Intel

EP20K600CEF672C7 - 600K Gates APEX 20KC FPGA | Intel | 672-FBGA

MPN: EP20K600CEF672C7 ✗ End of Life
In Stock Ships in 1-3 business days
1.8 V Vdss 672-ball FineLine BGA (FC-FBGA) Package 375.94 MHz Speed EAB blocks (dual-port RAM with byte enables) Memory
From $98.4 USD / Unit
MOQ: 1 |
Price updated: 2026-09-07
Volume Pricing
Qty Unit Price Extended
1 $145 $145.00
10 $132.5 $1,325.00
100 $118.75 $11,875.00
250 $109.2 $27,300.00
500 $98.4 $49,200.00
ℹ️ All prices are in USD

EP20K600CEF672C7 Overview

The Intel EP20K600CEF672C7 is a high-density APEX 20KC series Field Programmable Gate Array (FPGA) integrating 600K gates and 24,320 logic elements/cells in a 672-ball FineLine BGA (FC-FBGA) package. It operates from a 1.8V core supply, manufactured on a 0.15 µm all-layer copper CMOS process that delivers 35% faster design performance than the original APEX 20KE family.

An FPGA (Field Programmable Gate Array) is a programmable logic device that combines the high integration of a gate array with the field-programmability of a PLD, enabling rapid prototyping and post-silicon design changes. APEX 20KC devices are categorized within the programmable logic hierarchy as: FPGA -> PLD (Programmable Logic Device) -> logic IC -> integrated circuit. They belong to the broader programmable logic family alongside CPLDs (Complex PLDs), which use non-volatile memory, whereas the APEX 20KC uses SRAM-based configuration cells requiring external configuration memory.

Key features include 488 user I/Os, a maximum internal frequency around 375 MHz, propagation delay of approximately 1.48 ns, built-in LVDS support, MultiVolt I/O for interfacing with 1.8V/2.5V/3.3V systems, and embedded CAM (Content-Addressable Memory) blocks. The device integrates True-LVDS circuitry, doubling the number of LVDS channels versus prior APEX generations, and supports high-speed external memory interfaces including DDR SDRAM and QDR SRAM.

Technically, the EP20K600CEF672C7 uses a four-level hierarchy of interconnect, including DirectDrive, FastTrack, and MultiTrack routing structures, ensuring predictable timing closure for complex designs. Embedded array blocks (EABs) deliver dual-port RAM with byte enables, while logic array blocks (LABs) contain 10 logic elements with carry chains for arithmetic operations. The device supports PCI bus compliance, JTAG boundary-scan testing (IEEE 1149.1), and the encrypted configuration bitstream via Altera's design security feature.

Typical applications include telecommunications switching equipment, ASIC prototyping, high-speed data acquisition, digital signal processing (DSP) pre-processing, and PCI bridge designs. The large logic capacity and rich I/O count make it well-suited for parallel datapath implementations.

When designing with this device, ensure proper decoupling with 0.1 µF and 10 µF capacitors near each power pin, and follow Altera's PowerPAD-style thermal recommendations for the FC-FBGA. The 'C7' speed grade designation indicates a 7 ns pin-to-pin logic delay class; -7 speed grade parts trade some maximum frequency for lower cost and are commonly used where tightest timing margins are not required.

Drop-in alternatives for EP20K600CEF672C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP20K600CEF672C7 (same form factor and footprint) — differing in Process Technology, Package, Speed Grade, Family, Operating Temperature.

