EP4CE55F23I8LN - 55K FPGA, 484-BGA | Altera | Embedded Logic
MPN: EP4CE55F23I8LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $236 | $236.00 |
| 10 | $224.2 | $2,242.00 |
| 100 | $200.6 | $20,060.00 |
| 500 | $188.8 | $94,400.00 |
| 1,000 | $177 | $177,000.00 |
| 3,000 | $165.2 | $495,600.00 |
EP4CE55F23I8LN Overview
A field-programmable gate array is a semiconductor device containing programmable logic blocks, programmable interconnects, and configurable I/O cells. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing to implement combinational logic, sequential state machines, interfaces, digital signal processing, and bus controllers. Within the semiconductor hierarchy, it belongs to programmable logic, then digital logic, then integrated circuits. Cyclone IV E devices are positioned as low-cost, low-power FPGAs for high-volume and cost-sensitive systems.
The headline capacity of EP4CE55F23I8LN includes 55,856 logic elements, 2,396,160 bits of embedded memory, and 324 maximum user I/O pins. The 60 nm process and 1.2 V supply value are reported in the supplied specification data. The 484-BGA package provides a high-density surface-mount interface for complex designs, but its fine-pitch ball array requires controlled PCB fabrication, assembly, inspection, and power-delivery design. The MPN suffix I8 indicates the industrial ordering variant, although complete electrical and environmental limits are not included in the provided snippets.
Cyclone IV E architecture is suitable for designs requiring flexible logic, embedded memory blocks, configurable I/O, and hardware parallelism. The device can implement custom bridges, control logic, test fixtures, and low-to-moderate throughput signal processing without requiring a mask revision. The supplied data does not expose operating frequency, transceiver count, block RAM organization, phase-locked-loop count, or exact I/O bank assignments; those values are marked as needed elsewhere rather than inferred from the family name.
Typical applications include industrial control and automation, communications infrastructure, video or image-interface bridging, test and measurement equipment, and custom embedded controllers. Its 55,856 logic elements provide capacity for parallel datapaths and multiple peripheral controllers, while 324 maximum user I/O pins support wide external interfaces. Designers must partition logic carefully, verify memory and timing resources, and confirm that the selected package, ball map, configuration interface, and I/O voltage requirements match the PCB.
A primary design trade-off is density versus verification effort. Increasing FPGA utilization can improve integration, but reduces timing margin, routing freedom, power headroom, and design headroom. Review the manufacturer documentation, Intel/Altera device-support resources, configuration schematic, and PCB escape routing before release to fabrication. The exact package drawing and full pinout should be taken from the manufacturer data because the provided web data confirms 484 balls but does not provide a reliable per-ball table.
This page combines verified MPN capacity, package, process, memory, I/O, stock, and datasheet information with application guidance, selection constraints, and a drop-in-alternative review. It distinguishes the 484-BGA EP4CE55F23I8LN from parts with different packages, densities, temperature grades, or speed grades that cannot safely be treated as direct replacements.
Drop-in alternatives for EP4CE55F23I8LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE55F23I8LN (same form factor and footprint) — differing in Package, Temperature Grade, RoHS Status, Speed Grade, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE55F23I8L
✅ Drop-In✓ In Stock
$143.43 / Unit
View Datasheet →EP4CE55F23I7N
✅ Drop-In✓ In Stock
$119.6 / Unit
View Datasheet →EP4CE55F23I7
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP4CE55F23C9LN
✅ Drop-In✓ In Stock
$110.45 / Unit
View Datasheet →EP4CE55F23C8N
✅ Drop-In✓ In Stock
$74 / Unit
View Datasheet →EP4CE55F23I8LN Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Product Family | Cyclone IV E |
| Logic Elements | 55,856 |
| Logic Cell / Logic Blocks | 47 |
| Embedded Memory | 2,396,160 bits |
| Maximum User I/O | 324 pins |
| Process Technology | 60 nm |
| Supply Voltage | 1.2 V |
| Package | 484-BGA |
| Package Code | BGA |
| Terminal Count | 484 balls |
| Package Body Material | Plastic/Epoxy |
| Package Shape | Square |
| Temperature Grade | Industrial grade |
| Configuration Technology | SRAM-based programmable logic |
| RoHS Compliance | unknown |
| REACH Compliance | unknown |
| AEC-Q100 Qualification | not_applicable |
| Lead-Free Status | unknown |
| Halogen-Free Status | unknown |
EP4CE55F23I8LN square Pin Configuration Guide
Pin configuration for EP4CE55F23I8LN (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE55F23I8LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE55F23I8LN is suitable for 6 applications: Industrial Control and Automation, Communications Infrastructure, Video and Image Interface Bridging, Test and Measurement Equipment, Embedded Digital Signal Processing, Custom Embedded Controller.
