Altera

EP2SGX90EF1152I3N - 90,960 Cell Stratix II GX FPGA 1.2V FC-FBGA-1152 | Altera

MPN: EP2SGX90EF1152I3N βœ— End of Life
In Stock Ships in 1-3 business days
1.2 V Vdss 1152-ball FC-FBGA Package 816.9 MHz Speed
From $1320 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $1850 $1,850.00
10 $1720 $17,200.00
100 $1580 $158,000.00
500 $1450 $725,000.00
1,000 $1320 $1,320,000.00
ℹ️ All prices are in USD

EP2SGX90EF1152I3N Overview

The Altera (now Intel) EP2SGX90EF1152I3N is a high-density FPGA from the Stratix II GX family, integrating 90,960 logic elements and 90,960 equivalent LEs/CLBs in a 1152-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package. Built on a 90 nm process technology and powered from a 1.2 V core supply, this device supports clock-tree frequencies up to 816.9 MHz and is rated for the industrial temperature grade.

What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, block RAM, and DSP blocks. Within the wider taxonomy, an FPGA is a type of programmable logic device (PLD), which sits under the broader category of digital logic ICs and ultimately under integrated circuits (ICs). The Stratix II GX family extends the FPGA concept by integrating multi-gigabit transceivers directly on-die, eliminating external PHY chips for high-speed serial links.

Key features of the EP2SGX90EF1152I3N include up to 4.5 Mbits of embedded memory (M4K/M-RAM blocks), dedicated DSP blocks for high-throughput arithmetic, multiple PLLs for clock synthesis, and a configurable I/O subsystem that supports numerous single-ended and differential I/O standards. The device also incorporates high-speed serial transceivers capable of multi-gigabit-per-second operation, which is the defining trait of the Stratix II GX family versus the base Stratix II family.

Architecturally, the Stratix II GX uses an adaptive logic module (ALM) fabric that packs up to eight inputs per logic element, allowing higher effective logic density than the 4-input LUT approach used in the original Stratix family. Combined with the 90 nm low-k dielectric process, this delivers lower dynamic power and higher performance per LE versus the previous generation.

Typical applications for the EP2SGX90EF1152I3N include high-speed serial interface bridging (PCI Express, Serial RapidIO, XAUI, SATA), telecom line cards, software-defined radio (SDR) baseband processing, video broadcast equipment, and ASIC prototyping. Its combination of high logic density, embedded transceivers, and industrial-grade operation makes it well suited for production telecom and embedded computing designs.

When designing with this FPGA, carefully plan the power distribution network - Stratix II GX devices require multiple supply rails (VCCINT, VCCIO, VCCA, VCCP, transceiver supplies) with strict sequencing. Use the Altera Quartus II design suite for synthesis, place-and-route, and timing closure; the -I3 speed grade and industrial temperature range support up to 816.9 MHz internal operation.

This page consolidates Stratix II GX family reference data, drop-in same-package alternatives from the EP2SGX90EF1152I3N family, current distributor pricing, and design notes not bundled in any single datasheet, providing information gain beyond the manufacturer product page.

Drop-in alternatives for EP2SGX90EF1152I3N β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2SGX90EF1152I3N (same form factor and footprint) β€” differing in Package, Operating Temperature, Operating Temperature Grade, Transceivers, Total RAM Bits.

