EP4CE75F29C6 - Cyclone IV E FPGA, 75K LE, F29 BGA-780 | Intel
MPN: EP4CE75F29C6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $178.5 | $178.50 |
| 10 | $162.3 | $1,623.00 |
| 100 | $148.75 | $14,875.00 |
| 500 | $138.2 | $69,100.00 |
| 1,000 | $129.9 | $129,900.00 |
EP4CE75F29C6 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built from a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit within the broader category of programmable logic devices (PLDs) alongside CPLDs, and occupy the same hierarchy as ASICs and ASSPs - but unlike ASICs they can be reconfigured in the field after manufacture. The Cyclone IV E family specifically targets cost-sensitive, high-volume applications where power efficiency and signal integrity matter more than the highest logic density, making it part of Intel's (formerly Altera's) mainstream FPGA portfolio.
Key features include 7,950 total registers, 274 embedded 18x18 multipliers, 295 Kbits of distributed RAM, support for 66 MHz PCI, and 8-input look-up tables (LUTs) per logic element. Configuration options include Active Serial (AS), Passive Serial (PS), JTAG, and Fast Passive Parallel (FPP) modes, all using the dedicated 1.2 V core supply. The F29 package is the largest in the EP4CE75 family, exposing the full I/O count and 8 transceiver clock inputs needed for high-pin-count designs.
Typical applications span industrial motor control, video processing and image sensing pipelines, software-defined radio (SDR), factory automation HMI controllers, automotive driver assistance subsystems, and low-cost communications infrastructure. Designers choose the EP4CE75F29C6 over smaller Cyclone IV E variants when their logic utilization approaches 60K LE or when they need the full 426 I/O for parallel sensor, memory, or bus aggregation.
When designing with this device, ensure the PCB uses a 14-layer stack-up with 0.8 mm BGA pitch escape, and follow Intel's JTAG chain recommendations for in-system programming. Designers should also confirm Quartus Prime support status: the latest Quartus Prime Lite Edition supports Cyclone IV E through version 20.1, and Intel has officially transitioned Cyclone IV E to a mature-product lifecycle - plan sourcing accordingly.
Drop-in alternatives for EP4CE75F29C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE75F29C6 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE75F29C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$152.7 / Unit
View Datasheet →EP4CE75F29C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$149.75 / Unit
View Datasheet →EP4CE75F29I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$540 / Unit
View Datasheet →EP4CE115F29C7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP4CE55F29C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$138 / Unit
View Datasheet →EP3SL50F780C2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$199.95 / Unit
View Datasheet →EP4CE75F29C6 Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements | 75,408 |
| Total Registers | 7,950 |
| Embedded Memory (bits) | 2,810,880 |
| Embedded Multipliers (18x18) | 274 |
| Maximum User I/O Pins | 426 |
| PLLs | 4 |
| Global Clock Networks | 15 |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm low power |
| Package | 780-ball FineLine BGA (F29, 29x29 mm) |
| Operating Temperature | 0C to +85C (Commercial) |
| Configuration Modes | AS / PS / JTAG / FPP |
| Memory Controller | DDR / DDR2 / QDRII SRAM |
| RoHS Status | Compliant |
EP4CE75F29C6 780-ball fineline bga (f29, 29x29 mm) Pin Configuration Guide
Pin configuration for EP4CE75F29C6 (780-ball fineline bga (f29, 29x29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE75F29C6.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE75F29C6 is suitable for 7 applications: Industrial Motor Control, Video Processing and Image Aggregation, Software-Defined Radio (SDR) Baseband, Factory Automation and PLC Controllers, Automotive Driver Assistance (ADAS) Subsystems, Medical Imaging Front-End, Low-Cost Communications Infrastructure.
Industrial Motor Control
The EP4CE75F29C6's 75,408 logic elements and 274 embedded 18x18 multipliers make it well-suited for multi-axis industrial motor control, where field-oriented control (FOC) loops, SVPWM generators, and encoder interfaces run in parallel. The 426 user I/Os aggregate multiple encoder inputs (QEP), Hall sensor signals, and PWM outputs for 4-6 axis drives. Its 1.2 V core and 60 nm process keep typical power dissipation below 2.5 W even at 70-80% utilization. Unlike smaller Cyclone IV E variants (EP4CE55), the EP4CE75 provides headroom for safety logic, communication stacks (EtherCAT, PROFINET), and on-chip diagnostics without timing closure issues.
