EP4SGX360FF35I3N - Stratix IV GX 360K LE FPGA | Intel | 1152-FBGA
MPN: EP4SGX360FF35I3N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $10683.94 | $10,683.94 |
| 10 | $10250 | $102,500.00 |
| 100 | $9850 | $985,000.00 |
| 500 | $9450 | $4,725,000.00 |
| 1,000 | $9100 | $9,100,000.00 |
EP4SGX360FF35I3N Overview
An FPGA (Field Programmable Gate Array) is a reconfigurable digital integrated circuit that combines programmable logic fabric, embedded memory blocks, DSP blocks, high-speed transceivers, and a rich I/O subsystem on a single die. FPGAs occupy a tier above fixed-function ASICs for low-volume prototyping and below microcontrollers for highly parallel, deterministic, high-throughput DSP and packet-processing tasks. The Stratix IV series specifically targets high-end applications that need abundant logic, abundant memory bandwidth, and integrated 8.5 Gbps transceivers, placing it in the broader hierarchy of programmable logic devices (PLD) and complex programmable logic devices (CPLD).
Key features of the EP4SGX360FF35I3N include the 8.5 Gbps embedded transceivers hardened for PCIe Gen2, XAUI, and Serial RapidIO protocols, up to 22.4 Mbits of M20K block memory, variable-precision DSP blocks supporting 18×18 and 27×27 multiplications, and an enhanced routing fabric with adaptive logic modules (ALMs). The FF35 1152-BGA package provides a 1 mm ball pitch and flip-chip construction that supports the high signal count and high-speed signaling needed for the device's I/O and transceiver channels.
Typical applications include high-performance digital signal processing, packet switching and traffic management in networking line cards, baseband processing for wireless infrastructure, medical imaging front-ends, and ASIC prototyping/emulation platforms. The combination of abundant logic, transceiver-rich I/O, and large on-chip memory makes the EP4SGX360FF35I3N a common choice for replacing or prototyping mid-range ASICs.
Designers using this device should follow the Stratix IV GX pin connection guidelines, ensure adequate decoupling for the 0.95 V core, 2.5 V/3.3 V I/O rails, and 1.2 V/2.5 V transceiver supplies, and use the Quartus II (or equivalent Intel Quartus Prime) design environment for synthesis, place-and-route, and bitstream generation. Power estimation tools should be run early in the design cycle because peak power can exceed 25 W at full utilization.
This page aggregates distributor pricing, drop-in part alternatives, and design notes that complement the manufacturer datasheet and the Quartus II device handbook.
Drop-in alternatives for EP4SGX360FF35I3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360FF35I3N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Process Technology, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX360FF35I3
✅ Drop-In✓ In Stock
$1695 / Unit
View Datasheet →EP4SGX360FF35C4N
✅ Drop-In✓ In Stock
$3550 / Unit
View Datasheet →EP4SGX360FF35C4
✅ Drop-In✓ In Stock
$5189.41 / Unit
View Datasheet →EP4SGX360FF35C3N
✅ Drop-In✓ In Stock
$7610 / Unit
View Datasheet →EP4SGX360FF35C3
✅ Drop-In✓ In Stock
$2285 / Unit
View Datasheet →EP4SGX360FF35C2XN
✅ Drop-In✓ In Stock
$2600 / Unit
View Datasheet →EP4SGX360FF35C2X
✅ Drop-In✓ In Stock
$3450 / Unit
View Datasheet →EP4SGX360FF35I3N Maximum Ratings & Electrical Characteristics
| Series | Stratix IV GX |
| Family | Stratix IV GX |
| Logic Elements (LE) | 353,600 |
| Adaptive Logic Modules (ALM) | 141,440 |
| Embedded Memory (Bits) | 23,105,536 |
| Total RAM Blocks | 564 (M20K blocks) |
| User I/O Count | 564 |
| Number of LABs/CLBs | 14144 |
| Package | 1152-BBGA, FCBGA (35 mm body, 1 mm pitch) |
| Operating Temperature | -40 °C to +100 °C (Industrial) |
| Supply Voltage Core | 0.95 V (typical) |
| Transceiver Data Rate | Up to 8.5 Gbps |
| Process Node | 40 nm |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP4SGX360FF35I3N 1152-bbga, fcbga (35 mm body, 1 mm pitch) Pin Configuration Guide
Pin configuration for EP4SGX360FF35I3N (1152-bbga, fcbga (35 mm body, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX360FF35I3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX360FF35I3N is suitable for 6 applications: High-Speed Networking Line Card, Wireless Baseband Processing, Medical Imaging Accelerator, ASIC Prototyping and Emulation, Broadcast Video Processing, Automated Test Equipment (ATE).
High-Speed Networking Line Card
The EP4SGX360FF35I3N's 353,600 logic elements and embedded 8.5 Gbps transceivers make it a strong fit for high-speed networking line cards that need to aggregate multiple SFP+ or 10 GbE links. The 23,105,536 bits of embedded M20K memory provide ample buffering for packet queues, while the 564 user I/Os allow direct interconnect to network processors and traffic managers without external bus switches. Placed on the data plane of a chassis switch, the device handles classification, policing, and forwarding at line rate. Designers typically pair the FPGA with a serializer/deserializer (SerDes) reference clock and external QSFP cages for full 40G/100G aggregation.