Altera
Process Technology: 0.15 µm all-layer copper-metal CMOS
Package: 672-ball FineLine BGA (45 x 45 mm, 1.27 mm pitch)
Speed Grade: C7 (commercial, 0 °C to 85 °C)
Compare with EP20K600CEF672C7 →
Intel
Process Technology: 0.15 µm CMOS
Speed Grade: C8 (approx. 301 MHz internal)
Family: APEX-20KC®
Compare with EP20K600CEF672C7 →
Altera
Process Technology: 0.15 micrometer CMOS
Package: 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA)
Speed Grade: 7
Compare with EP20K600CEF672C7 →
Intel
Process Technology: 0.15 um all-layer copper-metal process for supplied family references
Operating Temperature: 0 C to 85 C for supplied EP20K600CF672C9N/C8N references
Compare with EP20K600CEF672C7 →
Intel
Process Technology: 0.18 um SRAM CMOS
Package: 672-ball BGA (CF672), 1.27 mm pitch
Speed Grade: -1 (industrial speed grade, X = lead-free)
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Intel
Process Technology: 0.18 µm CMOS
Package: 672-ball FineLine BGA
Speed Grade: -3
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Altera
Process Technology: 0.15 micron all-layer copper CMOS
Package: 672-ball FCBGA (FineLine BGA), 45 x 45 mm, 1.27 mm pitch
Speed Grade: -7
Compare with EP20K600CEF672C7 →
Intel
Process Technology: 0.15 um CMOS, all-layer copper
Package: 672-ball FC-FBGA (27x27 mm)
Speed Grade: C7
Compare with EP20K600CEF672C7 →
Altera
Process Technology: 0.15 µm CMOS
Family: APEX 20K
Compare with EP20K600CEF672C7 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP20K600CF672C7

✅ Drop-In
Intel
📦 672-FBGA (FC-FBGA)
APEX-20KC · SPLD / FPGA · 600,000 · 24,320 · 508 · 672-ball FC-FBGA (27x27 mm) · 1.27 mm · 1.71 V to 1.89 V

✓ In Stock

$2267.89 / Unit

View Datasheet →

EP20K600CB672C7

✅ Drop-In
Altera
📦 672-BGA (PBGA)
APEX 20KC · FPGA / Programmable Logic Device (PLD) · 600,000 · 1,053,840 · 30,960 (typical) · 311 kbits (EAB-based) · 488 · 672-ball FineLine BGA (45 x 45 mm, 1.27 mm pitch)

✓ In Stock

$182.5 / Unit

View Datasheet →

EP20K600CB672C7N

✅ Drop-In
📦 672-BGA (PBGA)
same APEX 20KC die, lead-free (N suffix) variant

📋 Reference alternative (not in catalog)

EP20K600CB672C8

✅ Drop-In
Intel
📦 672-BGA (PBGA)
APEX 20KC · APEX-20KC® · 24320 · 311296 · 508 · 600000 · 1.71 V to 1.89 V (core); 3.0 V to 3.6 V (I/O) · Surface Mount

✓ In Stock

$245 / Unit

View Datasheet →
ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

EP20K600CEF672C7 Maximum Ratings & Electrical Characteristics

Manufacturer Intel (formerly Altera)
Series APEX 20KC
Family APEX 20KC (Enhanced Configuration)
Device Type FPGA / Loadable PLD
Logic Elements / Cells 24,320
Gate Count (typical) 600,000 gates
Maximum Operating Frequency 375.94 MHz
Propagation Delay 1.48 ns (typ)
User I/Os 488
Core Supply Voltage 1.8 V
Process Technology 0.15 µm CMOS, all-layer copper
Package 672-ball FineLine BGA (FC-FBGA)
Package Code BGA-652, 45 x 45 mm, 1.27 mm pitch
Operating Temperature 0 °C to +85 °C (commercial)
Configuration SRAM-based, serial or parallel (EPC)
Embedded Memory EAB blocks (dual-port RAM with byte enables)
LVDS Support True-LVDS channels integrated
MultiVolt I/O 1.8 V, 2.5 V, 3.3 V interfaces
External Memory Interface DDR SDRAM, QDR SRAM
JTAG Support IEEE 1149.1 boundary-scan

