EP4SGX360FF35C2X - 353K LC, Stratix IV GX FPGA | Intel | Altera
MPN: EP4SGX360FF35C2X ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3995 | $39,950.00 |
| 25 | $3820 | $95,500.00 |
| 50 | $3650 | $182,500.00 |
| 100 | $3450 | $345,000.00 |
EP4SGX360FF35C2X Overview
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines programmable logic blocks, configurable interconnects, and dedicated hardware resources such as block RAM, DSP slices, and high-speed transceivers. Within the broader taxonomy, FPGAs sit under programmable logic devices -> logic ICs -> integrated circuits -> semiconductors. The Stratix IV family specifically targets high-performance applications including wireline communication, military radar, and high-end broadcast video.
Key features of the EP4SGX360FF35C2X include 564 user I/O pins, embedded transceivers capable of 600 Mbps to 8.5 Gbps operation, up to 1,288 18x18 multipliers for DSP, and 32 global clock networks. The device operates over the commercial 0 °C to +85 °C junction temperature range and ships in a 35 x 35 mm, 1.0 mm pitch FCBGA. Compared with later Stratix V and Stratix 10 families, this device retains the same Quartus II design flow and pin-compatible footprint options across speed grades.
The 'C2' suffix indicates the speed grade (fastest in the Stratix IV GX family) and 'FF35' designates the 1152-ball FCBGA package with FineLine BGA ball pitch. Power estimation requires Quartus II PowerPlay and depends on toggle rate, logic utilization, and transceiver activity. The 'X' suffix at the end denotes the extended industrial / commercial lead-free shipping option.
Typical applications include 40G/100G wireline framer/mapper, software-defined radio baseband, ASIC prototyping, high-resolution video processing, and DSP co-processing in test and measurement. Designers transitioning to newer Intel FPGAs should evaluate Cyclone V GX or Arria 10 for cost-sensitive designs, or Stratix 10 for higher transceiver bandwidth.
Drop-in alternatives for EP4SGX360FF35C2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360FF35C2X (same form factor and footprint) — differing in Package, Speed Grade, Mounting Type, Family, Lead-Free.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX360FF35C2XG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP4SGX360FF35I2X
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP4SGX360FF35C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$7610 / Unit
View Datasheet →EP4SGX360FF35C2N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP4SGX360FF35I3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$9100 / Unit
View Datasheet →EP4SGX360FF35C2X Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements | 353,600 |
| Adaptive Logic Modules (LABs) | 14,144 |
| Embedded Memory | 23,105,536 bits |
| User I/O Pins | 564 |
| Number of Transceivers | 24 |
| Max Transceiver Data Rate | 8.5 Gbps |
| DSP Blocks (18x18 multipliers) | 1,288 |
| Global Clock Networks | 32 |
| Process Node | 40 nm CMOS |
| Package | 1152-ball FCBGA (FF35), 35 x 35 mm, 1.0 mm pitch |
| Speed Grade | C2 (fastest) |
| Operating Junction Temperature | 0 °C to +85 °C (commercial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Design Software | Quartus II |
EP4SGX360FF35C2X 1152-ball fcbga (ff35), 35 x 35 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4SGX360FF35C2X (1152-ball fcbga (ff35), 35 x 35 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX360FF35C2X.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX360FF35C2X is suitable for 6 applications: 40G/100G Wireline Framer / Mapper, Software-Defined Radio Baseband, ASIC Prototyping Platform, High-Resolution Video Processing, Test & Measurement Instrumentation, DSP Co-Processing / Accelerators.
40G/100G Wireline Framer / Mapper
The EP4SGX360FF35C2X is well-suited for 40G and 100G wireline framer and mapper designs where 24 transceivers at 8.5 Gbps deliver the high-speed serial bandwidth required for OTU4, CFP, and QSFP+ interfaces. With 353,600 logic elements, the device can implement full OTN framer/mapper, FEC (forward error correction) Reed-Solomon coding, and GFP mapping in a single device without external ASSPs. Designers using this part typically run the transceivers at 8.5 Gbps to feed a CFP module, with the C2 speed grade providing margin for the 100G OTU4 43.018 Gbps aggregate data path. The 1.0 mm pitch FCBGA package enables controlled-impedance routing for the 24 transceiver channels.
