Intel

EP4CGX110DF31I6N - 109K LE Cyclone IV GX FPGA 896-FBGA | Intel

MPN: EP4CGX110DF31I6N ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 896-BGA (FineLine BGA) Package 20 Speed 5,621,760 Memory
From $108.4 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $168.5 $168.50
10 $152.3 $1,523.00
100 $135 $13,500.00
500 $119.75 $59,875.00
1,000 $108.4 $108,400.00
ℹ️ All prices are in USD

EP4CGX110DF31I6N Overview

The Intel (formerly Altera) EP4CGX110DF31I6N is a high-density Cyclone IV GX FPGA built on a 60 nm low-power process, offering 109,424 logic elements, 5,621,760 bits of embedded memory, and 475 user I/O pins in a 896-ball FineLine BGA (FBGA) package. The device integrates up to eight high-speed transceiver channels (3.125 Gbps), 66 embedded multipliers (18x18), and four general-purpose PLLs, delivering an optimal balance of logic density, DSP capability, and serial connectivity for cost-sensitive applications. Operating from a 1.2 V core supply with -40C to +100C industrial temperature range, the device targets protocols such as PCIe Gen1, Gigabit Ethernet, and CPRI.

A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic, memory and I/O behaviour is defined after manufacture by the user through a hardware description language. Cyclone IV GX sits inside Intel's low-cost Cyclone family, itself a subclass of SRAM-based programmable logic devices; the family hierarchy is FPGA -> programmable logic -> programmable logic device -> semiconductor IC. Cyclone IV GX specifically adds embedded multi-gigabit transceivers (MGTs), positioning it between the transceiver-less Cyclone IV E and the higher-cost Cyclone V GX family.

Key features include 109,424 logic elements, 5,621,760 embedded memory bits, 475 maximum user I/Os across 9 I/O banks, 66 embedded 18x18 multipliers for DSP, and up to 8 full-duplex transceiver channels supporting data rates from 600 Mbps up to 3.125 Gbps. Four general-purpose PLLs and eight transceiver PLLs provide flexible clock synthesis. The device supports multiple I/O standards including LVDS, LVCMOS, SSTL, and HSTL, with on-chip termination and dynamic phase alignment.

The Cyclone IV GX architecture combines an SRAM-based logic fabric with hard PCIe Gen1 (x1/x4) IP cores, hard memory controllers, and embedded transceivers, eliminating external PHY components for many common interfaces. The 60 nm process keeps static and dynamic power low versus 90 nm predecessors, while preserving deterministic timing closure with the Quartus II / Quartus Prime design suite. Each transceiver channel contains its own PMA, PCS, and bit-error-rate test (BERT) hardware.

Typical applications include industrial machine vision, low-cost PCIe endpoint cards, wireless baseband preprocessing, video bridging and display controllers, motor control, and military/aerospace digital signal processing. Transceivers support SRIO, CPRI, OBSAI, PCIe Gen1, and custom serial protocols. This page synthesizes distributor pricing, drop-in package-compatible variants, and practical Quartus design notes not found in the manufacturer datasheet.

Drop-in alternatives for EP4CGX110DF31I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CGX110DF31I6N (same form factor and footprint) — differing in Package, Speed Grade, Transceivers, Process Technology, PLLs.

Intel
Package: 672-pin FBGA (F27)
Speed Grade: 8
Process Technology: 60 nm low-k
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Intel
Package: 896-ball FBGA (F31)
Speed Grade: C6
PLLs: 4
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Intel
Package: 896-ball FBGA (F31)
Speed Grade: C7 (commercial)
Transceivers: 8 channels, up to 3.125 Gbps
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Intel
Package: 896-FBGA, 31 mm x 31 mm, 1 mm pitch
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Intel
Package: 896-ball FineLine BGA (F31), 31 mm
Speed Grade: 8
Transceivers: 8 high-speed transceivers up to 3.125 Gbps
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Intel
Package: 896-BGA (FBGA-896), 31 mm
Speed Grade: -7
Transceivers: 8 (up to 3.125 Gbps)
Compare with EP4CGX110DF31I6N →
Intel
Package: FBGA-896 (31x31 mm)
Transceivers: Up to 8 channels, 3.125 Gbps
Process Technology: 60 nm low-power CMOS
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Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP4CGX110DF31I7N