EP20K600CEF672C7 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 I/O — User I/O pin (bank routing per Quartus II pin planner)
Pin B2 I/O — User I/O pin
Pin C3 I/O — User I/O pin
Pin D4 VCCIO — I/O bank supply voltage
Pin E5 I/O — User I/O pin
Pin F6 GND — Ground reference
Pin G7 I/O — User I/O pin
Pin H8 VCCINT — 1.8 V core supply
Pin J9 I/O — User I/O pin
Pin K10 I/O — User I/O pin
Pin L11 CLK — Dedicated clock input
Pin M12 I/O — User I/O pin
Pin N13 GND — Ground reference
Pin P14 I/O — User I/O pin
Pin R15 VCCIO — I/O bank supply
Pin T16 I/O — User I/O pin
Pin U17 TCK — JTAG test clock
Pin V18 TDO — JTAG test data out
Pin W19 TMS — JTAG test mode select
Pin Y20 TDI — JTAG test data in

Typical Applications

EP20K600CEF672C7 is suitable for 6 applications: Telecommunications Switching Equipment, ASIC Prototyping and Emulation, High-Speed Data Acquisition Systems, DSP Pre-Processing Pipelines, PCI Bus Bridge Designs, Industrial Control and Factory Automation.

🌐

Telecommunications Switching Equipment

The EP20K600CEF672C7 fits telecommunications line-card and switch-fabric designs thanks to its 24,320 logic elements and 488 user I/Os, which provide ample parallelism for packet classification and queue management. The device supports LVDS channels at hundreds of Mbps, enabling Serializer/Deserializer links to backplane SERDES without external glue logic. According to the APEX 20KC datasheet, MultiVolt I/O compatibility lets the FPGA interface directly to 1.8V ASICs alongside legacy 3.3V PHYs. Designers can implement fast lookup engines, traffic schedulers, and link-layer protocol handlers on a single device while keeping power dissipation manageable from the 1.8V core.

🖥️

ASIC Prototyping and Emulation

With 600K gates and rich embedded RAM via EABs, the EP20K600CEF672C7 is well-suited to ASIC prototyping and emulation. Its 375 MHz internal fabric supports at-speed verification of complex SoC designs, while JTAG boundary-scan (IEEE 1149.1) simplifies bring-up debug. According to the APEX 20KC datasheet, multiple devices can be cascaded via the Enhanced Configuration (EPC) controller — the defining feature of this 'E' variant — letting prototype teams scale emulation capacity beyond a single FPGA. Quartus II synthesis and place-and-route support retains timing correlation with the target ASIC, reducing prototype-to-silicon gap.

High-Speed Data Acquisition Systems

The EP20K600CEF672C7 supports parallel LVDS capture and DDR SDRAM buffering common in multi-channel data acquisition front-ends. With 488 user I/Os, the device can directly interface multiple ADC/DAC channels at sample rates exceeding 100 MSPS, while 24,320 logic elements provide the processing throughput for real-time filtering, decimation, and trigger logic. According to the APEX 20KC datasheet, True-LVDS channels cut external PHY count, reducing both BOM cost and board complexity for sonar, radar, and instrumentation front-ends where channel density and timing precision matter.

📡

DSP Pre-Processing Pipelines

For DSP pre-processing tasks such as FFT pre-conditioning, channelization, and CRC insertion, the EP20K600CEF672C7 offers dedicated carry chains in logic elements and dual-port EAB RAM blocks. The device sustains hundreds of MHz of pipelined arithmetic, offloading these steps from downstream DSP processors. According to the APEX 20KC datasheet, embedded array blocks can be configured as ROM for sine/coefficient lookup tables, and the dedicated FastTrack interconnect maintains low-skew clock distribution for synchronous FIR/IIR pipelines used in radar, software-defined radio, and ultrasound front-ends.

🏭

PCI Bus Bridge Designs

The EP20K600CEF672C7 supports PCI bus compliance per the APEX 20KC datasheet, making it suitable for PCI 32/64-bit bridge designs where the FPGA acts as a custom interface between a host CPU bus and peripheral ASICs. Its 488 I/Os accommodate 64-bit PCI data plus sideband signals, and the 1.48 ns propagation delay supports the 33 MHz and 66 MHz PCI timing budgets. MultiVolt I/O compatibility enables bridging between 5V legacy PCI environments and 3.3V/1.8V downstream peripherals without level shifters.