Recommended
Video Processing and Image Aggregation
For video processing pipelines - including image aggregation from multiple cameras, real-time scaling, and overlay composition - the EP4CE75F29C6 offers 2.8 Mbits of embedded memory to buffer scan lines, plus 4 PLLs for pixel-clock generation across independent video streams. The 426 I/Os support parallel RGB/YCbCr interfaces up to 1080p60 at 148.5 MHz pixel clock, plus LVDS channels for high-speed serializers. Its memory controller hard IP offloads DDR2 addressing, freeing logic for compression or color-space conversion. The F29 BGA's 1.0 mm pitch is well-suited to standard 6-layer PCB stack-ups used in broadcast and surveillance equipment.
Recommended
Software-Defined Radio (SDR) Baseband
Software-defined radio baseband processing benefits from the EP4CE75F29C6's 274 embedded 18x18 multipliers, which deliver up to 274 GMACs of DSP throughput - sufficient for LTE, Wi-Fi, and proprietary OFDM waveforms at moderate bandwidths. The 4 PLLs generate independent baseband and IF clocks, while 426 I/Os handle parallel ADC/DAC interfaces and high-speed LVDS links to RF front-ends. The 2.8 Mbit embedded memory buffer is adequate for channelization FFTs up to 2K points. Compared with the EP4CE55, the EP4CE75's extra logic closes timing on wider FFT and turbo-decoder cores that would otherwise spill into slow logic paths.
Recommended
Factory Automation and PLC Controllers
The EP4CE75F29C6 serves as the programmable logic core in industrial PLCs, combining hard CPU interfaces with custom high-speed I/O. Its 426 user I/Os can directly drive dozens of isolated 24V digital inputs and PWM outputs through external buffers, while the embedded memory supports IEC 61131-3 runtime and ladder-logic interpretation. The Cyclone IV E family's long-term product lifecycle (10+ years of Intel support) makes it ideal for industrial equipment with multi-decade field deployments. Industrial designers also benefit from the EP4CE75F29I7N variant for -40C to +100C operation in harsh factory environments.
Recommended
Automotive Driver Assistance (ADAS) Subsystems
In ADAS subsystems - rear-view camera processors, surround-view aggregators, sensor-fusion pre-processors - the EP4CE75F29C6 handles multi-camera stitching, lane-detection preprocessing, and ultrasonic/radar sensor fusion. Its 4 PLLs generate independent pixel clocks for up to four camera inputs, and the embedded 18x18 multipliers accelerate Sobel and edge-detection kernels. Note that the C6 (commercial) temperature grade limits use to cabin-mounted modules; for under-hood or exterior-mounted designs, the EP4CE75F29I7N industrial variant or a Cyclone V device is required. Designers should also confirm AEC-Q100 qualification status with Intel before committing to automotive programs.
Recommended
Medical Imaging Front-End
Medical imaging front-ends - ultrasound beamformers, portable X-ray digitizers, patient-monitoring aggregators - leverage the EP4CE75F29C6's parallel DSP performance and high I/O count for real-time signal processing. The 274 18x18 multipliers handle beamforming delays and FIR filter taps across 32-128 channels, while the embedded memory buffers scan-line data before PCIe or USB offload. The 426 I/Os interface directly to analog front-end ADCs without external muxing. Designers must consider the EP4CE75F29I7N industrial-temperature variant for portable clinical equipment and validate IEC 60601 EMI/ESD performance against the device's LVDS and LVCMOS I/O structures.
