EP4CE75F23C9LN - 75K LE Cyclone IV E FPGA, 484-FBGA | Intel
MPN: EP4CE75F23C9LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $207.46 | $207.46 |
| 10 | $188.6 | $1,886.00 |
| 100 | $165.95 | $16,595.00 |
| 250 | $152.4 | $38,100.00 |
| 500 | $139.85 | $69,925.00 |
EP4CE75F23C9LN Overview
A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP blocks such as PLLs, DSP blocks, and embedded SRAM. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA) and are widely used for parallel data processing, custom interfacing, hardware acceleration, and glue-logic replacement. The Cyclone IV E family specifically targets cost-sensitive, high-volume, low-power applications such as industrial control, video processing, and communications line cards where ASIC NRE costs are prohibitive.
Key features of the EP4CE75F23C9LN include 4,713 logic array blocks (LABs/CLBs), 4 PLLs, 200 Kbits of distributed RAM, 274 Kbits of M9K block RAM, 200 MHz maximum internal operating frequency, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The device integrates 15 dedicated 18x18 multipliers for DSP functions and offers 4 general-purpose PLLs plus 8 I/O banks for flexible voltage-level mixing.
The Cyclone IV E architecture uses a CMOS SRAM-based configuration cell backed by 8 configuration schemes (AS, AP, FPP, PS, JTAG, etc.), enabling flexible boot from EPCS/EPCQ flash or external controllers. The F23 package variant is the largest in the EP4CE75 family and exposes the maximum user-I/O count for this device, making it the preferred choice for high-bandwidth or high-pin-count designs.
Typical applications for the EP4CE75F23C9LN include industrial motor control and PLCs, video broadcast and surveillance equipment, telecom line cards, automotive driver-assistance subsystems, medical imaging pre-processors, and embedded vision pipelines. The 200 MHz internal fabric, embedded multipliers, and external memory controller combine to support standard interfaces such as PCIe Gen1 (soft IP), Ethernet MAC, I2S, UART, and parallel LVDS camera/display links.
When designing with this device, plan power sequencing for VCCINT (1.2 V) before VCCA (2.5 V) and VCCIO (1.2-3.3 V) and provide adequate decoupling (100 nF near every VCCIO pin plus bulk 10-47 uF per bank). Quartus II / Quartus Prime is the required design toolchain; legacy projects target Quartus II 13.0sp1 or earlier, while new designs should use Quartus Prime 18.1 or later for full Cyclone IV E support.
This page consolidates distributor pricing, drop-in package-compatible alternatives, and practical Quartus design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP4CE75F23C9LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE75F23C9LN (same form factor and footprint) — differing in Process Technology, Package, Embedded 18x18 Multipliers, Speed Grade, Total RAM Bits.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE75F23C8LN
✅ Drop-In✓ In Stock
$108.5 / Unit
View Datasheet →EP4CE75F23C8N
✅ Drop-In✓ In Stock
$42.3 / Unit
View Datasheet →EP4CE75F23C8L
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP4CE75F23C7N
✅ Drop-In✓ In Stock
$136.85 / Unit
View Datasheet →EP4CE75F23I8LN
✅ Drop-In✓ In Stock
$199.5 / Unit
View Datasheet →EP4CE75F23C6N
✅ Drop-In✓ In Stock
$189.5 / Unit
View Datasheet →EP4CE75F23C9LN Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV E |
| Family | Cyclone IV E (EP4CE75) |
| Logic Elements (LEs) | 75,408 |
| Logic Array Blocks (LABs) | 4,713 |
| Total RAM Bits | 2,810,880 bits (274 Kbits M9K + 200 Kbits distributed) |
| Embedded 18x18 Multipliers | 15 |
| PLLs | 4 |
| Maximum User I/O | 292 |
| I/O Banks | 8 |
| Core Voltage (VCCINT) | 1.2 V |
| Analog Voltage (VCCA) | 2.5 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) |
| Process Technology | 60 nm CMOS, low-power |
| Maximum Internal Frequency | 265 MHz (per FindIC) / 200 MHz (typical logic) |
| Package | 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch |
| Configuration Schemes | AS, AP, FPP, PS, JTAG |
| RoHS / Lead-Free | Lead-free (per FindIC part description) |
| Mounting Type | Surface Mount |
| Speed Grade | C9 (commercial, 9 ns) |
EP4CE75F23C9LN 484-ball fbga (f23), 23 x 23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4CE75F23C9LN (484-ball fbga (f23), 23 x 23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE75F23C9LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE75F23C9LN is suitable for 7 applications: Industrial Motor Control (PMSM / ACIM FOC), Video Broadcast and Surveillance, Telecom Line Card and Protocol Bridging, Automotive Driver-Assistance (ADAS) Pre-Processor, Medical Imaging Pre-Processor (Ultrasound / Endoscope), Embedded Vision and Machine Learning Edge Inference, Industrial PLC and Edge Gateway.
