EP4SGX360FF35I4 - 353,600-Cell Stratix IV GX FPGA | Intel
MPN: EP4SGX360FF35I4 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1699 | $1,699.00 |
| 10 | $1529.1 | $15,291.00 |
| 100 | $1359.2 | $135,920.00 |
| 500 | $1189.3 | $594,650.00 |
| 1,000 | $1019.4 | $1,019,400.00 |
EP4SGX360FF35I4 Overview
A field-programmable gate array is a programmable semiconductor containing configurable logic blocks, routing resources, memory elements, and I/O structures. Unlike an application-specific integrated circuit, an FPGA can be reconfigured after manufacturing to implement digital processing, interface bridging, control, packet handling, or protocol-specific functions. Stratix IV GX FPGAs are positioned as programmable logic devices for bandwidth-intensive embedded systems. EP4SGX360FF35I4 integrates 353,600 logic cells with 14,144 LABs, giving system architects a large programmable fabric for parallel datapaths and control logic. The device is listed with 564 I/O, making package routing and power integrity important parts of board design.
The principal verified characteristics are 353,600 logic cells, 14,144 LABs, 564 I/O, 40 nm process technology, a 0.9 V core-voltage listing, and 1152-pin FC-FBGA packaging. The 1152-pin package provides extensive connectivity for high-pin-count digital designs, while the BGA format supports dense routing. The 3.4 mm maximum seated height constrains the mechanical stack-up and connector or heatsink clearances. The available distributor descriptions identify the product as a Stratix IV GX FPGA and expose the same 564-I/O and 353,600-cell architecture consistently.
Architecturally, EP4SGX360FF35I4 is a programmable logic platform rather than a fixed-function processor. The logic cells and LABs implement combinational and sequential functions, while programmable interconnect maps data paths between logic, memory, and I/O resources. The 0.9 V core-voltage value should be applied only to the supply domain identified by the manufacturer documentation; designers must verify exact power-pin groups, permissible tolerances, ramp requirements, and decoupling recommendations from the official datasheet before schematic release. No transceiver count, memory-bit total, operating-temperature range, or performance grade is provided in the verified snippets.
Typical applications include high-throughput communications equipment, industrial imaging and machine-vision processing, test and measurement systems, and embedded digital signal-processing platforms. Its high logic density suits parallel algorithms, protocol conversion, and interface aggregation, while 564 I/O supports numerous external buses and control signals. The Stratix IV GX family positioning also makes the device relevant to systems requiring substantial programmable bandwidth, but exact transceiver capability and speed grades must be confirmed from the manufacturer datasheet.
Designers should prioritize power-integrity analysis, BGA escape routing, decoupling placement, thermal characterization, and configuration-management review. The verified data does not provide signal-integrity limits, supported I/O standards, clock limits, memory resources, or exact power consumption, so those parameters require manufacturer confirmation. This page combines verified package, logic, and commercial-search information with explicit uncertainty markers where the supplied data is insufficient.
Drop-in alternatives for EP4SGX360FF35I4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360FF35I4 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Mounting Type, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX360FF35I3N
✅ Drop-In✓ In Stock
$9100 / Unit
View Datasheet →EP4SGX360FF35I3
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$1695 / Unit
View Datasheet →EP4SGX360FF35C4N
✅ Drop-In✓ In Stock
$3550 / Unit
View Datasheet →EP4SGX360FF35C4
✅ Drop-In✓ In Stock
$5189.41 / Unit
View Datasheet →EP4SGX360FF35C3N
✅ Drop-In✓ In Stock
$7610 / Unit
View Datasheet →EP4SGX360FF35I4 Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Series | Stratix IV GX |
| Logic Cells | 353600 |
| Logic Elements or Cells | 353600 |
| Logic Array Blocks | 14144 LABs |
| I/O Count | 564 I/O |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Package | 1152-pin FC-FBGA |
| Package Type | BGA |
| Terminal Count | 1152 |
| Package Shape | Square |
| Maximum Seated Height | 3.4 mm |
| Mounting Type | Surface Mount |
EP4SGX360FF35I4 square Pin Configuration Guide
Pin configuration for EP4SGX360FF35I4 (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX360FF35I4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX360FF35I4 is suitable for 6 applications: Communications Infrastructure, Industrial Imaging and Machine Vision, Test and Measurement Equipment, Embedded Digital Signal Processing, High-Performance Interface Aggregation, Programmable Industrial Control.