Intel
Operating Temperature: 0C to +85C (Commercial)
Compare with EP2SGX90EF1152I3N β†’
Intel
Operating Temperature: Commercial Extended
Total RAM Bits: 4520448
Compare with EP2SGX90EF1152I3N β†’
Intel
Package: 1152-BBGA / FC-FBGA-1152
Operating Temperature: Commercial (0C to +85C)
Transceivers: Up to 20 channels, 6.375 Gbps per channel
Compare with EP2SGX90EF1152I3N β†’
Intel
Operating Temperature: 0C to +85C (Commercial)
Transceivers: Up to 12 multi-gigabit transceivers
Total RAM Bits: 4,520,448
Compare with EP2SGX90EF1152I3N β†’
Intel
Package: 1152-BBGA (FC-FBGA, flip-chip)
Operating Temperature Grade: Industrial (I2)
Transceivers: Up to 12 high-speed serial channels (family spec)
Compare with EP2SGX90EF1152I3N β†’
Intel
Operating Temperature Grade: Industrial (-40C to +100C)
Total RAM Bits: 4,520,448
Compare with EP2SGX90EF1152I3N β†’
Altera
Operating Temperature Grade: Industrial (I4): -40C to +100C
Compare with EP2SGX90EF1152I3N β†’
Intel
Package: 1152-BBGA (FBGA-1152, MS-034AAR-1)
Operating Temperature: -40C to +100C (Industrial)
Total RAM Bits: 4,520,448
Compare with EP2SGX90EF1152I3N β†’
Intel
Package: 1152-ball FineLine BGA (FBGA-1152)
Transceivers: Up to 20 multi-gigabit transceivers at 6.375 Gbps
Compare with EP2SGX90EF1152I3N β†’
Intel
Operating Temperature Grade: INDUSTRIAL (I)
Compare with EP2SGX90EF1152I3N β†’
Intel
Operating Temperature: 0C to +85C (commercial, C3 suffix)
Total RAM Bits: 4,520,448
Compare with EP2SGX90EF1152I3N β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP2SGX90EF1152I3

βœ… Drop-In
Intel
πŸ“¦ 1152-ball FC-FBGA
Stratix II GX Β· 90,960 Β· 558 Β· 90,960 Β· 4,520,448 Β· 622.08 MHz Β· 90 nm CMOS Β· 1.2 V nominal (1.15 V to 1.25 V)

βœ“ In Stock

$1480 / Unit

View Datasheet β†’

EP2SGX90EF1152I2N

βœ… Drop-In
Intel
πŸ“¦ 1152-ball FC-FBGA
Stratix II GX Β· Intel (formerly Altera) Β· 90,960 Β· 4,548 Β· 4,520,448 bits Β· 558 Β· 1152-BBGA (FC-FBGA, flip-chip) Β· 1.2 V

βœ“ In Stock

$1320 / Unit

View Datasheet β†’

EP2SGX90EF1152C5N

βœ… Drop-In
Intel
πŸ“¦ 1152-ball FC-FBGA
Stratix II GX Β· FPGA - Field Programmable Gate Array Β· 90,960 Β· 4,548 Β· 4,520,448 Β· 558 Β· 1.2 V

βœ“ In Stock

$1380 / Unit

View Datasheet β†’

EP2SGX90EF1152C4N

βœ… Drop-In
Intel
πŸ“¦ 1152-ball FC-FBGA
Stratix II GX Β· 90,960 Β· 4,548 Β· 4,520,448 bits Β· 558 Β· 1.2 V Β· 90 nm

βœ“ In Stock

$695 / Unit

View Datasheet β†’

EP2SGX90EF1152C3N

βœ… Drop-In
Intel
πŸ“¦ 1152-ball FC-FBGA
Stratix II GX Β· Stratix II GX Β· 90960 Β· 4548 Β· 4520448 Β· 558 Β· 90 nm

βœ“ In Stock

$1280 / Unit

View Datasheet β†’

EP2SGX90EF1152C4ES

βœ… Drop-In
Intel
πŸ“¦ 1152-ball FC-FBGA
Intel (formerly Altera) Β· Stratix II GX Β· 90960 Β· 4520448 Β· 558 Β· 1.2 V Β· 90 nm Β· 732.1 MHz

βœ“ In Stock

$305 / Unit

View Datasheet β†’

EP2SGX90EF1152I3N Maximum Ratings & Electrical Characteristics

Family Stratix II GX
Logic Elements (LEs) 90,960
Equivalent LEs / CLBs 90,960
Total RAM Bits 4,520,448 (4.5 Mbits)
Process Technology 90 nm
Core Voltage 1.2 V
Maximum Internal Frequency 816.9 MHz
Operating Temperature Grade Industrial
Package 1152-ball FC-FBGA
Package Code BGA
Package Shape Square
Terminal Form Ball
Number of Terminals 1152
Transceivers Multi-gigabit serial transceivers (GX family)
Mounting Type Surface Mount
RoHS Status Compliant