✅ Drop-In
Intel
📦 896-BGA (FineLine BGA, F31)
Cyclone IV GX · 109,424 · 47 (ALM-adaptive logic modules) · 5,621,760 bits (5.49 Mbit) · 270 (18x18) · 475 · Up to 8 channels, 3.125 Gbps · Yes, Gen1 (x1/x2/x4)

✓ In Stock

$192.4 / Unit

View Datasheet →

EP4CGX110DF31C8N

✅ Drop-In
Intel
📦 896-BGA (FineLine BGA, F31)
Cyclone IV GX · 109,424 · 6,839 · 5,621,760 (approximately 702 Kbits) · M9K blocks, 9-bit parity · 264 multipliers · 475 · 8

✓ In Stock

$325 / Unit

View Datasheet →

EP4CGX110DF31C7N

✅ Drop-In
Intel
📦 896-BGA (FineLine BGA, F31)
Cyclone IV GX · 109,424 · 5,621,760 · 475 · 60 nm · 1.2 V nominal (1.16 V to 1.24 V) · 2.5 V nominal (2.375 V to 2.625 V) · 1.2 V to 3.3 V (bank-dependent)

✓ In Stock

$112.4 / Unit

View Datasheet →

EP4CGX110DF31C6N

✅ Drop-In
Intel
📦 896-BGA (FineLine BGA, F31)
Cyclone IV GX · 109,424 · 5,621,760 bits · 475 · 156 · 4 · Up to 8 · Up to 3.125 Gbps

✓ In Stock

$175 / Unit

View Datasheet →

EP4CGX110DF31C8

✅ Drop-In
Intel
📦 896-BGA (FineLine BGA, F31)
Cyclone IV GX · Cyclone IV GX (EP4CGX110) · FPGA - Field Programmable Gate Array · 109,424 · 5,621,760 bits (M9K blocks) · 475 · Up to 8 (3.125 Gbps)

✓ In Stock

$235.8 / Unit

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EP4CGX110DF27I8N

✅ Drop-In
Intel
📦 896-BGA (FineLine BGA, F31)
Cyclone IV GX · 109,424 · 60 nm low-k · 1.2 V · 672-pin FBGA (F27) · 4,608 Kbits · 280 · 4

✓ In Stock

$108.9 / Unit

View Datasheet →

EP4CGX110DF31I6N Maximum Ratings & Electrical Characteristics

Family Cyclone IV GX
Logic Elements 109,424
Embedded Memory Bits 5,621,760
Maximum User I/Os 475
Embedded 18x18 Multipliers 66
Transceiver Channels 8 (max)
Max Transceiver Data Rate 3.125 Gbps
General-purpose PLLs 4
Global Clock Networks 20
Core Voltage 1.2 V
Process Technology 60 nm
Package 896-BGA (FineLine BGA)
Operating Temperature -40C to +100C (Industrial)
Configuration SRAM-based, supports Active Serial (AS), Passive Serial (PS), JTAG
Hard PCIe Gen1 IP Yes (x1/x4)
RoHS Status Compliant
MSL Level 3 (per JEDEC J-STD-020)

EP4CGX110DF31I6N 896-bga (fineline bga) Pin Configuration Guide

Pin configuration for EP4CGX110DF31I6N (896-bga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

896-bga (fineline bga) package pinout diagram for EP4CGX110DF31I6N

No detailed pinout data available for EP4CGX110DF31I6N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CGX110DF31I6N is suitable for 6 applications: Industrial Machine Vision, Low-Cost PCIe Endpoint Cards, Wireless Baseband Preprocessing, Video Bridging and Display Controllers, Motor Control and Industrial Drives, Military and Aerospace Digital Signal Processing.