Recommended
Software-Defined Radio Baseband
The EP4SGX360FF35C2X serves as a high-density baseband processor for software-defined radio (SDR) platforms in military and commercial wireless infrastructure. Its 1,288 18x18 multipliers provide the DSP throughput needed for LTE, WiMAX, and proprietary modulation schemes, while 23 Mbits of embedded block RAM store intermediate FFT and channelization data. The C2 speed grade ensures that FFT engines running at hundreds of MHz meet timing closure in Quartus II. The 564 user I/Os connect to ADC/DAC mezzanine cards (FMC sites) for wideband RF sampling, and 8.5 Gbps transceivers link to digital front-end ASICs or backhaul Ethernet interfaces.
Recommended
ASIC Prototyping Platform
The EP4SGX360FF35C2X is widely used for ASIC prototyping thanks to its 353K logic elements which can emulate approximately 5-10 million ASIC gates depending on RTL style. The 564 user I/Os enable prototyping of ASICs with wide external buses (DDR2/3, LVDS, parallel ADC interfaces), and the embedded transceivers prototype high-speed SerDes that would otherwise be unavailable in standard ASIC prototyping platforms. Quartus II's incremental compilation and LogicLock regions let design teams partition a large ASIC design across multiple FPGAs. The C2 speed grade provides timing margin so that emulated ASIC paths still meet real-world frequency targets.
Recommended
High-Resolution Video Processing
Broadcast video processing equipment (e.g. 4K/UHD up-converters, motion-compensated frame rate converters, and HDMI 2.0 routers) deploy the EP4SGX360FF35C2X as the central video pipeline controller. The 8.5 Gbps transceivers carry SDI signals (3G-SDI, 6G-SDI, 12G-SDI) and HDMI 2.0 TMDS streams, while 353K logic elements implement chroma upsampling, scaling, and frame-buffer management. Embedded block RAM (23 Mbits) holds active video line buffers and motion vectors. The C2 speed grade allows the video pipeline to operate at pixel clock rates exceeding 297 MHz for 4K60 4:2:2 workflows.
Recommended
Test & Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and arbitrary waveform generators use the EP4SGX360FF35C2X for signal conditioning, memory control, and display pipeline functions. The 24 transceivers at 8.5 Gbps capture high-speed serial buses (PCIe Gen3, SATA III, USB 3.0) for protocol-aware logic analysis. With 564 user I/Os, the FPGA aggregates multi-channel ADC data from high-bandwidth digitizers and routes it through DDR3 memory controllers into processing pipelines. The C2 speed grade and rich DSP blocks enable real-time FFT and trigger logic for spectrum-analyzer functionality.
