core), VCCIO (per-bank, 1.2 to 3.3 V), VCCA (2.5 V PLL analog), and VCCD_PLL (1.2 V PLL digital). Intel recommends a power-on sequence where VCCINT ramps before or simultaneously with VCCIO, and VCCA must be stable before VCCINT exceeds 0.6 V to avoid latch-up. Use a dedicated LDO for VCCA with at least 100 mV headroom and a 10 uF + 100 nF decoupling network. Under typical machine-vision loading, VCCINT current reaches 0.8 to 1.2 A for the EP4CE55. Place at least one 22 uF bulk capacitor and ten 100 nF ceramic capacitors adjacent to the VCCINT and VCCIO balls.
The 780-FBGA F29 package has a theta-JA of approximately 15 to 20 C/W on a standard 4-layer JEDEC test board (depends on copper weight and airflow). At 2 W total dissipation, junction temperature rise is 30 to 40 C above ambient. For high-utilization designs that push the fabric above 3 W, add thermal vias under the exposed die flag pad and consider a small heatsink or 200 LFM airflow. The Cyclone IV E device handbook provides thermal models and recommended PCB copper area for each package. Industrial-grade variants (I7 speed grade) extend operating range to 100 C and are mandatory for outdoor enclosures.
The 780-FBGA F29 package uses a 1.0 mm ball pitch, which requires 0.5 mm via-in-pad with filled and plated-over copper to allow solder escape. Maintain a minimum 4-layer stackup with continuous GND plane on layer 2 and VCCINT split plane on layer 3. Place external memory (DDR2 SDRAM) on the same side as the FPGA within 100 mm trace length to meet Quartus timing constraints. Use matched-length routing (plus or minus 25 mil) for DDR2 address/control traces and plus or minus 10 mil for clocks. Configure unused I/O as tri-state inputs with weak pull-up to minimize leakage.
Common pitfalls on EP4CE55 designs include: (1) forgetting to assign CONFIG_DATA and CONFIG_CLK pins for AS configuration, leaving the FPGA unable to boot from EPCS flash; (2) mixing 2.5 V and 3.3 V on the same I/O bank, which violates VCCIO rules; (3) leaving MSEL pins floating, which selects an undefined configuration mode; (4) using LVDS without an external 100 ohm termination resistor across the differential pair; (5) exceeding the 374-pin I/O limit by routing signals to internal-only pads. Always run the Quartus Prime I/O Assignment Analysis before board fabrication to catch bank conflicts early.
Compliance Information
RoHS compliant per Intel product page. Lead-free (Pb-free) finish on BGA balls per the datasheet. Halogen-free laminate and substrate per the conflict-minerals report. AEC-Q100 is not applicable - this is a commercial-grade FPGA, not an automotive-qualified part.