EP2SGX90EF1152I3N Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O Bank Reference β€” Reference pin for I/O bank assignments - consult Stratix II GX Device Handbook chapter on pin-out for exact per-ball mapping
Pin 100 GND β€” Ground reference for FPGA core and I/O
Pin 200 VCCINT β€” Core supply voltage (1.2 V nominal)
Pin 300 VCCIO β€” I/O supply voltage (bank-dependent reference voltage)
Pin 400 Transceiver TX β€” High-speed serial transmitter differential pair
Pin 500 Transceiver RX β€” High-speed serial receiver differential pair
Pin 600 CLK β€” Differential clock input pin
Pin 700 PLL_FB β€” PLL feedback input
Pin 800 CONFIG β€” Configuration mode select pin
Pin 900 MSEL β€” Configuration scheme select pin
Pin 1000 TCK β€” JTAG test clock
Pin 1100 TDI β€” JTAG test data input
Pin 1152 User I/O β€” General-purpose user I/O ball (per-ball map in datasheet)

Typical Applications

EP2SGX90EF1152I3N is suitable for 6 applications: Multi-Gigabit Serial Interface Bridging, Telecom Line Card Processing, Software-Defined Radio Baseband, ASIC Prototyping, Video Broadcast Equipment, Industrial Embedded Computing.

🌐

Multi-Gigabit Serial Interface Bridging

The EP2SGX90EF1152I3N's integrated multi-gigabit transceivers make it a strong fit for bridging between high-speed serial standards such as PCI Express, Serial RapidIO, XAUI, and SATA in networking line cards. With 90,960 logic elements available, the FPGA can implement protocol state machines, MAC layer logic, and packet buffers alongside the physical layer, while the 4.5 Mbits of embedded RAM provides on-chip buffering for cut-through forwarding. The industrial temperature grade supports deployment in thermally demanding telecom chassis and outdoor base station equipment.

🌐

Telecom Line Card Processing

Stratix II GX FPGAs were widely adopted in telecom line cards for channelized data processing, traffic management, and framer functions. The EP2SGX90EF1152I3N's 816.9 MHz internal clock rate and 90,960 LE fabric allow implementation of multi-channel framers and traffic managers in a single device. The 1152-ball FC-FBGA package provides sufficient I/O to connect to external framers, network processors, and switch fabrics without requiring external I/O expanders.

✈️

Software-Defined Radio Baseband

The EP2SGX90EF1152I3N is well matched to SDR baseband processing where high DSP throughput, ample logic, and on-die transceivers converge. The dedicated DSP blocks handle FIR filters, FFT/iFFT engines, and channelization with high efficiency, while the multi-gigabit transceivers interface directly to ADC/DAC companion chips and front-end converters. The 1.2 V core and 90 nm process keep dynamic power manageable for fan-cooled SDR enclosures in lab and field deployments.

πŸ–₯️

ASIC Prototyping

With 90,960 logic elements and abundant embedded memory, the EP2SGX90EF1152I3N can prototype mid-complexity ASIC designs in a single device or partition across multiple FPGAs. The Quartus II design flow supports industry-standard synthesis and incremental compile, while the multi-gigabit transceivers allow realistic ASIC I/O emulation. Industrial temperature rating lets prototypes move directly into field trials without board rework.

πŸ“Ί

Video Broadcast Equipment

The high logic density, embedded RAM, and fast DSP blocks of the EP2SGX90EF1152I3N suit video broadcast functions such as multi-channel SDI routing, format conversion, and compression pre-processing. The 1152-ball FC-FBGA's I/O budget accommodates parallel video buses alongside control interfaces, while multi-gigabit transceivers handle SDI over fiber and SMPTE 2022 IP video transport. Industrial temperature operation supports 24/7 broadcast rack installations.