Communications Infrastructure
EP4SGX360FF35I4 fits communications infrastructure that needs a large programmable logic fabric and extensive board-level connectivity. Its verified 353600 logic cells and 14144 LABs provide substantial parallel resources for packet processing, protocol conversion, traffic management, and control logic. The listed 564 I/O supports aggregation of multiple buses, status signals, clocks, and management interfaces without requiring a lower-density device. The Stratix IV GX family positioning is relevant to bandwidth-oriented designs, but transceiver count, line rate, and supported protocols are not included in the supplied data. Engineers must confirm those values in the official datasheet and validate timing, signal integrity, and power before implementation.
Recommended
Industrial Imaging and Machine Vision
EP4SGX360FF35I4 is appropriate for industrial imaging and machine-vision systems that process multiple data streams and control many external devices. The 353600 logic cells and 14144 LABs can support pixel formatting, buffering control, region-of-interest logic, filtering, and sensor synchronization in a programmable architecture. Its 564 I/O count provides room for camera interfaces, encoders, memories, and machine-control signals. The 1152-pin FC-FBGA package supports dense routing, while the listed 3.4 mm seated height must be accommodated in the mechanical design. The verified data does not provide memory capacity or clock limits, so those requirements need manufacturer confirmation.
Recommended
Test and Measurement Equipment
EP4SGX360FF35I4 can serve as the programmable processing and interface core in test and measurement equipment. Its 353600 logic cells support instrument control, waveform sequencing, digital filtering, data capture coordination, and multiple measurement channels. The 564 I/O listing helps when a system combines acquisition devices, clocks, triggers, displays, communications ports, and calibration interfaces. A Stratix IV GX FPGA also allows implementation changes without replacing a custom ASIC, which is valuable when measurement algorithms evolve. The supplied evidence does not specify embedded memory, transceiver resources, or timing limits; designers should obtain those specifications and perform worst-case timing and thermal analysis before release.
Recommended
Embedded Digital Signal Processing
EP4SGX360FF35I4 suits embedded digital signal processing where parallel arithmetic and flexible interfaces are required. The verified 353600-cell and 14144-LAB architecture can implement filters, encoders, decoders, transforms, control loops, and multi-channel datapaths. Its 564 I/O supports external converters, memory interfaces, control signals, and system management paths. The 40 nm process and 0.9 V listed core voltage are useful for initial technology and supply planning, but they do not replace the official power and timing specifications. Engineers should confirm supported arithmetic resources, memory blocks, clock networks, I/O standards, and configuration modes before selecting this FPGA for a signal-processing design.
Recommended
High-Performance Interface Aggregation
EP4SGX360FF35I4 is a strong candidate for systems that aggregate many digital interfaces into one programmable platform. The listed 564 I/O can connect parallel data buses, control lines, clock domains, and management signals, while 353600 logic cells provide capacity for protocol adaptation, buffering control, and traffic arbitration. The 1152-pin FC-FBGA package is designed for high connection density, but it also makes escape routing, via construction, decoupling, and signal-integrity analysis critical. The verified snippets do not identify I/O standards, lane counts, or maximum data rates. Validate every interface electrical specification, bank rule, impedance target, and timing constraint against the manufacturer datasheet.