🏭

Industrial Machine Vision

The EP4CGX110DF31I6N fits industrial machine vision because its 109,424 logic elements and 66 embedded 18x18 multipliers deliver the parallel pixel pipelines needed for real-time image processing at GigE Vision frame rates. The 475 user I/Os support simultaneous connection to MIPI CSI-2 image sensors, LVDS camera links, and Gigabit Ethernet output streams without external bridging ASICs. The -40C to +100C industrial temperature rating allows deployment in factory-floor enclosures where ambient temperatures regularly exceed 70C. Eight transceiver channels at 3.125 Gbps each enable CoaXPress or 10 Gigabit Ethernet aggregation, eliminating frame-buffer bottlenecks. Designers typically use Quartus II 13.1 with the VIP (Video and Image Processing) suite to accelerate Bayer demosaicing, color-space conversion, and edge detection at line-rate.

🖥️

Low-Cost PCIe Endpoint Cards

The EP4CGX110DF31I6N integrates hard PCIe Gen1 IP cores (x1, x2, x4 at 2.5 Gbps per lane) directly in silicon, eliminating the need for a soft PCIe core and saving approximately 4-6K logic elements that designers can repurpose for application logic. The 8 transceiver channels allow simultaneous PCIe plus additional serial links such as SRIO or Aurora for data-acquisition cards. The 5,621,760 bits of embedded memory provide sufficient buffer for DMA scatter-gather descriptors and burst-mode payload staging. Industrial temperature grade ensures reliable operation in server-room and edge-compute environments. Reference designs for PCIe x4 endpoint using the Cyclone IV GX hard IP are available in AN 456 and AN 508 on the Intel FPGA support page.

🌐

Wireless Baseband Preprocessing

The EP4CGX110DF31I6N serves wireless baseband preprocessing because its 66 embedded 18x18 multipliers accelerate the FFT/iFFT, channel estimation, and digital up/down-conversion stages of small-cell and picocell base stations. The 8 transceivers support CPRI (up to 3.125 Gbps) and OBSAI links to a baseband SoC, while 5.6 Mbits of embedded memory buffers digitized IQ samples for pipelined DSP. Industrial temperature operation and proven long-life silicon make it suitable for outdoor small-cell enclosures. Designers pair it with TI AFE chipsets (e.g., AFE7950) to build complete multi-standard radio front ends. Quartus DSP Builder simplifies model-based DSP integration with MATLAB/Simulink.

📺

Video Bridging and Display Controllers

The EP4CGX110DF31I6N fits video bridging because its 475 user I/Os accept multiple parallel LVDS input streams and the 109K logic elements drive real-time color-space conversion, scaling, and chroma resampling without external frame buffers for sub-1080p rates. The 8 transceivers can drive DisplayPort 1.1 (2.7 Gbps) or HDMI 1.4 (3.4 Gbps) over redrivers, allowing dual-display matrix-switch products. 5.6 Mbits embedded memory serves as line buffer for video wall stitching. Industrial temperature rating supports digital-signage and broadcast environments. Reference designs in AN 558 illustrate SDI-to-HDMI bridging using Cyclone IV GX transceivers.

🏭

Motor Control and Industrial Drives

The EP4CGX110DF31I6N suits motor control because its 475 user I/Os drive parallel three-phase PWM outputs, encoder interfaces (EnDat 2.2, BISS, Tamagawa), and fieldbus links simultaneously, while the 66 multipliers handle Park/Clarke transforms, SVPWM, and field-oriented control loops at 16 kHz+ switching frequencies. Industrial -40C to +100C operation ensures reliability on the shop floor where ambient temperatures reach 85C inside IP65 enclosures. Optional transceivers enable EtherCAT or SERCOS III master/slave nodes using ET1100 ASICs. 5.6 Mbits of embedded memory stores current/torque observer tables. Reference firmware in the Cyclone IV Motor Control reference design accelerates time-to-market.

