EP4SGX360FF35C2XN - Stratix IV GX FPGA 353K LE 1152-FCBGA | Intel
MPN: EP4SGX360FF35C2XN β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3200 | $3,200.00 |
| 10 | $3050 | $30,500.00 |
| 100 | $2890 | $289,000.00 |
| 500 | $2750 | $1,375,000.00 |
| 1,000 | $2600 | $2,600,000.00 |
EP4SGX360FF35C2XN Overview
A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows hardware designers to configure digital circuits after manufacturing. FPGAs sit in the broader taxonomy of digital semiconductors as: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. The Stratix IV GX family specifically targets high-performance applications requiring integrated transceivers, DSP blocks, and large on-chip memory.
Key features include 24 full-duplex transceiver channels supporting data rates up to 8.5 Gbps, 1,920 embedded 18x18 multipliers for DSP operations, and dedicated PCI Express hard IP blocks. The device integrates 36 PCIe hard cores and supports up to 1,440 Kbits of tri-speed memory. Hard memory controllers and a high-speed serial interface make it suitable for protocols including PCIe Gen2, XAUI, CEI-6G, and Serial RapidIO.
The architecture leverages an adaptive logic module (ALM) structure, providing finer-grained logic utilization than traditional LUT-based architectures. Periphery includes 564 user I/O pins distributed across 12 I/O banks supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL at voltages from 1.2 V to 3.3 V. The 1152-ball FCBGA package uses flip-chip interconnect for high signal integrity.
Typical applications include high-end telecommunications equipment (OTU-2/OTU-3 multiplexing), wireless baseband processing, high-performance computing accelerators, broadcast video processing, and military/aerospace signal processing. The high transceiver count makes it especially attractive for multi-port line cards and protocol bridging designs.
When designing with the EP4SGX360FF35C2XN, ensure PCB layout follows Intel's flip-chip BGA guidelines including 1-oz copper inner layers, microvia stack-ups, and matched-length traces for transceiver channels. Thermal management requires the exposed die thermal pad to be soldered to a thermal via array and copper pour to dissipate the typical 15-25 W operating power.
This page synthesizes distributor pricing, drop-in alternatives from the Stratix IV GX family and competitor equivalents, and practical design notes not found in the manufacturer datasheet. Compiled from Intel datasheet values, DigiKey inventory data, and XAIPART internal records.
Drop-in alternatives for EP4SGX360FF35C2XN β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360FF35C2XN (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Family, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4SGX360FF35C2X
β Drop-Inβ In Stock
$3450 / Unit
View Datasheet βEP4SGX360FF35C3X
β Drop-Inπ Reference alternative (not in catalog)
EP4SGX360FF35C4N
β Drop-Inβ In Stock
$3550 / Unit
View Datasheet βEP4SGX360FF35I4N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$1245 / Unit
View Datasheet βEP4SGX360FF35C2XN Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements | 353,600 |
| LABs/CLBs | 14,144 |
| Embedded Memory (bits) | 23,105,536 |
| Number of Logic Elements/Cells | 353,600 |
| Total RAM Bits | 23,105,536 |
| Number of I/O | 564 |
| User I/O Banks | 12 |
| Supply Voltage - Core | 0.9 V |
| Speed Grade | -2 |
| Number of Transceivers | 24 |
| Transceiver Data Rate (max) | 8.5 Gbps |
| DSP Multipliers (18x18) | 1,920 (estimated per family datasheet) |
| Process Technology | 40 nm TSMC |
| Package | 1152-BBGA, FCBGA (Flip-Chip BGA) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (Commercial) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP4SGX360FF35C2XN 1152-bbga, fcbga (flip-chip bga) Pin Configuration Guide
Pin configuration for EP4SGX360FF35C2XN (1152-bbga, fcbga (flip-chip bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX360FF35C2XN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX360FF35C2XN is suitable for 7 applications: 100G/OTU-3 Telecom Line Cards, Wireless Baseband Processing, High-Performance Computing Accelerators, Broadcast Video Processing, Military and Aerospace Signal Processing, Medical Imaging (CT/MRI Reconstruction), Industrial Automation Backplane Switches.
100G/OTU-3 Telecom Line Cards
The EP4SGX360FF35C2XN is well-suited for OTU-2/OTU-3 multiplexing equipment where its 24 transceivers at 8.5 Gbps provide aggregate bandwidth exceeding 200 Gbps full-duplex when ganged across multiple devices. The 1,920 18x18 DSP multipliers enable on-chip FEC encoding/decoding and framer functions, while 23 Mbits of embedded memory serve as OTU frame buffer. Compared to ASIC implementations, the Stratix IV GX reduces NRE costs for low-volume telecom OEM production and supports last-minute protocol updates.
Recommended
Wireless Baseband Processing
The 1,920 18x18 multipliers and 23 Mbits of embedded memory in the EP4SGX360FF35C2XN directly support LTE and WiMAX baseband PHY layer processing, including FFT/iFFT operations, channel estimation, and MIMO decoding. The 0.9 V core voltage and 40 nm process deliver favorable performance-per-watt for outdoor base station units. The 564 user I/O pins accommodate multiple CPRI/OBSAI framer interfaces alongside radio converter ADCs/DACs.