Industrial Motor Control (PMSM / ACIM FOC)
The EP4CE75F23C9LN fits industrial motor control because its 15 embedded 18x18 multipliers execute field-oriented control (FOC) loops for 3-phase PMSM and ACIM drives at switching frequencies up to 100 kHz without external DSP. Its 292 user I/Os and 8 banks connect directly to 3.3 V Hall sensors, 5 V gate drivers (via level shifters), 1.5 V resolver/ADC front-ends, and CAN/RS-485 isolation barriers. The 4 PLLs synthesize the PWM carrier, ADC sample clock, and encoder quadrature clock from a single 50 MHz reference. Estimated: at 75% LE utilization with 100 kHz FOC and 4 PWM channels, total dynamic power is about 0.8 W which a 4-layer 1 oz PCB can dissipate without a heatsink.
Recommended
Video Broadcast and Surveillance
The EP4CE75F23C9LN handles video broadcast because its 292 I/Os accept parallel BT.656, LVDS-based camera-link inputs, and HDMI/DVI parallel RGB outputs without external bridge chips. The 274 Kbits of M9K block RAM plus 200 Kbits of distributed RAM build line buffers for 720p60 video processing pipelines, while the 4 PLLs generate pixel clocks up to 148.5 MHz for 1080i deinterlacing. For 1080p60, an external DDR2 SDRAM controller (Altera soft IP) attaches to the 8 I/O banks at 1.8 V SSTL. Estimated: a 720p60 deinterlacer + scaler consumes about 30% of the LEs and about 60% of the block RAM, leaving headroom for motion detection overlays.
Recommended
Telecom Line Card and Protocol Bridging
The EP4CE75F23C9LN fits telecom line cards because its 292 I/Os and 8 banks bridge legacy TDM buses (HMVIP, H.110), 1G Ethernet MACs (SGMII via soft IP), and PCIe Gen1 endpoint controllers to backplane fabrics. The 2.8 Mbits of embedded memory buffer packet headers and CRC tables without external SSRAM. The 4 PLLs derive 125 MHz SGMII, 100 MHz PCIe, and 8 kHz frame sync from a 25 MHz backplane reference. Cyclone IV E's low static power (~150 mW typical for this density) suits -48 V powered central-office slots.
Recommended
Automotive Driver-Assistance (ADAS) Pre-Processor
The EP4CE75F23C9LN suits ADAS pre-processing because its 15 DSP multipliers perform real-time Sobel/Canny edge detection on 1-megapixel camera frames at 30 fps. The 8 banks interface to MIPI-CSI2 (via external bridge) and parallel LVDS automotive cameras at 1.8 V, while the 2.8 Mbits of block RAM hold 3-frame deep history for collision-warning algorithms. Designers pair it with an external -40C to +105C-qualified DDR2 for sensor fusion. The C9 commercial temperature grade is acceptable for cabin-mounted ECUs; for front-camera units use the EP4CE75F23I8LN industrial variant instead.
Recommended
Medical Imaging Pre-Processor (Ultrasound / Endoscope)
The EP4CE75F23C9LN fits medical imaging because its 15 DSP multipliers perform beamforming and envelope detection on 32-channel ultrasound arrays at 80 MHz sampling rate. The 2.8 Mbits of block RAM store scan-line buffers and lookup tables for grayscale mapping, eliminating external SRAM. The 8 I/O banks connect to 12-bit ADCs at 1.8 V LVCMOS and to LVDS-based color-endoscope sensors. Quartus Prime's medical-grade timing analysis (with medical-grade speed files) supports IEC 62304 verification. Estimated: a 32-channel beamformer occupies about 45% of the LEs and 70% of the multipliers, leaving room for color-Doppler post-processing.
Recommended
Embedded Vision and Machine Learning Edge Inference
The EP4CE75F23C9LN serves embedded-vision edge inference because its 75,408 LEs and 15 DSP multipliers run small CNN accelerators (e.g., quantized MobileNet) at 5-10 frames per second on 96x96 inputs. The 2.8 Mbits of block RAM caches the first three CNN layers' weights, reducing external DDR pressure. The 4 PLLs synthesize 200 MHz fabric clocks and 50 MHz image-sensor clocks. For higher throughput designs, designers pair two EP4CE75 devices in a master-slave configuration sharing a DDR2 SODIMM. This FPGA class sits below the Intel Cyclone V SoC but above microcontrollers, giving cost-effective edge AI without an OS.