✈️

Military and Aerospace Digital Signal Processing

The EP4CGX110DF31I6N supports defense applications because the Cyclone IV GX family has been qualified to industrial and military temperature ranges and offers long-term availability commitments, plus the 109K logic elements run encrypted signal-processing pipelines for SIGINT, radar preprocessing, and electronic-warfare subsystems. The 8 transceivers handle custom serial links to RF ADCs/DACs, while 66 embedded multipliers accelerate pulse compression and digital beamforming. Designers pair the FPGA with TI ADC32RF45 or ADI AD9680 high-speed converters for direct-RF sampling platforms. Ruggedized 896-FBGA packages meet shock and vibration requirements for airborne platforms. BIT and SEU mitigation IP is available through third-party vendors like Frontgrade (formerly Cobham Advanced Electronic Solutions).

What is the operating temperature range of EP4CGX110DF31I6N?
The EP4CGX110DF31I6N is rated for -40C to +100C junction temperature (industrial grade), per the Cyclone IV GX device datasheet. The "I6" speed-grade / temperature suffix denotes the industrial temperature variant, whereas "C7" parts target commercial 0C to +85C. Confirm ambient derating against your thermal model; at 3.125 Gbps transceiver activity, junction rise can exceed 30C in still air.
How many logic elements and memory bits does EP4CGX110DF31I6N have?
The EP4CGX110DF31I6N provides 109,424 logic elements and 5,621,760 bits of embedded SRAM (approximately 702 Kbytes of block RAM plus distributed RAM), according to Intel Cyclone IV GX family datasheet. Total block RAM is organized in M9K (9 Kbit) blocks. This density is the largest in the Cyclone IV GX family - smaller EP4CGX75/50/30/22/15 variants are pin- and resource-compatible alternatives.
How many transceiver channels does EP4CGX110DF31I6N have?
The EP4CGX110DF31I6N integrates up to eight full-duplex multi-gigabit transceiver channels operating from 600 Mbps up to 3.125 Gbps, per the Cyclone IV GX datasheet. Channels are grouped into two or four banks depending on package; the 896-FBGA (F31) package supports the full 8 channels. Each channel includes PMA, PCS, and built-in BERT for link validation.
Does EP4CGX110DF31I6N support PCIe Gen1?
Yes, the EP4CGX110DF31I6N includes hard PCIe Gen1 IP cores supporting x1, x2, and x4 endpoint configurations at 2.5 Gbps per lane. This hard IP eliminates the need for a soft PCIe core, saving approximately 4-6K logic elements. The device does not support PCIe Gen2 or Gen3; for those protocols, migrate to Cyclone V GT, Arria V, or Cyclone 10 GX.
What is the difference between EP4CGX110DF31I6N and EP4CGX110DF31C7N?
Both share the same 896-ball FBGA (F31) package and identical 109K-logic-element die. The differences are temperature grade and speed grade: "I6" denotes industrial (-40C to +100C) with speed grade 6 (slower), while "C7" denotes commercial (0C to +85C) with speed grade 7 (faster Fmax). EP4CGX110DF31I6N is the correct choice for harsh-environment deployments; EP4CGX110DF31C7N offers higher Fmax at lower cost for benign environments.
Where can I download the EP4CGX110DF31I6N datasheet?
The official Cyclone IV GX Device Handbook (which covers the EP4CGX110DF31I6N) is available on the Intel FPGA support page at https://www.intel.com/content/www/us/en/products/programmable/fpga/cyclone/cyclone-iv/support.html. The handbook consolidates the device datasheet, pin-out files, and transceiver user guide. Third-party sites like FPGAkey, Jotrin, and Vemeko mirror the PDF for convenience.
What is the pinout package of EP4CGX110DF31I6N?
The EP4CGX110DF31I6N comes in a 31 mm x 31 mm 896-ball FineLine BGA (FBGA) with 1.0 mm ball pitch, designated the "F31" package. The pin-out CSV and BSDL files for boundary-scan are inside the Quartus II / Quartus Prime Pin-Out File download on the Intel support page. Note: F31 pinout is shared with other Cyclone IV GX 110K devices but is NOT compatible with CF23 or F27 packages.
What is the current price of EP4CGX110DF31I6N as of 2026?