Recommended
Low-Cost Communications Infrastructure
Small-cell base stations, industrial gateways, and protocol-converter appliances use the EP4CE75F29C6 for packet processing, encryption offload, and multi-standard bridging. Its embedded memory supports line-rate buffering for Gigabit Ethernet and USB 3.0 interfaces, while the 4 PLLs synthesize independent clocks for CPRI, OBSAI, or SGMII links. Compared with dedicated network processors, the EP4CE75 gives designers flexibility to add proprietary protocols without NRE. For higher-throughput aggregation switches, stepping up to Cyclone V SX or Cyclone 10 GX parts provides transceivers, but the EP4CE75 remains the lowest-cost choice for sub-Gigabit aggregation nodes.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE75F29C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE75F29C7N | EP4CE75F29I7N | EP4CE115F29C7N | EP4CE55F29C7N | EP3SL50F780C2 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FineLine BGA (F29, 29x29 mm) | 780-ball FineLine BGA (F29) - same | 780-ball FineLine BGA (F29) - same | 780-ball FineLine BGA (F29) - same | 780-ball FineLine BGA (F29) - same | 780-pin FineLine BGA (F780) - same footprint family |
| Logic Elements | 75,408 | 75,408 | 75,408 | 114,480 (+52%) | 55,488 (-26%) | 47,500 |
| Speed Grade | -6 (C6) | -7 (C7, faster) | -7 (C7, industrial temp) | -7 (C7) | -7 (C7) | -2 (C2, Stratix III) |
| Embedded Memory (bits) | 2,810,880 | 2,810,880 | 2,810,880 | 3,981,312 (+42%) | 2,396,160 (-15%) | 1,836,000 |
| Embedded 18x18 Multipliers | 274 | 274 | 274 | 266 | 156 (-43%) | 384 |
| Maximum User I/Os | 426 | 426 | 426 | 426 | 426 | 488 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | -40C to +100C (Industrial) | 0C to +85C | 0C to +85C | 0C to +85C |
Key Differentiators
- Highest I/O count in Cyclone IV E F29 BGA family (vs EP4CE75F23C6)
- Balanced DSP throughput for mid-range signal processing (vs EP4CE55F29C7N)
- Lower-cost drop-in option versus Stratix III at the same pin count (vs EP3SL50F780C2)
- Mature long-term lifecycle versus newer FPGA families (vs Cyclone V / Cyclone 10 devices)
Design Notes
The F29 BGA at 1.0 mm pitch requires a 6-layer PCB minimum with 0.5 oz copper on outer layers and 1.0 oz on inner power planes. Use a 14-mil laser-drilled microvia stack-up for breakout, or a dog-bone fan-out if cost is critical. Follow Intel AN 429 for via-in-pad recommendations - via-in-pad plating must be 25 um Cu minimum to survive lead-free reflow at 245C peak. Power plane stitching vias should be placed every 5 mm along the BGA perimeter to suppress ground bounce during simultaneous switching of LVDS I/Os.
Decoupling per Intel's Cyclone IV E PDN guidelines: 100 nF X7R 0402 caps within 50 mils of every VCCINT pin pair, 4.7 uF X5R 0805 bulk caps every 10 mm along the core rail, plus one 220 uF polymer and one 47 uF ceramic on each of VCCINT, VCCIO, and VCCA. Estimated: at 80% utilization with 100 MHz clock tree and 100 LVDS toggling I/Os, expect ICCINT ~700 mA and ICCIO ~1.2 A. Inadequate decoupling causes JTAG configuration failures and is the most common Cyclone IV E bring-up issue.
Three pitfalls cause most EP4CE75F29C6 board bring-up failures. (1) MSEL[2:0] pins not pulled to known states with 4.7 kohm resistors - leaves the device in undefined configuration mode at power-up. (2) JTAG TCK pulled up instead of down on boards with multiple JTAG devices - causes chain-scan failures; pin should have a 10 kohm pull-down. (3) Using EPCS16 with the wrong AS mode - the C6 speed grade requires DCLK output of the configuration device to be stable within 50 ns of nCONFIG release; some low-cost clones violate this spec. Always use Intel-qualified EPCQ devices for production.
Estimated: at typical 80% LE utilization with 75% toggle rate at 100 MHz, junction-to-ambient thermal resistance theta_JA of the F29 BGA is approximately 14 C/W with 0 LFM airflow, dropping to 9 C/W at 200 LFM. Power dissipation at this loading is ~2.5 W, yielding a junction temperature rise of 35-60 C above ambient - well within the 0C to +85C commercial rating for typical 25C-55C environments. For sealed enclosures with no airflow, consider the EP4CE55F29C8N variant to reduce power, or add a small heatsink bonded to the BGA top side.
Compliance Information
RoHS and REACH compliant per Intel product declaration. The C6 (commercial) speed grade is not AEC-Q100 qualified - AEC-Q100 programs must select the EP4CE75F29I7N industrial variant and confirm AEC status with Intel. Halogen-free status not stated in available data.