Recommended
Industrial PLC and Edge Gateway
The EP4CE75F23C9LN fits PLC and edge-gateway applications because its 292 I/Os connect to 24 V industrial sensors (via optocouplers), 4-20 mA analog inputs (via external ADCs), Modbus RS-485, EtherCAT, and PROFINET ports. The 75,408 LEs execute IEC 61131-3 logic, PID loops, and OPC-UA protocol stacks concurrently. The 8 banks mix 5 V tolerant (limited via level shifters) and 3.3 V LVCMOS peripherals, while the 4 PLLs derive the EtherCAT 100 MHz distributed clock from a 25 MHz TCXO. Designers add an EPCQ flash for fail-safe firmware update per IEC 61131-3.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE75F23C9LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE75F23C8LN | EP4CE75F23C8N | EP4CE75F23C8L | EP4CE75F23C7N | EP4CE75F23I8LN | EP4CE75F23C6N |
|---|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (F23) 23x23 mm | 484-ball FBGA (F23) 23x23 mm - same | 484-ball FBGA (F23) 23x23 mm - same | 484-ball FBGA (F23) 23x23 mm - same | 484-ball FBGA (F23) 23x23 mm - same | 484-ball FBGA (F23) 23x23 mm - same | 484-ball FBGA (F23) 23x23 mm - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 75,408 | 75,408 | 75,408 | 75,408 | 75,408 | 75,408 | 75,408 |
| Speed Grade | C9 (9 ns, 265 MHz) | C8 (8 ns, ~290 MHz) | C8 (8 ns, ~290 MHz) | C8 (8 ns, ~290 MHz) | C7 (7 ns) | I8 (industrial, 8 ns) | C6 (6 ns, fastest) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C |
| Total RAM Bits | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits |
| DSP 18x18 Multipliers | 15 | 15 | 15 | 15 | 15 | 15 | 15 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Max User I/O | 292 | 292 | 292 | 292 | 292 | 292 | 292 |
Key Differentiators
- Largest LE count in EP4CE75 family with maximum 292 I/O (vs EP4CE55F23C9LN)
- C9 commercial speed grade optimized for cost-sensitive designs (vs EP4CE75F23C8LN)
- Commercial 0C to +85C temperature range vs industrial option (vs EP4CE75F23I8LN)
Design Notes
Power sequencing for the EP4CE75F23C9LN must follow Intel's Cyclone IV Device Handbook: VCCINT (1.2 V core) ramps before or simultaneously with VCCA (2.5 V analog PLL supply) and VCCIO (1.2-3.3 V per bank). Place a 100 nF X7R 0402 decoupling cap within 2 mm of every VCCINT and VCCIO pin, plus a single 47 uF X5R bulk cap per bank. Use a dedicated LDO (e.g., TI TPS7A4701) for VCCA to keep PLL jitter under 200 ps. Estimated: at 75% LE utilization and 200 MHz fabric clock, ICCINT is approximately 0.7 A plus 50 mA per enabled PLL.
The F23 484-ball FBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 18 C/W on a 4-layer 1 oz JEDEC test board, dropping to about 12 C/W with a 6-layer 2 oz board and thermal vias in the central ball grid. Estimated: at full LE+block-RAM+15-multiplier activity the device dissipates about 1.5 W, producing a 27 C junction rise above ambient on a 4-layer board. For industrial enclosures above 60 C ambient, down-clock the fabric to 150 MHz or move to the EP4CE75F23I8LN industrial grade.
Route all 8 I/O banks as separate voltage islands; never short VCCIO pins from different banks. Place external memory (DDR2 SDRAM) within 25 mm of the FPGA to keep SSTL traces matched within +/- 25 ps. Use 100 ohm differential impedance for LVDS pairs and 50 ohm single-ended for LVCMOS. The F23 package's 1.0 mm ball pitch requires NSMD (non-solder-mask-defined) pads with a 0.5 mm diameter and a 0.27 mm laser-drilled microvia to the inner layer.
Do not confuse the EP4CE75F23C9LN (F23 484-ball) with the EP4CE75F29C9LN (F29 484-ball) - the F23 and F29 pinouts are NOT compatible because the F29 package exposes additional power/ground balls for higher I/O count variants. Also, do not assume the C9 speed grade is fast enough for 200 MHz DDR2 interfaces; use the C8 or C7 grade for memory controllers running at full rate. Finally, the EP4CE75 family does NOT support PCIe Gen2 hard IP - external PHY is required.
Cyclone IV E LVDS receivers require a 100 ohm differential termination across the pair, placed within 7 mm of the FPGA pin. For SSTL-18 DDR2 interfaces, enable on-die termination (OCT) for the FPGA-side drivers and place a 50 ohm to VTT at the SDRAM side. Series damping resistors of 33 ohm on high-speed clock outputs reduce overshoot below 200 mV. The 4 PLLs should each have their own filtered 2.5 V analog supply to minimize inter-PLL jitter coupling.
Compliance Information
RoHS compliant and lead-free per FindIC FBGA-484 datasheet description. Not AEC-Q100 qualified - automotive designs should use the EP4CE75F23I8LN industrial variant. Halogen-free status not confirmed in available data.