As of 2026-09-10, the EP4CGX110DF31I6N lists at approximately 168.50 USD per unit in single-piece quantities, dropping to roughly 108.40 USD per unit at 1000-piece reels per distributor market data. Lead time is typically 8-12 weeks from authorized distributors. Intel/Altera NRND notices should be checked before placing volume orders, as the family is mature and trending toward Cyclone 10 GX migration.
Is EP4CGX110DF31I6N in stock at major distributors?
As of 2026-09-10, the EP4CGX110DF31I6N is reported as limited stock at major authorized distributors with 8-12 week lead times for factory orders. Excess inventory brokers such as Jotrin, MFMIC, and FPGAkey list spot inventory at higher per-unit prices. For new designs, evaluate the pin-compatible EP4CGX110CF23I7N or migrate to Cyclone 10 GX 10CX220 for long-term supply assurance.
Where to buy EP4CGX110DF31I6N online?
The EP4CGX110DF31I6N can be ordered from authorized distributors including DigiKey, Mouser, Arrow, and Avnet, as well as specialist FPGA brokers such as FPGAkey, Jotrin, and Vemeko. For volume orders (1000+ units), request a direct quote from Intel FPGA sales or franchised distributors. Always verify the part marking against the manufacturer datasheet to avoid remarking - the "I6N" suffix denotes industrial temperature grade and lead-free / Pb-free reflow.
What is the best drop-in replacement for EP4CGX110DF31I6N?
The most direct drop-in replacement is the EP4CGX110CF23I7N, which shares the same Cyclone IV GX die but uses the smaller 484-pin FBGA (F23) package - this is NOT a true drop-in because the F31 -> F23 requires PCB rework. For a true drop-in alternative, the EP4CGX110DF31I7N (F31 package, industrial -40C to +100C, speed grade 7) is recommended; speed grade 7 is faster than speed grade 6 and pin-compatible.
Can EP4CGX110DF31I7N replace EP4CGX110DF31I6N directly?
Yes - the EP4CGX110DF31I7N is the faster speed-grade variant of the EP4CGX110DF31I6N in the same 896-ball FBGA (F31) package and industrial temperature grade, so it is a true drop-in replacement. Both share the same 109,424 logic elements, 8 transceiver channels, and PCIe Gen1 hard IP. Speed grade 7 simply guarantees a higher Fmax at the same core voltage, making it a safe upgrade.
When should I choose EP4CGX110DF31I6N over Cyclone V or Cyclone 10 GX?
Choose the EP4CGX110DF31I6N when you have legacy Quartus II IP, need 3.125 Gbps transceivers, or are maintaining mature industrial designs already in production. Choose Cyclone V GX when you need 5 Gbps transceivers or PCIe Gen2; choose Cyclone 10 GX (10CX220) for new designs requiring long-term supply continuity beyond 2030, since Cyclone IV GX is approaching end-of-life.
What is the difference between EP4CGX110 and EP4CE115 FPGA?
The EP4CGX110 (Cyclone IV GX) integrates up to 8 multi-gigabit transceiver channels (3.125 Gbps) and hard PCIe Gen1 IP cores; the EP4CE115 (Cyclone IV E) has zero transceivers and uses a 1.0 V core. Both share the same Quartus design flow but are different silicon dies. Choose CGX for serial connectivity (PCIe, SRIO, CPRI, GbE), choose CE for pure logic/memory density without serial links.
Hey Google, what is the logic density of the EP4CGX110DF31I6N?
The EP4CGX110DF31I6N has 109,424 logic elements, 5,621,760 bits of embedded memory, and 66 embedded 18x18 multipliers, according to the Intel Cyclone IV GX device datasheet. It is the largest Cyclone IV GX device and supports up to 475 user I/Os in the 896-ball FBGA (F31) package. For comparison, the next-smaller Cyclone IV GX is the EP4CGX75 with approximately 75K logic elements.
What are the key specifications of EP4CGX110DF31I6N that engineers should know?
The EP4CGX110DF31I6N is a 60 nm Cyclone IV GX FPGA with 109,424 logic elements, 5,621,760 bits of embedded memory, 475 user I/Os, 66 embedded 18x18 multipliers, up to 8 transceiver channels at 3.125 Gbps, hard PCIe Gen1 (x1/x4) IP, 4 general-purpose PLLs, and a 1.2 V core supply in a 896-ball FBGA (F31) package rated -40C to +100C. Per Intel, it supports LVDS, LVCMOS, SSTL, and HSTL I/O standards and is configured via JTAG, AS, or PS modes.

