EP4CGX110DF31I6N - 109K LE Cyclone IV GX FPGA 896-FBGA | Intel
MPN: EP4CGX110DF31I6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $168.5 | $168.50 |
| 10 | $152.3 | $1,523.00 |
| 100 | $135 | $13,500.00 |
| 500 | $119.75 | $59,875.00 |
| 1,000 | $108.4 | $108,400.00 |
EP4CGX110DF31I6N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic, memory and I/O behaviour is defined after manufacture by the user through a hardware description language. Cyclone IV GX sits inside Intel's low-cost Cyclone family, itself a subclass of SRAM-based programmable logic devices; the family hierarchy is FPGA -> programmable logic -> programmable logic device -> semiconductor IC. Cyclone IV GX specifically adds embedded multi-gigabit transceivers (MGTs), positioning it between the transceiver-less Cyclone IV E and the higher-cost Cyclone V GX family.
Key features include 109,424 logic elements, 5,621,760 embedded memory bits, 475 maximum user I/Os across 9 I/O banks, 66 embedded 18x18 multipliers for DSP, and up to 8 full-duplex transceiver channels supporting data rates from 600 Mbps up to 3.125 Gbps. Four general-purpose PLLs and eight transceiver PLLs provide flexible clock synthesis. The device supports multiple I/O standards including LVDS, LVCMOS, SSTL, and HSTL, with on-chip termination and dynamic phase alignment.
The Cyclone IV GX architecture combines an SRAM-based logic fabric with hard PCIe Gen1 (x1/x4) IP cores, hard memory controllers, and embedded transceivers, eliminating external PHY components for many common interfaces. The 60 nm process keeps static and dynamic power low versus 90 nm predecessors, while preserving deterministic timing closure with the Quartus II / Quartus Prime design suite. Each transceiver channel contains its own PMA, PCS, and bit-error-rate test (BERT) hardware.
Typical applications include industrial machine vision, low-cost PCIe endpoint cards, wireless baseband preprocessing, video bridging and display controllers, motor control, and military/aerospace digital signal processing. Transceivers support SRIO, CPRI, OBSAI, PCIe Gen1, and custom serial protocols. This page synthesizes distributor pricing, drop-in package-compatible variants, and practical Quartus design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP4CGX110DF31I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX110DF31I6N (same form factor and footprint) — differing in Package, Speed Grade, Transceivers, Process Technology, PLLs.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX110DF31I7N
✅ Drop-In✓ In Stock
$192.4 / Unit
View Datasheet →EP4CGX110DF31C8N
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View Datasheet →EP4CGX110DF31C7N
✅ Drop-In✓ In Stock
$112.4 / Unit
View Datasheet →EP4CGX110DF31C6N
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$175 / Unit
View Datasheet →EP4CGX110DF31C8
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$235.8 / Unit
View Datasheet →EP4CGX110DF27I8N
✅ Drop-In✓ In Stock
$108.9 / Unit
View Datasheet →EP4CGX110DF31I6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements | 109,424 |
| Embedded Memory Bits | 5,621,760 |
| Maximum User I/Os | 475 |
| Embedded 18x18 Multipliers | 66 |
| Transceiver Channels | 8 (max) |
| Max Transceiver Data Rate | 3.125 Gbps |
| General-purpose PLLs | 4 |
| Global Clock Networks | 20 |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm |
| Package | 896-BGA (FineLine BGA) |
| Operating Temperature | -40C to +100C (Industrial) |
| Configuration | SRAM-based, supports Active Serial (AS), Passive Serial (PS), JTAG |
| Hard PCIe Gen1 IP | Yes (x1/x4) |
| RoHS Status | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020) |
EP4CGX110DF31I6N 896-bga (fineline bga) Pin Configuration Guide
Pin configuration for EP4CGX110DF31I6N (896-bga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX110DF31I6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX110DF31I6N is suitable for 6 applications: Industrial Machine Vision, Low-Cost PCIe Endpoint Cards, Wireless Baseband Preprocessing, Video Bridging and Display Controllers, Motor Control and Industrial Drives, Military and Aerospace Digital Signal Processing.