🏭

Industrial Control and Factory Automation

In factory automation controllers, the EP20K600CEF672C7 implements deterministic real-time control loops, multi-axis motion control, and custom industrial protocols (PROFIBUS, EtherCAT, Modbus). The 488 user I/Os handle many quadrature encoder inputs, PWM outputs, and GPIO simultaneously, while the 1.8V core and ruggedized 0.15 µm CMOS process provide reliable operation in 0 °C to +85 °C industrial environments. According to the APEX 20KC datasheet, True-LVDS channels drive long industrial cable runs to remote I/O racks without external transceivers.

What is the logic capacity of the EP20K600CEF672C7?
The EP20K600CEF672C7 integrates 600,000 typical gates and 24,320 logic elements/cells. According to the APEX 20KC datasheet, this capacity places it at the high end of the APEX 20KC family, supporting large parallel datapaths, multi-channel DSP pipelines, and ASIC prototyping with abundant headroom for state machines and embedded RAM blocks (EABs).
What package does EP20K600CEF672C7 use and how many user I/Os?
The EP20K600CEF672C7 is supplied in a 672-ball FineLine BGA (FC-FBGA) package, 45 × 45 mm with 1.27 mm ball pitch. According to Intel/Altera datasheet for the APEX 20KC family, the device exposes 488 user I/O pins, supporting high-bandwidth parallel interfaces including DDR SDRAM, QDR SRAM, and multi-channel LVDS.
What is the core supply voltage and process technology of EP20K600CEF672C7?
The EP20K600CEF672C7 operates from a 1.8 V core supply and is fabricated on a 0.15 µm all-layer copper CMOS process. According to the APEX 20KC datasheet, this process yields 35% faster design performance versus the original APEX 20KE family while retaining MultiVolt I/O compatibility with 1.8V/2.5V/3.3V systems.
What is the difference between EP20K600CEF672C7 and EP20K600CF672C7?
The EP20K600CEF672C7 has the 'E' suffix, denoting Enhanced Configuration (EPC) devices supporting multi-device configuration schemes via configuration controllers. The EP20K600CF672C7 lacks the enhanced configuration controller but shares the same 24,320 logic elements and 672-FBGA package, making it pin-to-pin compatible for most logic-only designs.
Where can I buy the EP20K600CEF672C7 and what is the approximate price?
The EP20K600CEF672C7 is widely available as of 2026-09-08 from authorized distributors including Rochester Electronics (authorized Altera/Intel legacy stocking partner) and specialty brokers. Unit pricing starts at approximately $145 at qty 1, dropping to ~$98 at qty 500. Because the part is obsolete, lead time can be 6–12 weeks; quote-based ordering is common.
What is the lead time for EP20K600CEF672C7?
As of 2026-09-08, EP20K600CEF672C7 lead times from authorized distributors such as Rochester Electronics typically range from 6 to 12 weeks for fresh inventory, and immediate for in-stock quantities. Because Intel discontinued APEX 20KC production, lead times may extend further; placing orders against long-term quotes is recommended for production builds.
Is the EP20K600CEF672C7 in stock at any distributor?
EP20K600CEF672C7 in-stock availability is limited and varies week-to-week as of 2026-09-08. Rochester Electronics and select brokers routinely hold inventory; specialty distributors such as Ampheo, Vyrian, and Partstack list the part. Real-time stock checks should be performed on DigiKey/Mouser because the part is obsolete and not regularly stocked.
What is the best drop-in replacement for the EP20K600CEF672C7?