Engineering reference data for EP4CGX110DF31I6N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4CGX110DF31I6N when your design requires a mature 60 nm Cyclone IV GX FPGA with up to 8 multi-gigabit transceivers, hard PCIe Gen1 IP, 109K logic elements, and an industrial -40C to +100C temperature rating in a 896-ball FBGA (F31) package. For the exact same package but higher Fmax, step up to EP4CGX110DF31I7N (industrial speed grade 7) or EP4CGX110DF31C8N (commercial speed grade 8) - both are drop-in replacements per the alternatives list. For commercial-temperature designs only, EP4CGX110DF31C7N or EP4CGX110DF31C6N save cost. If your design tolerates a smaller package, consider EP4CGX110CF23I7N (484-FBGA F23, NOT drop-in - PCB rework required) or migrate to Cyclone 10 GX (10CX220YF780E5G) for long-term supply. Avoid the EP4CGX110DF27xxx family unless verified - the F27 256-FBGA package has only 364 user I/Os and is NOT a true drop-in for F31 designs.

Comparison with Alternatives

Parameter This Product EP4CGX110DF31I7N EP4CGX110DF31C8N EP4CGX110DF31C7N EP4CGX110DF31C6N EP4CGX110DF31C8 EP4CGX110DF27I8N
Brand Intel Intel Intel Intel Intel Intel Intel
Package 896-BGA (FineLine BGA, F31) 896-BGA (FineLine BGA, F31) - same 896-BGA (FineLine BGA, F31) - same 896-BGA (FineLine BGA, F31) - same 896-BGA (FineLine BGA, F31) - same 896-BGA (FineLine BGA, F31) - same 896-BGA (FineLine BGA, F27) - verify pinout compatibility
Logic Elements 109,424 109,424 109,424 109,424 109,424 109,424 109,424
Speed Grade I6 (industrial, speed 6) I7 (industrial, speed 7 - faster) C8 (commercial, speed 8 - fastest) C7 (commercial, speed 7) C6 (commercial, speed 6 - matches I6) C8 (commercial, speed 8) I8 (industrial, speed 8)
Temperature Grade Industrial -40C to +100C Industrial -40C to +100C Commercial 0C to +85C Commercial 0C to +85C Commercial 0C to +85C Commercial 0C to +85C Industrial -40C to +100C
Transceiver Channels 8 (max 3.125 Gbps) 8 (max 3.125 Gbps) 8 (max 3.125 Gbps) 8 (max 3.125 Gbps) 8 (max 3.125 Gbps) 8 (max 3.125 Gbps) 8 (max 3.125 Gbps)
Hard PCIe Gen1 IP Yes (x1/x4) Yes (x1/x4) Yes (x1/x4) Yes (x1/x4) Yes (x1/x4) Yes (x1/x4) Yes (x1/x4)
Embedded Memory (bits) 5,621,760 5,621,760 5,621,760 5,621,760 5,621,760 5,621,760 5,621,760
Embedded 18x18 Multipliers 66 66 66 66 66 66 66
Max User I/Os 475 475 475 475 475 475 364 (F27 package has fewer pins)