Industrial Machine Vision
The EP4CGX110DF31I6N fits industrial machine vision because its 109,424 logic elements and 66 embedded 18x18 multipliers deliver the parallel pixel pipelines needed for real-time image processing at GigE Vision frame rates. The 475 user I/Os support simultaneous connection to MIPI CSI-2 image sensors, LVDS camera links, and Gigabit Ethernet output streams without external bridging ASICs. The -40C to +100C industrial temperature rating allows deployment in factory-floor enclosures where ambient temperatures regularly exceed 70C. Eight transceiver channels at 3.125 Gbps each enable CoaXPress or 10 Gigabit Ethernet aggregation, eliminating frame-buffer bottlenecks. Designers typically use Quartus II 13.1 with the VIP (Video and Image Processing) suite to accelerate Bayer demosaicing, color-space conversion, and edge detection at line-rate.
Recommended
Low-Cost PCIe Endpoint Cards
The EP4CGX110DF31I6N integrates hard PCIe Gen1 IP cores (x1, x2, x4 at 2.5 Gbps per lane) directly in silicon, eliminating the need for a soft PCIe core and saving approximately 4-6K logic elements that designers can repurpose for application logic. The 8 transceiver channels allow simultaneous PCIe plus additional serial links such as SRIO or Aurora for data-acquisition cards. The 5,621,760 bits of embedded memory provide sufficient buffer for DMA scatter-gather descriptors and burst-mode payload staging. Industrial temperature grade ensures reliable operation in server-room and edge-compute environments. Reference designs for PCIe x4 endpoint using the Cyclone IV GX hard IP are available in AN 456 and AN 508 on the Intel FPGA support page.
Recommended
Wireless Baseband Preprocessing
The EP4CGX110DF31I6N serves wireless baseband preprocessing because its 66 embedded 18x18 multipliers accelerate the FFT/iFFT, channel estimation, and digital up/down-conversion stages of small-cell and picocell base stations. The 8 transceivers support CPRI (up to 3.125 Gbps) and OBSAI links to a baseband SoC, while 5.6 Mbits of embedded memory buffers digitized IQ samples for pipelined DSP. Industrial temperature operation and proven long-life silicon make it suitable for outdoor small-cell enclosures. Designers pair it with TI AFE chipsets (e.g., AFE7950) to build complete multi-standard radio front ends. Quartus DSP Builder simplifies model-based DSP integration with MATLAB/Simulink.
Recommended
Video Bridging and Display Controllers
The EP4CGX110DF31I6N fits video bridging because its 475 user I/Os accept multiple parallel LVDS input streams and the 109K logic elements drive real-time color-space conversion, scaling, and chroma resampling without external frame buffers for sub-1080p rates. The 8 transceivers can drive DisplayPort 1.1 (2.7 Gbps) or HDMI 1.4 (3.4 Gbps) over redrivers, allowing dual-display matrix-switch products. 5.6 Mbits embedded memory serves as line buffer for video wall stitching. Industrial temperature rating supports digital-signage and broadcast environments. Reference designs in AN 558 illustrate SDI-to-HDMI bridging using Cyclone IV GX transceivers.
Recommended
Motor Control and Industrial Drives
The EP4CGX110DF31I6N suits motor control because its 475 user I/Os drive parallel three-phase PWM outputs, encoder interfaces (EnDat 2.2, BISS, Tamagawa), and fieldbus links simultaneously, while the 66 multipliers handle Park/Clarke transforms, SVPWM, and field-oriented control loops at 16 kHz+ switching frequencies. Industrial -40C to +100C operation ensures reliability on the shop floor where ambient temperatures reach 85C inside IP65 enclosures. Optional transceivers enable EtherCAT or SERCOS III master/slave nodes using ET1100 ASICs. 5.6 Mbits of embedded memory stores current/torque observer tables. Reference firmware in the Cyclone IV Motor Control reference design accelerates time-to-market.
Recommended
Military and Aerospace Digital Signal Processing
The EP4CGX110DF31I6N supports defense applications because the Cyclone IV GX family has been qualified to industrial and military temperature ranges and offers long-term availability commitments, plus the 109K logic elements run encrypted signal-processing pipelines for SIGINT, radar preprocessing, and electronic-warfare subsystems. The 8 transceivers handle custom serial links to RF ADCs/DACs, while 66 embedded multipliers accelerate pulse compression and digital beamforming. Designers pair the FPGA with TI ADC32RF45 or ADI AD9680 high-speed converters for direct-RF sampling platforms. Ruggedized 896-FBGA packages meet shock and vibration requirements for airborne platforms. BIT and SEU mitigation IP is available through third-party vendors like Frontgrade (formerly Cobham Advanced Electronic Solutions).