Industrial Control and Automation
EP4CE55F23I8LN is a strong candidate for industrial control systems that need configurable logic for motor-control sequencing, sensor aggregation, machine safety interfaces, and communications. Its verified 55,856 logic elements support multiple state machines, protocol handlers, timers, and control datapaths in one device. The 2,396,160 bits of embedded memory can support buffering and intermediate data storage, while the 324 maximum user I/O pins can connect to wide sensor, actuator, and backplane interfaces. Use the FPGA between low-level industrial peripherals and a processor or supervisory controller. The device can implement deterministic I/O handling, protocol conversion, custom timing, and parallel control while allowing field updates through reconfiguration. The 1.2 V supply value and industrial-grade ordering designation are verified, but exact I/O voltage rules, temperature limits, clocking resources, and timing characteristics must be taken from the manufacturer documentation. Confirm the 484-BGA escape, decoupling, configuration circuit, and signal-integrity design before layout release.
Recommended
Communications Infrastructure
EP4CE55F23I8LN can support communications infrastructure functions such as interface adaptation, packet buffering, clock-domain management, and custom protocol handling. Its 55,856 logic elements provide capacity for parallel datapaths, while 2,396,160 bits of embedded memory can be used for FIFOs, lookups, and temporary frame storage. The 324 maximum user I/O pins help connect multiple narrow or wide external interfaces without immediately forcing a larger FPGA, although the usable number depends on I/O bank, voltage, and package constraints. A practical design can place a Cyclone IV E FPGA between a network processor, line-card transceivers, and control or management logic. Implement protocol-specific framing, error handling, rate adaptation, and monitoring in programmable hardware while retaining software flexibility. The supplied data does not verify transceiver count, maximum clock rate, or specific memory-interface standards, so timing closure and signal integrity must be established from the relevant Cyclone IV E documentation and the actual board implementation. Validate the 484-BGA power distribution and high-speed escape strategy early.
Recommended
Video and Image Interface Bridging
EP4CE55F23I8LN is suitable for configurable video or image-interface bridges where multiple timing domains, data formats, and control paths must be adapted. The verified 55,856 logic elements can implement pixel formatting, timing generation, synchronization, frame buffering control, and protocol adaptation. The 2,396,160 bits of embedded memory support small FIFOs, line buffers, and lookup structures, while the 324 maximum user I/O pins can accommodate parallel camera, display, or control interfaces when the I/O bank plan permits. Use the FPGA to translate between a sensor or display interface and an application processor, FPGA SoC, or custom image-processing block. Programmable logic can absorb nonstandard resolutions, handshaking rules, and timing requirements without changing the PCB for a protocol change. The supplied results do not verify a specific maximum pixel clock, supported display standard, or memory bandwidth, so those values require the manufacturer’s I/O and timing documentation. Confirm differential-pair placement, clock routing, frame timing, and 484-BGA signal integrity before fabrication.
Recommended
Test and Measurement Equipment
EP4CE55F23I8LN can serve as the programmable logic core of test and measurement equipment, where acquisition, stimulus, timing, and control functions are often customized. Its 55,856 logic elements support counters, pattern generators, digital filters, trigger logic, and instrument-control interfaces. The 2,396,160 bits of embedded memory provide capacity for waveform samples, capture buffers, and calibration data, while the 324 maximum user I/O pins allow connection to ADC/DAC control, relays, reference clocks, and service interfaces. Place the FPGA close to the measurement front end and use its programmable fabric to coordinate acquisition timing, data qualification, and downstream transport. The device can combine deterministic hardware control with later logic revisions, which is useful for evolving test platforms. Exact sampling performance, supported I/O standards, maximum operating frequency, and timing specifications are not present in the supplied data and must not be inferred. Validate the complete datasheet, clock tree, power integrity, thermal environment, and 484-BGA layout before committing the design.
Recommended
Embedded Digital Signal Processing
EP4CE55F23I8LN is applicable to embedded digital signal processing that benefits from parallel, deterministic hardware execution. The 55,856 logic elements can implement arithmetic datapaths, filters, encoders, decoders, and control logic, while the 2,396,160 bits of embedded memory can provide sample, coefficient, and intermediate-result storage. The 324 maximum user I/O pins allow integration with multiple data converters, processors, and control peripherals. The exact DSP capability, embedded multiplier count, clock limits, and throughput are not included in the supplied results and require manufacturer validation. A useful architecture can split the workload between FPGA datapaths and a host processor: use the FPGA for deterministic filtering, framing, buffering, and real-time control, then transfer processed results over a defined interface. This arrangement is useful for instrumentation, communications, and industrial processing. Confirm the actual device resources, I/O standards, timing constraints, and toolchain support from the current Cyclone IV E documentation. Use simulation and static timing analysis with the selected speed-grade and temperature conditions before hardware release.