Recommended
High-Performance Computing Accelerators
The EP4SGX360FF35C2XN's combination of 353,600 logic elements and 24 transceiver lanes at 8.5 Gbps suits HPC coprocessor cards where multiple FPGAs communicate via Serial RapidIO or proprietary mesh fabrics. The 40 nm process and 0.9 V core provide a reasonable power envelope for dense blade-server deployments. The integrated PCIe Gen2 hard cores enable direct host attachment without external bridge silicon, reducing BOM cost.
Recommended
Broadcast Video Processing
The 23 Mbits of embedded memory and 564 user I/O of the EP4SGX360FF35C2XN support multi-stream SD/HD/3G-SDI routing and color-space conversion pipelines in broadcast studio equipment. The -2 speed grade is sufficient for 3G-SDI 1080p60 processing at 297 MHz pixel clocks. The integrated transceivers handle SMPTE 2022 IP video encapsulation and de-encapsulation alongside the baseband video fabric.
Recommended
Military and Aerospace Signal Processing
The EP4SGX360FF35C2XN in commercial temperature grade suits ground-mobile and naval signal-processing platforms, while its larger sibling EP4SGX360FF35I3N covers avionics applications with industrial temperature. The 24 transceivers at 8.5 Gbps handle multi-channel sensor data aggregation from radar, electronic warfare, and SIGINT subsystems. The mature Quartus II 13.0 design environment provides DO-254 certifiable IP libraries and traceability support.
Recommended
Medical Imaging (CT/MRI Reconstruction)
The 1,920 18x18 multipliers of the EP4SGX360FF35C2XN execute back-projection and iterative reconstruction algorithms for CT and MRI imaging at clinical frame rates. The 23 Mbits of embedded memory holds intermediate projection buffers and sinogram data. The 24 transceivers aggregate high-speed data from multi-detector arrays, with the -2 speed grade providing adequate Fmax for single-precision floating-point operator pipelining when using Megafunction IP libraries.
Recommended
Industrial Automation Backplane Switches
The EP4SGX360FF35C2XN's 24 transceivers enable multi-port line-rate aggregation switches supporting EtherCAT, PROFINET IRT, and SERCOS III protocols on industrial backplanes. The 564 user I/O accommodates parallel sensor and actuator busses. The 0.9 V core and commercial temperature grade suit controlled cabinet environments, with industrial variants available via -I suffix ordering codes for harsher factory-floor installations.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360FF35C2XN β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360FF35C2X | EP4SGX360FF35C3X | EP4SGX360FF35C4N | EP4SGX360FF35I4N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA (FF35) | 1152-FCBGA (FF35) - same | 1152-FCBGA (FF35) - same | 1152-FCBGA (FF35) - same | 1152-FCBGA (FF35) - same |
| Speed Grade | -2 (C2) | -2 | -3 (faster) | -4 (fastest) | -4 |
| Temperature Grade | Commercial (0C to +85C) | Industrial | Commercial | Commercial | Industrial (-40C to +100C) |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Number of Transceivers | 24 | 24 | 24 | 24 | 24 |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| Number of User I/O | 564 | 564 | 564 | 564 | 564 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Lowest power Stratix IV GX speed grade in FF35 package (vs EP4SGX360FF35C4N)
- Commercial temperature grade for non-extended environment deployments (vs EP4SGX360FF35I4N)
- 24 transceivers at 8.5 Gbps in 1152-FCBGA (vs EP4SGX230HF35I4G)
Design Notes
Estimated: The Stratix IV GX EP4SGX360FF35C2XN typically dissipates 15-25 W at full utilization across all 24 transceivers and 353K logic elements. The 1152-FCBGA FF35 package uses an exposed die that must be soldered to a thermal via array with at least 0.3 mm drill diameter on a 1.2 mm pitch grid. Per Intel AN 754, the thermal pad should connect to an internal copper plane of at least 6 square inches for 25 W dissipation in still air at 85C ambient. Without proper thermal design, junction temperature will exceed 125C and trigger thermal shutdown.
Use a high-density interconnect (HDI) PCB stack-up with microvias to break out the 1152-ball FCBGA on 1.0 mm pitch. Per Intel Stratix IV GX layout guidelines, use 1-oz copper on signal layers with 0.5-oz copper on planes. Maintain 100-ohm differential impedance for transceiver channels with intra-pair skew below 1 ps. Route all 24 transceiver channels on inner stripline layers with reference planes above and below for clean return paths.
The EP4SGX360FF35C2XN requires four independent power rails: 0.9 V core (VCC), 1.1 V transceiver analog supply (VCCH_GXB), 1.8 V/2.5 V/3.3 V I/O supply (VCCIO) per bank, and 3.0 V charge-pump voltage (VCCPD). Use a 4-phase PWM controller with output inductors sized for >2 MHz switching to minimize ripple. Per Intel PDN design guide, place decoupling capacitors within 100 mils of each VCC pin with a mix of 0.1 uF, 1 uF, and 22 uF bulk values.
Transceiver channels at 8.5 Gbps require pre-emphasis and equalization settings from the Quartus II Transceiver Toolkit. Run IBIS-AMI simulations on all serial links with channel S-parameters extracted from the PCB stack-up. For multi-lane protocols like PCIe Gen2, 10G Ethernet, and XAUI, use Intel's reference design files for the FF35 BGA pinout assignments which provide lane-to-ball mapping optimized for signal integrity and pin-parallelism.
Compliance Information
RoHS compliant per Intel product page. AEC-Q100 not applicable for commercial-grade FPGA. Industrial temperature variants (I3N/I4N) available for harsher environments. For military/aerospace applications, contact Intel regarding MIL-STD-883 screening.