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX110DF31I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX110DF31I7N | EP4CGX110DF31C8N | EP4CGX110DF31C7N | EP4CGX110DF31C6N | EP4CGX110DF31C8 | EP4CGX110DF27I8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 896-BGA (FineLine BGA, F31) | 896-BGA (FineLine BGA, F31) - same | 896-BGA (FineLine BGA, F31) - same | 896-BGA (FineLine BGA, F31) - same | 896-BGA (FineLine BGA, F31) - same | 896-BGA (FineLine BGA, F31) - same | 896-BGA (FineLine BGA, F27) - verify pinout compatibility |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 |
| Speed Grade | I6 (industrial, speed 6) | I7 (industrial, speed 7 - faster) | C8 (commercial, speed 8 - fastest) | C7 (commercial, speed 7) | C6 (commercial, speed 6 - matches I6) | C8 (commercial, speed 8) | I8 (industrial, speed 8) |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C |
| Transceiver Channels | 8 (max 3.125 Gbps) | 8 (max 3.125 Gbps) | 8 (max 3.125 Gbps) | 8 (max 3.125 Gbps) | 8 (max 3.125 Gbps) | 8 (max 3.125 Gbps) | 8 (max 3.125 Gbps) |
| Hard PCIe Gen1 IP | Yes (x1/x4) | Yes (x1/x4) | Yes (x1/x4) | Yes (x1/x4) | Yes (x1/x4) | Yes (x1/x4) | Yes (x1/x4) |
| Embedded Memory (bits) | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 |
| Embedded 18x18 Multipliers | 66 | 66 | 66 | 66 | 66 | 66 | 66 |
| Max User I/Os | 475 | 475 | 475 | 475 | 475 | 475 | 364 (F27 package has fewer pins) |
Key Differentiators
- Hard PCIe Gen1 IP core integrated in silicon (vs EP4CE115F29C8N (Cyclone IV E))
- Eight 3.125 Gbps transceiver channels in a single device (vs EP4CE115F29C8N (Cyclone IV E))
- Industrial temperature rating with full logic density (vs EP4CGX110DF31C8N (commercial grade))
- Speed grade 6 enables lower power than faster grades (vs EP4CGX110DF31C8N (speed grade 8))
Design Notes
Estimated: at full transceiver activity (8 channels at 3.125 Gbps) and 75% logic utilization, the EP4CGX110DF31I6N core can consume 3-5 W. The 896-FBGA package has theta_JB of approximately 4 C/W; with proper thermal-via array and 4-layer PCB with 2 oz copper on outer layers, theta_JA falls to 8-12 C/W. Industrial-grade operation at +100C requires thermal simulations under worst-case ambient, not just typical. Use the Intel PowerPlay Early Power Estimator (EPE) spreadsheet for accurate budgeting before PCB layout commitment.
Decouple each transceiver channel with 0.1 uF X7R 0402 capacitors within 100 mils of the dedicated VCCT/GND pins. Route high-speed serial traces as 100 ohm differential with intra-pair length matching under 5 mils and pair-to-pair skew under 50 mils. Keep the reference plane continuous under transceivers; via-stitching every 100 mils along the channel edges. Reference Intel Cyclone IV GX transceiver user guide for full layout checklists including AC coupling capacitor placement and refclk routing.
Do not assume EP4CGX110DF31I6N pinout is compatible with F27 (EP4CGX110DF27xxx) or F23 (EP4CGX110CF23xxx) variants - the 896-FBGA F31, 484-FBGA F23, and 256-FBGA F27 packages have different ball maps. Confirm ball coordinates against the Quartus II pin-out file before PCB layout. The "I6N" suffix denotes industrial grade AND lead-free (Pb-free); the "C8" without N may indicate lead-bearing, which is unsuitable for RoHS-compliant reflow profiles.
Configure the EP4CGX110DF31I6N via Active Serial (AS) mode using an EPCS16 or EPCS64 configuration device for fastest boot, or via JTAG for prototyping. The configuration time for a full 109K-LE design with 5.6 Mbit memory is approximately 25 ms using EPCS64 in AS mode. Ensure CONFIG_DONE, nCONFIG, and nSTATUS pins are properly pulled up with 10 kohm resistors; floating CONFIG_DONE is a common cause of intermittent boot failures.
Compliance Information
RoHS-compliant per Intel Cyclone IV GX product page; the trailing 'N' suffix denotes lead-free reflow compatibility per JEDEC J-STD-020 MSL-3. AEC-Q100 not applicable (industrial grade only; automotive would require specific Q-grade screening). Halogen-free status not explicitly stated in retrieved data.