Recommended
DSP Co-Processing / Accelerators
High-performance compute systems deploy the EP4SGX360FF35C2X as a coprocessor for DSP-intensive workloads such as radar beamforming, seismic processing, and real-time image enhancement. The 1,288 18x18 multipliers can be cascaded into 36x36 multipliers and 18x18 complex multipliers, while the embedded memory bandwidth supports streaming FFT kernels. PCIe Gen2 x8 lanes (via transceivers) link the FPGA to a host CPU for coprocessor-style workload offload. Compared to GPU or DSP ASIC solutions, the EP4SGX360FF35C2X offers lower latency and per-watt efficiency for deterministic real-time signal processing.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360FF35C2X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360FF35C2XG | EP4SGX360FF35I2X | EP4SGX360FF35C3N | EP4SGX360FF35C2N | EP4SGX360FF35I3N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FCBGA (FF35), 35x35 mm | 1152-ball FCBGA (FF35) - same | 1152-ball FCBGA (FF35) - same | 1152-ball FCBGA (FF35) - same | 1152-ball FCBGA (FF35) - same | 1152-ball FCBGA (FF35) - same |
| Logic Elements | 353,600 | 353,600 (identical) | 353,600 (identical) | 353,600 (identical) | 353,600 (identical) | 353,600 (identical) |
| Speed Grade | C2 (fastest) | C2 (fastest) | I2 (industrial temp, C2 speed) | C3 (slower ~15%) | C2 (fastest) | I3 (industrial, slower) |
| Operating Junction Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) |
| Lead-Free Suffix | X (extended lead-free) | G suffix lead-free | X (extended lead-free) | N (standard lead-free) | N (standard lead-free) | N (standard lead-free) |
| Transceiver Count / Speed | 24 ch @ up to 8.5 Gbps | 24 ch @ 8.5 Gbps (identical) | 24 ch @ 8.5 Gbps (identical) | 24 ch @ 8.5 Gbps (identical) | 24 ch @ 8.5 Gbps (identical) | 24 ch @ 8.5 Gbps (identical) |
Key Differentiators
- C2 speed grade provides highest Fmax in the Stratix IV GX family (vs EP4SGX360FF35C3N)
- Full industrial temperature range option in identical FF35 footprint (vs EP4SGX360FF35I2X)
- X-suffix indicates extended lead-free and pre-bake compliance (vs EP4SGX360FF35C2XG)
Design Notes
Estimated: The EP4SGX360FF35C2X in the 35 x 35 mm FCBGA can dissipate 20-30 W depending on transceiver activity and logic utilization. At a typical theta_JA of ~3-5 °C/W (with sufficient airflow and thermal via array), the device requires a forced-air heatsink for continuous operation. A 6x6 thermal via array in the central slug region with 0.3 mm drill and 1 oz copper plating is mandatory to meet thermal design power (TDP) targets.
The 1152-ball FCBGA with 1.0 mm pitch requires high-density interconnect (HDI) stack-up with microvia-in-pad technology. Use an 8-12 layer PCB stack-up with stripline routing for transceiver channels. Each transceiver channel requires 100 ohm differential impedance with skew <5 mil. Decoupling: place 0402 0.1 µF and 0201 0.01 µF capacitors as close as possible to every power pin; bulk 22 µF ceramic capacitors on each power rail within 200 mil.
Transceiver channels at 8.5 Gbps demand a continuous reference plane with no splits under the channel routing. Use HyperLynx or SiSoft QCD/QCS for pre-route simulation of channel loss (<-10 dB at 4.25 GHz Nyquist) and crosstalk. AC-coupling capacitors (0.01 µF 0402) must be placed within 200 mil of the FPGA balls. Receiver CTLE and transmit pre-emphasis / de-emphasis should be configured per Altera Stratix IV GX Transceiver User Guide.
Do not confuse the FF35 1152-ball FCBGA package with FF31 (1517-ball) or FF23 (780-ball) - the ballout and pinout are not compatible. Always verify the exact device temperature grade ('C' = commercial, 'I' = industrial) matches your environmental requirements. When migrating from C2 to C3 speed grade, expect approximately 15% Fmax reduction; re-run TimeQuest timing analysis after recompiling. Ensure Quartus II version is 13.1 or later for full Stratix IV GX support.
Power estimation requires Quartus II PowerPlay Analyzer. Inputs: toggle rate, logic utilization, transceiver count, clock frequency, I/O activity. For an early estimate, assume 0.5 mW per logic element at 250 MHz toggle rate, plus 200-400 mW per active transceiver channel at 8.5 Gbps. The device requires multiple supply rails: VCC (core), VCCAUX (auxiliary), VCCPD (I/O pre-driver), VCCPGM (configuration), and per-bank VCCIO. Sequence VCC before VCCAUX per datasheet ramp requirements.
Compliance Information
RoHS compliance per Altera/Intel product documentation. AEC-Q100 not applicable - FPGAs are not AEC-Q100 qualified; for automotive-grade FPGA, choose Cyclone V or Arria-V devices.