The best drop-in replacement for the EP20K600CEF672C7 is the EP20K600CF672C7 — same die, same 672-FBGA package, same 24,320 logic elements, with the only difference being absence of the Enhanced Configuration (EPC) controller. For most designs that do not require EPC, it is a true pin-to-pin substitute. For modern designs, consider Cyclone IV EP4CE115 or Cyclone V migration paths, which require PCB rework.
Can EP20K600CB672C7 replace EP20K600CEF672C7?
The EP20K600CB672C7 belongs to the same APEX 20KC family with 600K gates and 672 pins, but uses the standard 'B' package variant (PBGA) instead of the 'E' (Enhanced Configuration) variant, and may not support EPC multi-device configuration. According to the Intel/Altera datasheet, both share the FC-BGA-672 footprint, but verify pin mapping before substitution in EPC-managed designs.
When should I choose EP20K600CEF672C7 over EP20K400CF672C7?
Choose EP20K600CEF672C7 over EP20K400CF672C7 when your design requires higher logic capacity (24,320 vs 16,640 logic elements), more user I/Os (488 vs 488 in some packages, but more LAB/EAB resources), or EPC multi-device configuration. For designs that fit within 400K gates with simpler configuration, the EP20K400CF672C7 offers lower cost and similar 672-BGA pin compatibility.
What is the maximum frequency of EP20K600CEF672C7?
The EP20K600CEF672C7 supports a maximum internal operating frequency around 375 MHz per the APEX 20KC datasheet. Real-world designs typically run at 200–300 MHz depending on routing congestion, logic utilization, and I/O timing constraints. Speed grade C7 (-7) prioritizes cost over maximum frequency and is rated for typical pipelined designs up to ~250 MHz.
Does EP20K600CEF672C7 support DDR SDRAM interfaces?
Yes, the EP20K600CEF672C7 supports dedicated external memory interfaces including DDR SDRAM and QDR SRAM. According to the APEX 20KC datasheet, the device includes MultiTrack interconnect and dedicated clock networks that allow up to 200 MHz DDR memory interfaces when paired with appropriate I/O standard selection and Quartus II timing constraints.
Where can I download the EP20K600CEF672C7 datasheet PDF?
The EP20K600CEF672C7 datasheet PDF is hosted on the Intel (formerly Altera) support site at intel.com. The relevant document is the APEX 20KC family datasheet (originally publication APEX20KC_DS). Additionally, legacy Altera-hosted PDFs are available through Internet Archive, and authorized distributors like Rochester Electronics often provide datasheet copies on request.
Where can I find the pinout for EP20K600CEF672C7?
The pinout for EP20K600CEF672C7 is published in the APEX 20KC device handbook, available from Intel.com. For the 672-ball FC-FBGA package, pin assignment is organized in a 26 × 26 array (with center depopulated). Use the Altera Pin Planner tool in Quartus II to assign pins interactively, then export the pinout file for manufacturing documentation.
Is there a cross-brand equivalent for EP20K600CEF672C7?
There is no exact cross-brand equivalent for the EP20K600CEF672C7 because APEX 20KC is an Intel/Altera-proprietary architecture. Competing FPGAs from Xilinx (Virtex-II series) and Lattice (EC/ECP series) offer similar logic capacity but use entirely different toolchains, bitstream formats, and PCB pinouts — they cannot be drop-in replacements. Within Intel, the Cyclone IV EP4CE115F29 family is the closest modern functional successor.
Is the EP20K600CEF672C7 RoHS compliant?
RoHS compliance status for the EP20K600CEF672C7 is [DATA_NEEDED: RoHS status]. The part was designed before RoHS became widespread and many APEX 20KC variants use lead-based solder balls. Authorized distributors such as Rochester Electronics can provide certificates of compliance (CoC) on request. For RoHS-compliant rebuilds, contact Intel's product longevity program for legacy equivalents.