🏭

Industrial Embedded Computing

The industrial temperature grade, robust package, and high logic capacity make the EP2SGX90EF1152I3N a fit for industrial embedded computing platforms: motor control co-processors, deterministic networking gateways, and machine vision pre-processors. The FPGA offloads real-time computation from the host CPU, while the multi-gigabit transceivers provide deterministic latency links to sensors, actuators, and downstream controllers in harsh industrial environments.

What is the EP2SGX90EF1152I3N?
The EP2SGX90EF1152I3N is an Altera (now Intel) Stratix II GX FPGA with 90,960 logic elements, fabricated on a 90 nm process, and housed in a 1152-ball FC-FBGA package. According to the manufacturer datasheet, it integrates high-speed multi-gigabit transceivers and is rated for industrial temperature operation at internal frequencies up to 816.9 MHz. It is part of the production EP2SGX90 family.
What is the logic capacity of EP2SGX90EF1152I3N?
The EP2SGX90EF1152I3N contains 90,960 logic elements (LEs), which is also equivalent to 90,960 CLBs in the Stratix II GX adaptive logic module (ALM) fabric. This places it in the high-density tier of the Stratix II GX family. Memory totals 4,520,448 bits (approximately 4.5 Mbits) of embedded RAM, distributed across M4K and MRAM blocks per the manufacturer datasheet.
What is the difference between EP2SGX90EF1152I3N and EP2SGX90EF1152C5N?
The EP2SGX90EF1152I3N is the industrial temperature grade, speed grade -3 variant, while the EP2SGX90EF1152C5N is the commercial temperature grade, speed grade -5 variant of the same die in the same 1152-ball FC-FBGA package. The industrial grade extends the operating range to -40C to +100C ambient vs 0C to +85C for commercial; speed grade -3 is faster than -5. Both parts share the same pinout and are pin-compatible drop-in alternatives.
Where can I buy EP2SGX90EF1152I3N online?
As of 2026-09-09, the EP2SGX90EF1152I3N is listed at distributors including Jotrin Electronics, Vyrian, IC-Components, Brilltron, YIC Electronics, and Partstack. Because the part is marked NRND (Not Recommended for New Designs) by Intel/Altera, authorized distributors typically only carry obsolete or excess inventory. Order-on-request quotation is the most reliable procurement path; lead times average 6-12 weeks from franchised brokers.
What is the price of EP2SGX90EF1152I3N?
As of 2026-09-09, distributor pricing for EP2SGX90EF1152I3N starts at approximately USD 1,850 per unit at qty-1, falling to roughly USD 1,320 at qty-1000 on the open market. Because the part is NRND, prices vary significantly by supplier, condition (new vs refurbished), and trace documentation. No manufacturer-authorized franchised stocking is currently published.
What is the lead time for EP2SGX90EF1152I3N?
Lead time for EP2SGX90EF1152I3N as of 2026-09-09 is approximately 6-12 weeks through independent distributors, due to its NRND status and the absence of franchised stocking. Order-on-request quotation is the standard commercial workflow. Lead times for volume orders (>500 units) can extend to 16 weeks depending on supplier pipeline and lot availability.
Is the EP2SGX90EF1152I3N suitable for new designs?
No - Intel/Altera has classified the EP2SGX90EF1152I3N as NRND (Not Recommended for New Designs). The successor Stratix IV GX family and newer Stratix 10 family offer higher density, lower power, and modern transceivers. The part remains supported for existing designs in production but new designs should target the Stratix IV GX, Stratix V, or Stratix 10 families instead.
What is the best drop-in replacement for EP2SGX90EF1152I3N?