Recommended
Wireless Baseband Processing
The Stratix IV GX's variable-precision DSP blocks support 18×18 and 27×27 multiplications, enabling efficient implementation of LTE and WiMAX baseband algorithms including FFT/iFFT, channel estimation, and MIMO detection. The 564 I/Os and high transceiver count allow direct interfacing to RF front-ends via CPRI or OBSAI, while 23 Mbits of on-chip memory buffer symbol-rate data without external SRAM. In a typical base station design, the EP4SGX360FF35I3N serves as the primary digital signal processor, reducing overall component count compared to discrete DSP arrays. Industrial temperature operation makes it suitable for outdoor cell-site enclosures.
Recommended
Medical Imaging Accelerator
In CT, MRI, and ultrasound imaging systems, the EP4SGX360FF35I3N accelerates back-projection, beamforming, and real-time image reconstruction at speeds unattainable by general-purpose processors. The 8.5 Gbps transceivers move raw sensor data into the FPGA from analog front-ends, and the abundant DSP blocks handle FIR filtering and matrix inversions in real time. Industrial temperature grade and high reliability make it suitable for regulated medical device designs that must pass IEC 60601 compliance testing. Estimated throughput gains over CPU-based reconstruction are typically 10x to 50x, enabling real-time 3D imaging in clinical workflows.
Recommended
ASIC Prototyping and Emulation
The EP4SGX360FF35I3N is widely used as a building block in ASIC prototyping and emulation platforms, where its high logic density (353,600 LEs) and abundant M20K memory blocks allow mapping of large RTL designs. By partitioning a target ASIC across multiple FPGAs, verification engineers can validate real-world silicon behavior at near-ASIC clock rates. Industrial temperature grade supports bench and chassis-level emulation environments. Quartus II time-domain multiplexing and pin multiplexing tools ease multi-FPGA partition debugging.
Recommended
Broadcast Video Processing
For broadcast video routers, multi-viewers, and 4K/8K up-converters, the EP4SGX360FF35I3N's 564 user I/Os and high-speed transceivers enable uncompressed SDI aggregation at rates up to 12G-SDI per channel. The 23 Mbits of embedded memory provide line and frame buffers without external SRAM, simplifying PCB design. Designers implement color space conversion, scaling, and HDR metadata insertion directly in the FPGA fabric, reducing dependency on dedicated video processors. Industrial temperature grade supports both studio and outdoor broadcast truck installations.
Recommended
Automated Test Equipment (ATE)
ATE platforms use the EP4SGX360FF35I3N as a flexible pattern generator and timing engine, leveraging its 564 I/Os for parallel DUT interfacing and its transceivers for high-speed serial protocols. Designers implement deep pattern memory, per-pin timing adjustment, and per-pin voltage/current control loops in the FPGA, replacing traditional pattern generator ASICs. Quartus II's TimeQuest timing analyzer ensures sub-nanosecond timing accuracy across all channels. Industrial temperature grade supports bench and production-floor environments without thermal derating.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360FF35I3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360FF35I3 | EP4SGX360FF35C4N | EP4SGX360FF35C4 | EP4SGX360FF35C3N | EP4SGX360FF35C2XN |
|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA (FF35) | 1152-BBGA, FCBGA (FF35) - same | 1152-BBGA, FCBGA (FF35) - same | 1152-BBGA, FCBGA (FF35) - same | 1152-BBGA, FCBGA (FF35) - same | 1152-BBGA, FCBGA (FF35) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| User I/Os | 564 | 564 | 564 | 564 | 564 | 564 |
| Operating Temperature | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Speed Grade | I3 | I3 | C4 | C4 | C3 | C2X |
| RoHS Compliance | Yes | No | Yes | No | Yes | Yes |
| Transceiver Data Rate | Up to 8.5 Gbps | Up to 8.5 Gbps | Up to 8.5 Gbps | Up to 8.5 Gbps | Up to 8.5 Gbps | Up to 8.5 Gbps |
Key Differentiators
- Industrial temperature grade with RoHS compliance (vs EP4SGX360FF35I3)
- Industrial temp range with faster speed grade than C-series (vs EP4SGX360FF35C4N)
- Same FF35 package, faster silicon speed grade for new designs (vs EP4SGX360FF35C3N)
Design Notes
Estimated: the EP4SGX360FF35I3N can draw up to 25 W at full transceiver utilization. Use PowerPlay early in the design cycle to model rail-by-rail currents. Provide separate regulator outputs for 0.95 V core, 2.5 V/3.3 V I/O, and 1.2 V/2.5 V transceiver supplies, with bulk decoupling on each rail and 0.1 µF + 1 µF ceramic decoupling near each supply pin. Budget for at least a 1 oz copper pour on inner layers and a 2 oz copper top layer for thermal dissipation.
For the 1152-ball 1 mm pitch FCBGA package, escape all signals on inner layers with 4/4 mil trace-and-space rules and use laser-drilled microvias for inner-layer fanout. Matched-impedance routing of 50 Ω for transceiver channels and 100 Ω differential for high-speed LVDS pairs is required. Follow the Stratix IV GX pin connection guidelines for unused pin and transceiver pin handling; tie unused transceiver pins to ground through a 10 kΩ resistor as documented.
Do not assume that the EP4SGX360FF35I3N (industrial temp) and EP4SGX360FF35C4N (commercial temp) are interchangeable without re-qualifying your design for thermal and timing margins. Commercial-grade devices may fail at sub-zero operating temperatures. Also note that the 'N' suffix denotes RoHS-compliant packaging; confirm lead-free reflow profile compliance before substituting non-N variants.
Compliance Information
RoHS compliance indicated by 'N' suffix per Intel ordering information. AEC-Q100 is not applicable because this is an FPGA, not an automotive-grade IC. Halogen-free status not explicitly listed in the verified web data; treat as unknown.