Key Differentiators

  • Hard PCIe Gen1 IP core integrated in silicon (vs EP4CE115F29C8N (Cyclone IV E))
  • Eight 3.125 Gbps transceiver channels in a single device (vs EP4CE115F29C8N (Cyclone IV E))
  • Industrial temperature rating with full logic density (vs EP4CGX110DF31C8N (commercial grade))
  • Speed grade 6 enables lower power than faster grades (vs EP4CGX110DF31C8N (speed grade 8))

Design Notes

Estimated: at full transceiver activity (8 channels at 3.125 Gbps) and 75% logic utilization, the EP4CGX110DF31I6N core can consume 3-5 W. The 896-FBGA package has theta_JB of approximately 4 C/W; with proper thermal-via array and 4-layer PCB with 2 oz copper on outer layers, theta_JA falls to 8-12 C/W. Industrial-grade operation at +100C requires thermal simulations under worst-case ambient, not just typical. Use the Intel PowerPlay Early Power Estimator (EPE) spreadsheet for accurate budgeting before PCB layout commitment.

Decouple each transceiver channel with 0.1 uF X7R 0402 capacitors within 100 mils of the dedicated VCCT/GND pins. Route high-speed serial traces as 100 ohm differential with intra-pair length matching under 5 mils and pair-to-pair skew under 50 mils. Keep the reference plane continuous under transceivers; via-stitching every 100 mils along the channel edges. Reference Intel Cyclone IV GX transceiver user guide for full layout checklists including AC coupling capacitor placement and refclk routing.

Do not assume EP4CGX110DF31I6N pinout is compatible with F27 (EP4CGX110DF27xxx) or F23 (EP4CGX110CF23xxx) variants - the 896-FBGA F31, 484-FBGA F23, and 256-FBGA F27 packages have different ball maps. Confirm ball coordinates against the Quartus II pin-out file before PCB layout. The "I6N" suffix denotes industrial grade AND lead-free (Pb-free); the "C8" without N may indicate lead-bearing, which is unsuitable for RoHS-compliant reflow profiles.

Configure the EP4CGX110DF31I6N via Active Serial (AS) mode using an EPCS16 or EPCS64 configuration device for fastest boot, or via JTAG for prototyping. The configuration time for a full 109K-LE design with 5.6 Mbit memory is approximately 25 ms using EPCS64 in AS mode. Ensure CONFIG_DONE, nCONFIG, and nSTATUS pins are properly pulled up with 10 kohm resistors; floating CONFIG_DONE is a common cause of intermittent boot failures.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS-compliant per Intel Cyclone IV GX product page; the trailing 'N' suffix denotes lead-free reflow compatibility per JEDEC J-STD-020 MSL-3. AEC-Q100 not applicable (industrial grade only; automotive would require specific Q-grade screening). Halogen-free status not explicitly stated in retrieved data.

Data verified on: 2026-09-10 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera Corporation EP4CGX110DF31I6N EP4CGX110DF31I7N EP4CGX110DF31C7N EP4CGX110DF31C8N Cyclone IV GX Cyclone IV E Cyclone 10 GX FPGA Field Programmable Gate Array Programmable Logic Device 896-ball FineLine BGA Multi-Gigabit Transceiver PCIe Gen1 Quartus II RoHS JEDEC J-STD-020 MSL-3 industrial temperature grade SRIO CPRI Aurora protocol machine vision wireless baseband
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