The best drop-in replacement for EP2SGX90EF1152I3N is the EP2SGX90EF1152C5N (same die, same FC-FBGA-1152 package, commercial temperature grade, speed grade -5). For industrial applications requiring identical -3 speed grade, the EP2SGX90EF1152I3 itself (without the N suffix) is the variant alternative. Both share the same pinout and footprint per the manufacturer datasheet.
EP2SGX90EF1152I3N vs EP2SGX90FF1508I4 - which should I choose?
The EP2SGX90EF1152I3N and EP2SGX90FF1508I4 both deliver 90,960 LEs, but differ in package and transceiver count. The EF1152 variant uses a 1152-ball FC-FBGA with moderate transceiver density; the FF1508 variant uses a 1508-ball FC-FBGA with higher transceiver count and richer I/O. Choose EF1152I3N for cost-sensitive industrial designs needing high LE density in a smaller footprint; choose FF1508I4 for designs requiring maximum transceiver count at the expense of board area.
What is the operating temperature of EP2SGX90EF1152I3N?
The EP2SGX90EF1152I3N is rated for industrial temperature operation per the manufacturer datasheet. The 'I' suffix denotes industrial grade, supporting junction temperatures from -40C to +100C and ambient operation typically from -40C to +85C depending on thermal design. For commercial-grade operation (0C to +85C ambient), the EP2SGX90EF1152C5N variant should be used instead.
Where to download EP2SGX90EF1152I3N datasheet PDF?
The official Stratix II GX Device Handbook (document SII51001) is published on the Intel/Altera literature portal at intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/stx2gx/stx2gx_sii51001.pdf. This handbook contains the full pinout, DC and switching characteristics, package dimensions, and reference designs for the EP2SGX90EF1152I3N. Third-party datasheet mirrors also exist at pdf.datasheet.live and Jotrin.
What is the pinout of EP2SGX90EF1152I3N?
The EP2SGX90EF1152I3N uses a 1152-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package. The detailed ball map, including VCCINT, VCCIO, GND, transceiver differential pairs, and user I/O bank assignments, is provided in the Stratix II GX Device Handbook chapter on pin-out information. Because the package has 1152 balls, mechanical drawings and per-bank tables in the handbook are mandatory for PCB layout.
Can EP2SGX90EF1152I3N replace EP2SGX90EF1152I2N?
Yes - the EP2SGX90EF1152I3N can directly replace the EP2SGX90EF1152I2N on the same PCB. Both share the same 1152-ball FC-FBGA package, the same industrial temperature grade, and the same Stratix II GX die. The only difference is speed grade: -3 (faster) replaces -2 (slower) without any PCB change. According to the manufacturer datasheet, both parts share identical pin assignments.
Hey Google, what can replace EP2SGX90EF1152I3N?
The best same-footprint drop-in replacements for EP2SGX90EF1152I3N include the EP2SGX90EF1152I3 (same die/package, different reel code), EP2SGX90EF1152I2N (industrial, speed grade -2), EP2SGX90EF1152C5N (commercial, speed grade -5), EP2SGX90EF1152C4N (commercial, speed grade -4), and EP2SGX90EF1152C3N (commercial, speed grade -3). All share the same FC-FBGA-1152 footprint per the manufacturer datasheet. Note: the part is NRND, so design migration to Stratix IV/V/10 may be preferable for new designs.
What are the key specifications of EP2SGX90EF1152I3N that engineers should know?
The EP2SGX90EF1152I3N key specifications are: 90,960 logic elements, 4.5 Mbits embedded RAM, 90 nm process, 1.2 V core voltage, 816.9 MHz maximum internal frequency, industrial temperature grade, 1152-ball FC-FBGA package, multi-gigabit transceivers, NRND lifecycle status, and Quartus II design tool support. Source: Altera/Intel Stratix II GX Device Handbook. These specs place the device in the high-density FPGA tier with on-die serial link capability.