Recommended
Custom Embedded Controller
EP4CE55F23I8LN can consolidate a custom embedded controller when a fixed microcontroller does not provide enough parallel I/O, timing flexibility, or protocol customization. Its 55,856 logic elements support timers, pulse generation, state machines, interface controllers, and small processing datapaths. The 2,396,160 bits of embedded memory can hold buffers, lookup tables, and control data, while the 324 maximum user I/O pins provide extensive connectivity for sensors, memories, actuators, and host interfaces. The supplied data does not specify configuration memory, supported boot modes, or exact peripheral resources. Implement the FPGA as a deterministic companion to a processor, or use it as the main controller for a tightly defined appliance. The programmable architecture allows protocol and timing changes late in development and can consolidate glue logic that would otherwise require multiple devices. The industrial-grade ordering designation makes the part appropriate for evaluation in industrial environments, subject to confirmation of the complete environmental specification. Review the 484-BGA land pattern, power sequencing, clocking, configuration interface, I/O bank assignments, and timing constraints before schematic sign-off.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE55F23I8LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE55F23I8L | EP4CE55F23I7N | EP4CE55F23C9LN | EP4CE55F23C8N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 484-BGA | 484-BGA | 484-BGA | 484-BGA | 484-BGA |
| Ordering Grade | I8 industrial variant | I8 ordering variant; final-code difference not quantified | I7N ordering variant; difference not quantified | C9LN ordering variant; difference not quantified | C8N ordering variant; difference not quantified |
| Pinout and Package Compatibility | 484-BGA, 484 terminals | Same 484-BGA package reported; full pin compatibility not verified | Same 484-BGA package reported; full pin compatibility not verified | Same 484-BGA package reported; full pin compatibility not verified | Same 484-BGA package reported; full pin compatibility not verified |
Key Differentiators
- Higher verified logic capacity than a same-family lower-density option (vs EP4CE40F29I8LN)
- Large verified embedded-memory capacity (vs EP4CE40F23I8LN)
- High user-I/O ceiling (vs EP4CE40F23I8L)
- Explicit F23 package ordering identifier (vs EP4CE40F29A7N)
Design Notes
EP4CE55F23I8LN uses a 1.2 V supply value in the verified data, but the supplied source does not expose the complete power-tree limits, current requirements, rail tolerances, or power-up sequencing. Do not design the regulator solely from the nominal value. Obtain the manufacturer’s electrical characteristics and recommended power-supply circuit, then verify startup, monotonicity, transient response, decoupling, and current capacity on the bench. Treat all unprovided rail values as [DATA_NEEDED: power architecture details] rather than estimates.
The 484-BGA package requires an official land pattern, exact ball map, via escape, and assembly drawing from the manufacturer data. Place decoupling and configuration components close to their associated balls, maintain continuous reference planes, and route clock and high-speed differential signals according to the Cyclone IV E I/O guidance. The supplied data confirms 484 balls but does not provide a reliable per-ball table; never infer pin names or bank assignments from the MPN.
Thermal design must use the manufacturer junction-to-air, junction-to-case, board-dependent, and environmental data, none of which is included in the supplied snippets. Provide a continuous ground or appropriate reference plane, controlled copper spreading, adequate airflow, and thermal vias where the official package and PCB guidance permits them. Validate worst-case activity, I/O loading, ambient temperature, and enclosure conditions. No junction-temperature or dissipation calculation is made because the required thermal inputs and operating limits are [DATA_NEEDED: thermal data].
A common substitution error is treating another EP4CE55 order code as an automatic drop-in replacement because it has the same family and 484-BGA package. The supplied cross-reference data does not verify equal speed grade, temperature grade, I/O behavior, configuration, or timing. Validate the complete orderable part number against the manufacturer ordering guide, compare package markings, rerun synthesis and static timing analysis, and confirm the PCB land pattern and configuration circuit before approving a replacement.
Compliance Information
The supplied web data does not verify RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 status. The MPN is identified as an industrial-grade ordering variant, but this does not establish automotive qualification. Compliance values remain unknown rather than assumed.
