EP4SGX530HH35C2 - Stratix IV GX FPGA, 531200 Cells, 1152-BGA | Intel
MPN: EP4SGX530HH35C2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5800 | $5,800.00 |
| 10 | $5450 | $54,500.00 |
| 25 | $5100 | $127,500.00 |
| 50 | $4780 | $239,000.00 |
| 100 | $4500 | $450,000.00 |
EP4SGX530HH35C2 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, I/O cells, and embedded memory/DSP/multiplier blocks that can be re-programmed after manufacture to implement arbitrary digital circuits. FPGAs sit in the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix IV GX family specifically targets high-speed serial interface, high-density DSP, and embedded-processor applications, and is positioned below newer Stratix V/10 families but above Cyclone and MAX families in Intel/Altera's portfolio in terms of logic density, transceiver speed, and DSP throughput.
Key features of the EP4SGX530HH35C2 include 531200 logic elements, 212480 CLBs, 28033024 bits of embedded memory, hard IP for PCI Express Gen1/Gen2, dedicated DSP blocks, programmable power technology, and transceiver tiles supporting protocols such as PCIe, XAUI, Serial RapidIO, and CPRI. The 1152-BGA package supports a wide user I/O count (up to 564) plus dedicated transceiver, clock, and configuration pins, allowing very high pin-count designs to be implemented in a single device.
The architecture is built around ALM (Adaptive Logic Module) blocks, M9K/M144K embedded memory blocks, and 18x18 multiplier/accumulator DSP blocks with up to ~1.3 GMACS throughput. Transceiver tiles are arranged in groups of four (quad), each with dedicated physical coding sublayer (PCS) and physical medium attachment (PMA) blocks that simplify high-speed serial design while keeping the FPGA fabric flexible.
Typical applications include high-end telecommunications line cards, wireless baseband processing, test and measurement equipment with high-speed serial I/O, radar and signal-intelligence platforms, medical imaging (ultrasound beamforming), and high-performance computing accelerators. The combination of high logic density and embedded transceivers makes it well-suited to designs that previously required an FPGA plus an external PHY.
When designing with the EP4SGX530HH35C2, careful PCB layout is essential: a multi-layer PCB (typically 10-16 layers for a 1152-BGA at 1.0 mm pitch) with continuous ground and power planes, controlled-impedance routing for transceiver channels, and proper decoupling are mandatory for signal integrity and robust power delivery.
This page synthesizes distributor pricing, drop-in alternatives from the same Stratix IV GX family, comparison data, and PCB-level design notes not found in any single manufacturer datasheet.
Drop-in alternatives for EP4SGX530HH35C2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX530HH35C2 (same form factor and footprint) — differing in Package, Operating Temperature, Transceivers, Mounting Type, Device Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX530HH35C2G
✅ Drop-In📋 Reference alternative (not in catalog)
EP4SGX530HH35C3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2398 / Unit
View Datasheet →EP4SGX530HH35C4
✅ Drop-In✓ In Stock
$3120 / Unit
View Datasheet →EP4SGX530HH35C2N
✅ Drop-In✓ In Stock
$3500 / Unit
View Datasheet →EP4SGX530KH35C2
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP4SGX530HH35C2 Maximum Ratings & Electrical Characteristics
| Series | Stratix IV GX |
| Family | Stratix IV |
| Logic Elements | 531200 |
| Configurable Logic Blocks (CLBs) | 212480 |
| Embedded Memory (bits) | 28033024 |
| Maximum User I/O | 564 |
| Package | 1152-BGA (FBGA-1152 / HBGA-1152) |
| Mounting Type | Surface Mount |
| Process Technology | 40 nm CMOS |
| Operating Temperature Grade | Commercial (C2 suffix) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Transceivers | Up to 24 channels, up to 8.5 Gbps |
| Hard IP | PCI Express Gen1/Gen2 |
EP4SGX530HH35C2 1152-bga (fbga-1152 / hbga-1152) Pin Configuration Guide
Pin configuration for EP4SGX530HH35C2 (1152-bga (fbga-1152 / hbga-1152) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX530HH35C2.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX530HH35C2 is suitable for 6 applications: Telecommunications Line Cards, Wireless Baseband Processing, Test & Measurement Instrumentation, Radar & Signal Intelligence Platforms, Medical Imaging (Ultrasound Beamforming), High-Performance Computing Accelerators.
Telecommunications Line Cards
The EP4SGX530HH35C2 fits telecom line card designs because its 531200 logic elements and 24 transceivers at up to 8.5 Gbps aggregate >200 Gbps of serial bandwidth, enough for multi-port 10G/SONET/OTU fabric. Placed on a 16-layer PCB with continuous GND/PWR planes, it implements MAC, framer, and traffic management while the embedded 27 Mbits of RAM eliminates external SRAM for cell buffering. Compared to an ASIC, it preserves reconfigurability for evolving protocols (e.g., CPRI, OBSAI) without re-spinning silicon.
Recommended
Wireless Baseband Processing
The EP4SGX530HH35C2 is well-suited to LTE/5G NR baseband designs because its 18x18 hardware multipliers and dedicated DSP blocks deliver >1 GMACS throughput per the Stratix IV datasheet, accelerating FFT/iFFT, channel coding, and MIMO matrix operations. Its 564 user I/O pins allow parallel connections to analog front-end ADCs/DACs and CPRI links to remote radio heads, while the 27 Mbits of embedded memory stores HARQ buffers and constellation maps. Designers pair it with a soft-core CPU (Nios II) for control-plane processing.