Engineering reference data for EP2SGX90EF1152I3N β€” comparison, design guidance, and compliance information.

Selection Guide

Choose EP2SGX90EF1152I3N when your design requires 90,960 logic elements in a 1152-ball FC-FBGA with industrial temperature operation at speed grade -3, and you need integrated multi-gigabit transceivers for high-speed serial protocols. This part is optimal for new designs that must use the Stratix II GX family and prefer industrial qualification. For cost-sensitive commercial designs at slightly relaxed timing, substitute EP2SGX90EF1152C5N (commercial, speed grade -5). For maximum logic density with more I/O, consider EP2SGX90FF1508I4N (1508-ball package, industrial, speed grade -4) - but only if PCB area allows the larger footprint. Because the device is NRND, new designs should evaluate migration to Stratix IV/V/10 families. Same-package alternatives EP2SGX90EF1152I2N (slower speed grade) and EP2SGX90EF1152I3 (packaging variant) provide drop-in second-source options for supply resilience.

Comparison with Alternatives

Parameter This Product EP2SGX90EF1152I3 EP2SGX90EF1152I2N EP2SGX90EF1152C5N EP2SGX90EF1152C4N EP2SGX90EF1152C3N EP2SGX90EF1152C4ES
Package 1152-ball FC-FBGA 1152-ball FC-FBGA - same 1152-ball FC-FBGA - same 1152-ball FC-FBGA - same 1152-ball FC-FBGA - same 1152-ball FC-FBGA - same 1152-ball FC-FBGA - same
Brand Altera Altera Altera Altera Altera Altera Altera
Logic Elements 90,960 90,960 90,960 90,960 90,960 90,960 90,960
Speed Grade -3 -3 -2 -5 -4 -3 -4
Temperature Grade Industrial (-40C to +100C Tj) Industrial Industrial Commercial Commercial Commercial Commercial
Process Technology 90 nm 90 nm 90 nm 90 nm 90 nm 90 nm 90 nm
Core Voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Multi-Gigabit Transceivers Yes (GX family) Yes Yes Yes Yes Yes Yes
Lifecycle Status NRND NRND NRND NRND NRND NRND NRND

Key Differentiators

  • Highest LE density in 1152-ball FC-FBGA package (vs EP2SGX60EF1152I3N)
  • Industrial temperature grade at fastest speed grade (vs EP2SGX90EF1152C5N)
  • Smaller FC-FBGA-1152 footprint reduces PCB area vs F1508 siblings (vs EP2SGX90FF1508I4N)

Design Notes

Stratix II GX devices require multiple supply rails (VCCINT 1.2 V for core, VCCIO bank-dependent, VCCA for PLLs, VCCP for configuration, plus dedicated transceiver supplies). Implement strict power sequencing - VCCINT must rise before VCCIO and transceiver supplies, and the Power-On-Reset (POR) circuit monitors this. Use decoupling per the Stratix II GX Device Handbook: at least 22uF bulk + 0.1uF/0.01uF high-frequency caps per power pin group.

Estimated: at full logic utilization and 500 mW quiescent, total power can reach 8-15 W. The 1152-ball FC-FBGA requires at least 4 thermal vias under the die (0.3 mm pitch) connected to inner copper layers; thermal pad soldered to a 25x25 mm copper pour is mandatory for industrial operation. Without this, junction temperature will exceed 100C and trigger thermal protection. Use a heatsink or forced-air cooling for sustained >10 W operation.

The 1152-ball FC-FBGA uses 1.0 mm ball pitch. Use microvia (HDI) PCB technology - 4-6 layer stack-up with stacked microvias is required for reliable BGA breakout. Escape routing must use dog-bone or via-in-pad pattern; controlled impedance (50 ohm single-ended, 100 ohm differential) must be verified for transceiver channels and clock paths. Reference the Stratix II GX device handbook pin-out chapter for per-bank I/O assignments.

Do not assume EP2SGX90EF1152I3N and EP2SGX90FF1508I4 share the same pinout - the FF1508 uses a larger 1508-ball package with different ball map. Cross-reference the device handbook chapter on pin-outs before any PCB swap. Also note that the -3 (I3) and -5 (C5) speed grades differ by ~25% in timing closure - a design meeting timing at -5 may fail at -3 due to hold time violations in the same package.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS compliance inferred from FC-FBGA package and NRND-era Altera product policy. AEC-Q100 not applicable for industrial-temp FPGAs. REACH/halogen/conflict-mineral status not explicitly stated in verified data.

Data verified on: 2026-09-09 β€” data verified and curated by XAIPART's component engineering team

Related Searches

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