Recommended
Programmable Industrial Control
EP4SGX360FF35I4 can support programmable industrial-control systems requiring deterministic logic, many I/O, and adaptable sequencing. The verified 353600 logic cells and 14144 LABs can implement state machines, safety-control logic, data concentrators, protocol conversion, and synchronized actuation control. The 564 I/O count allows connection to sensors, motor-control peripherals, communications devices, and local memory. The I4 ordering code is associated by the MPN with an industrial-oriented designation, but the verified data does not state a temperature range or AEC-Q100 qualification. Confirm the exact ordering-code definition, environmental limits, and lifecycle status before using it in industrial or regulated equipment.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360FF35I4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360FF35I3N | EP4SGX360FF35I3 | EP4SGX360FF35C4N | EP4SGX360FF35C4 | EP4SGX360FF35C3N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-pin FC-FBGA | 1152-pin FC-FBGA | 1152-pin FC-FBGA | 1152-pin FC-FBGA | 1152-pin FC-FBGA | 1152-pin FC-FBGA |
| Pin Count | 1152 | 1152 | 1152 | 1152 | 1152 | 1152 |
Key Differentiators
- High verified logic density (vs EP4CGX150DF31I7N)
- Extensive listed I/O capacity (vs EP4CGX110CF23I7N)
- High-density FC-FBGA package (vs EP4CGX75DF27I7N)
- Stratix IV GX family positioning (vs EP4SGX110HF35C4G)
Design Notes
Begin the power design from the manufacturer datasheet, not the distributor headline value. The verified data lists a 0.9 V core voltage, but it does not provide supply tolerances, I/O-bank voltages, auxiliary rails, current limits, sequencing, or power-up behavior. Create the power budget with worst-case utilization, clocking, I/O switching, and temperature conditions, then add local decoupling at the relevant supply pins. Do not apply the 0.9 V value to every FPGA rail or assume that one regulator can serve all domains. Validate the final power tree with Intel documentation and hardware measurements.
The 1152-pin FC-FBGA package requires a controlled BGA layout. Confirm the official land pattern, ball pitch, body dimensions, and keepout rules before routing. Use an escape strategy that supports all 564 available I/O, power balls, ground balls, and configuration signals without creating excessive via congestion. Plan layer transitions, return paths, impedance targets, and test access with the FPGA pinout available. The verified data gives a 3.4 mm maximum seated height, so include that value in the mechanical stack-up and assembly review. Do not release the footprint from a generic BGA symbol.
The 353600-cell architecture can create a substantial thermal load depending on utilization, clock rate, I/O activity, and configuration. The supplied data does not provide power consumption, junction-to-ambient resistance, or a thermal derating curve, so no safe operating-area or heatsink conclusion can be made. Estimate heat from the final design and measure the case or board temperature under worst-case operation. Provide copper spreading, thermal vias, airflow, or a heatsink only after the manufacturer package data and power specification are available.
Treat the 564 I/O and 1152 BGA terminals as a high-speed package-design problem, not only as a routing-count exercise. The verified results do not list supported I/O standards, differential-pair limits, slew rates, or maximum clock frequencies. Confirm bank assignments, voltage rules, termination requirements, and receiver or driver capabilities from the official documentation. Maintain continuous reference-plane returns through layer transitions, minimize via stubs, and verify impedance and crosstalk with field-solver or measurement data. A valid logical netlist cannot compensate for an incorrect BGA escape or compromised return path.
Do not infer a complete replacement, lifecycle, temperature grade, or compliance status from the EP4SGX360FF35I4 suffix. The I4 code is part of the ordering designation, but the verified data does not define its complete commercial and environmental meaning. Likewise, related Intel MPNs in the site catalog are not automatically drop-in parts. Before substitution, compare the exact ball map, speed grade, I/O banks, memory and transceiver resources, power rails, configuration method, tool support, and timing constraints. Treat all missing values as [DATA_NEEDED] until supported by the manufacturer documentation.
Compliance Information
The verified web data does not provide RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. No compliance claim is inferred from the I4 suffix.