Recommended
Test & Measurement Instrumentation
The EP4SGX530HH35C2 serves high-end oscilloscopes, BERTs, and protocol analyzers because its 24 transceivers at 8.5 Gbps aggregate enough bandwidth for multi-channel 6 Gbps serial data acquisition with on-chip pattern generation and error counting. The 531200 logic elements implement deep FIFO memories and protocol decoders (PCIe, USB 3.0, SATA) while the embedded 27 Mbits of RAM store captured waveforms. Designers typically pair the FPGA with high-speed ADCs/DACs via LVDS interfaces, using 564 user I/O for parallel data lanes.
Recommended
Radar & Signal Intelligence Platforms
The EP4SGX530HH35C2 fits radar/ELINT systems because its 531200 logic elements plus DSP blocks deliver the GMACS throughput required for pulse compression, MTI filtering, and beamforming, while 24 transceivers aggregate digitized antenna-array data. Embedded 27 Mbits of RAM is sufficient for sample windows and pre-summing, reducing external SRAM needs. Designers typically instantiate FFT and matrix inversion cores in fabric, achieving >100 GMACS effective throughput per the Stratix IV family performance figures.
Recommended
Medical Imaging (Ultrasound Beamforming)
The EP4SGX530HH35C2 suits ultrasound beamforming systems because its 531200 logic elements implement delay-and-sum beamforming across 64-128 channels in real time, while 564 user I/O pins connect to per-channel ADC data streams. The 18x18 multipliers accelerate apodization and Hilbert transform calculations, and the embedded 27 Mbits of RAM stores per-channel sample histories. Compared to DSP clusters, a single Stratix IV GX FPGA replaces multiple DSPs, lowering BOM and power per channel.
Recommended
High-Performance Computing Accelerators
The EP4SGX530HH35C2 accelerates HPC kernels because its 531200 logic elements, hardware DSP blocks, and PCI Express Gen2 hard IP support direct attachment to CPU sockets as a co-processor. Designers implement custom floating-point pipelines, FFT, or cryptographic primitives in fabric, while 24 transceivers provide additional I/O to memory and inter-FPGA links. Embedded 27 Mbits of RAM stores intermediate vectors, often paired with external DDR3 SODIMMs for larger working sets.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX530HH35C2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX530HH35C2G | EP4SGX530HH35C3 | EP4SGX530HH35C4 | EP4SGX530HH35C2N | EP4SGX530KH35C2 |
|---|---|---|---|---|---|---|
| Package | 1152-BGA (FBGA-1152) | 1152-BGA (FBGA-1152) - same | 1152-BGA (FBGA-1152) - same | 1152-BGA (FBGA-1152) - same | 1152-BGA (FBGA-1152) - same | 1152-BGA (FBGA-1152) - same BGA, different ball map |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 531200 | 531200 | 531200 | 531200 | 531200 | 531200 |
| Speed Grade | -2 (C2) | -2 | -3 | -4 | -2 | -2 |
| Temperature Grade | Commercial (0C to 85C) | Commercial | Commercial | Commercial | Industrial | Commercial |
| Lead-Free / RoHS | Per ordering code (verify) | Yes (lead-free / RoHS) | Per ordering code | Per ordering code | Yes (lead-free / RoHS) | Per ordering code |
| Embedded Memory | 28033024 bits | 28033024 bits | 28033024 bits | 28033024 bits | 28033024 bits | 28033024 bits |
| Max User I/O | 564 | 564 | 564 | 564 | 564 | 564 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Lead-free / RoHS-compliant terminal finish (vs EP4SGX530HH35C2 (non-G))
- Higher speed grade available in same package (vs EP4SGX530HH35C4)
- Industrial temperature range option (vs EP4SGX530HH35C2N)
Design Notes
Estimated: The EP4SGX530HH35C2 in 1152-BGA at 1.0 mm pitch typically requires a 10-16 layer PCB with continuous GND and PWR planes, microvia-in-pad assembly, and 0.5 oz copper on outer layers. Trace width/clearance for 50 ohm controlled impedance must be verified with the PCB vendor's stack-up planner. Transceiver channels need matched-length routing within 0.1 mm tolerance across P/N pairs.
Decoupling for the EP4SGX530HH35C2 requires hundreds of 0402/0201 ceramic capacitors distributed under the BGA per the Stratix IV power distribution network (PDN) guidelines. Use a mix of 1 uF, 100 nF, and 10 nF values with vias placed close to each BGA ball. Core and transceiver supplies should be filtered with ferrite beads and bulk decoupling placed within 25 mm of the package.
The EP4SGX530HH35C2 has a maximum power dissipation in the 15-25 W range at high utilization per Stratix IV GX datasheet thermal characteristics; a heatsink with thermal pad and adequate airflow is mandatory. Estimate junction temperature: T_J = T_A + P_D x theta_JA. Place 4-6 thermal vias under the package center to spread heat to internal GND planes.
Transceiver channels must follow the Stratix IV GX PCB layout guidelines strictly: AC-coupled capacitors as close to the FPGA transceiver balls as possible (<2 mm), reference planes unbroken beneath all high-speed traces, and length matching to within 0.127 mm (5 mil) for P/N pairs. Use IBIS-AMI simulations for channels >5 inches before fabrication.
Common pitfalls with the EP4SGX530HH35C2 include: (1) confusing C2/C3/C4 speed grades - verify timing closure permits substitution; (2) substituting H-prefix and K-prefix SKUs without re-checking the BGA ball map (transceiver channels differ); (3) omitting the configuration device (e.g., EPCQ256) on the board; (4) failing to verify MSL handling for BGA packages during PCB assembly.
Compliance Information
RoHS compliance varies by ordering code; the 'G' suffix denotes lead-free finish. AEC-Q100 not applicable (FPGA is not an automotive-qualified IC by default). Halogen-free status unknown - consult Intel product declaration.