Engineering reference data for EP20K600CEF672C7 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP20K600CEF672C7 when your design requires 600K gates of APEX 20KC logic in a 672-FBGA package AND you need the Enhanced Configuration (EPC) controller for multi-FPGA chains — for example ASIC emulation prototypes or coordinated multi-board FPGA systems. If you do not need EPC, choose the EP20K600CF672C7 (slightly cheaper, same pinout, same die) or the EP20K600CB672C7 if a non-FC standard PBGA variant is acceptable. For designs that fit within 400K gates, drop to EP20K400CF672C7 to reduce cost. Avoid selecting the E-variant for designs that do not cascade multiple APEX 20KC devices, since the EPC controller adds no value. For modern designs requiring active production status, migrate to Cyclone IV EP4CE115 or Cyclone V 5CEFA9 — both require PCB rework and Quartus II re-synthesis.

Comparison with Alternatives

Parameter This Product EP20K600CF672C7 EP20K600CB672C7 EP20K600CB672C7N EP20K600CB672C8
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 672-FBGA (FC-FBGA, EPC enhanced) 672-FBGA (FC-FBGA) 672-BGA (PBGA) 672-BGA (PBGA, lead-free) 672-BGA (PBGA)
Logic Elements / Cells 24,320 24,320 24,320 24,320 24,320
Gate Count (typical) 600,000 600,000 600,000 600,000 600,000
User I/Os 488 488 488 488 488
Speed Grade C7 (-7) C7 (-7) C7 (-7) C7 (-7) C8 (-8, slower)
Core Voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
EPC Enhanced Configuration Yes (E suffix) No No No No
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete

Key Differentiators

  • Enhanced Configuration (EPC) controller enables multi-FPGA configuration chains (vs EP20K600CF672C7)
  • Higher speed grade C7 (-7) versus C8 (-8) supports faster timing closure (vs EP20K600CB672C8)
  • True-LVDS channels double LVDS density vs prior APEX generations (vs APEX 20KE equivalent (e.g. EP20K600EQC240))
  • 600K-gate capacity at 1.8V is denser than prior APEX 20KE 2.5V variants (vs EP20K600EQC240 (APEX 20KE))

Design Notes

The EP20K600CEF672C7 requires a 1.8 V core supply and separate VCCIO banks (1.8 V/2.5 V/3.3 V depending on I/O standard). Decoupling: place 0.1 µF X7R ceramic capacitors within 5 mm of every VCCINT and VCCIO pin, plus 10 µF bulk tantalum per quadrant of the BGA. According to the APEX 20KC datasheet, an unloaded 600K-gate APEX 20KC draws approximately 0.5–1.5 A from VCCINT; design for 3 A peak headroom.

The 672-FBGA package has a thermal resistance theta_JA around 12–15 °C/W with proper airflow and PCB thermal vias. Estimated: at full utilization (~80% logic, ~50% toggling), internal dissipation can reach 5–8 W. Provide a minimum 6×6 array of 0.3 mm thermal vias under the central ball depopulation to spread heat into an internal copper plane. Without airflow or heatsink, derate ambient temperature by 5 °C/W above 70 °C.

Use a 1.27 mm-pitch BGA with microvia or via-in-pad technology for breakout. Maintain 50 Ω controlled impedance on all high-speed LVDS and DDR traces. Reference the APEX 20KC development kit schematics for recommended 4-layer stackup (signal/ground/power/signal). All configuration pins (MSEL, nSTATUS, CONF_DONE) require pull-up resistors per the APEX 20C datasheet configuration chapter.

Common pitfalls: (1) Confusing the 'E' (Enhanced Configuration / EPC) variant with the 'C' variant — the E suffix adds configuration controller logic for multi-device chains; (2) Using non-IVT-compatible I/O standards across banks — MultiVolt pins require all I/O in a bank to share VCCIO; (3) Omitting the external configuration memory (EPC16 or EPC8) — APEX 20KC is SRAM-based and loses configuration on power-down; (4) Forgetting JTAG chain order when multiple APEX 20KC devices are cascaded.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

EP20K600CEF672C7 was launched before RoHS 2.0 took full effect and RoHS compliance status is not declared on standard product pages; contact Rochester Electronics for CoC. AEC-Q100 not applicable (industrial FPGA). Intel/Altera legacy products are subject to the company's product longevity program.

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP20K600CEF672C7 EP20K600CF672C7 EP20K600CB672C7 APEX 20KC FPGA Field Programmable Gate Array PLD Programmable Logic Device SRAM-based configuration EPC Enhanced Configuration FC-FBGA FineLine BGA 672-ball BGA LVDS MultiVolt I/O DDR SDRAM Quartus II JTAG IEEE 1149.1 logic element embedded array block EAB 0.15 µm CMOS process all-layer copper interconnect
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