EP2SGX90EF1152C5N - Stratix II GX FPGA 90,960 LE, 558 I/O | Intel
MPN: EP2SGX90EF1152C5N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1495 | $747,500.00 |
| 1,000 | $1380 | $1,380,000.00 |
EP2SGX90EF1152C5N Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and belong to the integrated circuits (IC) family, with variants including SRAM-based, flash-based, and antifuse-based architectures. Modern high-end FPGAs such as the Stratix II GX family integrate hard IP cores (transceivers, DSP blocks, memory interfaces) alongside general-purpose fabric, allowing one device to replace multiple discrete components on a board.
Key features of the EP2SGX90EF1152C5N include 558 user I/Os, support for DDR/DDR2/QDRII memory interfaces, dedicated DSP blocks for high-throughput arithmetic, and a 1.2 V core supply with 90 nm process technology. The part operates over the commercial temperature range (0C to +85C) and is offered in a -5 speed grade. The 1152-ball flip-chip BGA package enables high pin density while supporting the high-speed signal integrity required by multi-gigabit transceivers.
The Stratix II GX architecture employs an adaptive logic module (ALM) structure that improves logic efficiency versus prior 4-input LUT architectures, delivering higher effective logic capacity per die area. The integrated transceivers incorporate built-in clock data recovery (CDR), pre-emphasis, and equalization, supporting standards such as PCI Express, Serial RapidIO, XAUI, and CEI-6G without external PHY devices.
Typical applications include high-speed serial backplane interfaces, telecom line cards, high-end test and measurement equipment, video broadcast infrastructure, and protocol bridging ASIC prototyping. The combination of logic density and integrated multi-gigabit transceivers lets designers consolidate what would otherwise be a discrete ASSP plus FPGA solution onto a single device.
When designing with this part, pay close attention to power supply sequencing, PCB BGA fanout, and signal-integrity constraints on the transceiver channels. Reference designs and the Stratix II GX Device Handbook should be consulted for transceiver channel routing, decoupling strategies, and JTAG configuration circuit requirements. Designers should also note that the EP2SGX90 family is in its mature product lifecycle and may require sourcing through distribution channels.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a single, comprehensive reference for sourcing and designing with the EP2SGX90EF1152C5N.
Drop-in alternatives for EP2SGX90EF1152C5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90EF1152C5N (same form factor and footprint) β differing in Package, Transceivers, Operating Temperature, Speed Grade, Core Voltage.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX90EF1152C5
β Drop-Inβ In Stock
$225 / Unit
View Datasheet βEP2SGX90EF1152C5ES
β Drop-Inβ In Stock
$1495 / Unit
View Datasheet βEP2SGX90EF1152C4N
β Drop-Inβ In Stock
$695 / Unit
View Datasheet βEP2SGX90EF1152C4ES
β Drop-Inβ In Stock
$305 / Unit
View Datasheet βEP2SGX90EF1152C3N
β Drop-Inβ In Stock
$1280 / Unit
View Datasheet βEP2SGX90EF1152C3ES
β Drop-Inβ In Stock
$2050 / Unit
View Datasheet βEP2SGX90EF1152C5N Maximum Ratings & Electrical Characteristics
| Series | Stratix II GX |
| Family | FPGA - Field Programmable Gate Array |
| Logic Elements | 90,960 |
| Logic Array Blocks (LABs) | 4,548 |
| Total RAM Bits | 4,520,448 |
| User I/Os | 558 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm |
| Package | 1152-ball FC-FBGA |
| Mounting Type | Surface Mount |
| Speed Grade | 5 |
| Operating Temperature | 0C to +85C (Commercial) |
| RoHS Status | Compliant |
| Transceivers | Up to 12 multi-gigabit transceivers |
| Transceiver Data Rate | Up to 6.375 Gbps |
EP2SGX90EF1152C5N 1152-ball fc-fbga Pin Configuration Guide
Pin configuration for EP2SGX90EF1152C5N (1152-ball fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90EF1152C5N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90EF1152C5N is suitable for 6 applications: High-Speed Serial Backplane Interface, Telecom Line Card and Protocol Bridging, Test and Measurement Instrumentation, Video Broadcast and Imaging Infrastructure, ASIC Prototyping and Emulation, Industrial Control and High-Speed Data Acquisition.
High-Speed Serial Backplane Interface
The EP2SGX90EF1152C5N's integrated multi-gigabit transceivers support line rates up to 6.375 Gbps, making it well suited for high-speed backplane applications including XAUI, Serial RapidIO, and proprietary serial links. With up to 12 transceivers and built-in CDR, pre-emphasis, and equalization, the device can drive signals across 40+ inches of FR-4 backplane without external PHY chips. The 90,960 logic elements and 4,520,448 bits of embedded RAM provide ample fabric for protocol state machines, link-layer processing, and traffic management. Designers typically place the FPGA at the line-card edge with SMA or backplane connector interfaces, and the 1.2 V core plus PLL supply rails are sequenced per the Stratix II GX Device Handbook to ensure clean PLL lock at power-up.
Recommended
Telecom Line Card and Protocol Bridging
In telecom line-card designs, the EP2SGX90EF1152C5N serves as a protocol-bridging device between legacy TDM/Ethernet framer ASICs and modern packet-based backplanes. Its combination of 558 user I/Os, DDR2/QDRII memory controller hard IP, and 6.375 Gbps transceivers lets a single device aggregate multiple lower-speed interfaces into a high-speed uplink. The 4,520,448 bits of embedded RAM support packet buffering, traffic shaping, and statistics counters without consuming fabric logic. Operating from a 1.2 V core in the 0C to +85C commercial range, the device is designed for thermally-managed central-office enclosures. Designers should follow the Stratix II GX Device Handbook's reference designs for telecom line cards to minimize signal-integrity risk on the multi-gigabit links.
Recommended
Test and Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and BERT (bit-error-rate tester) instruments often use the EP2SGX90EF1152C5N for high-speed signal acquisition, pattern generation, and protocol decoding. The 12 multi-gigabit transceivers support stimulus and capture at 6.375 Gbps, while the 558 user I/Os handle parallel acquisition channels, control interfaces, and display data paths. The 4,520,448 bits of embedded RAM serve as deep acquisition buffers, and the 90,960 logic elements implement channelized trigger logic and DSP-based measurement functions. Per the Stratix II GX datasheet, the device's adaptive logic modules (ALMs) deliver efficient implementation of complex trigger state machines, which is critical for real-time protocol analysis. The 1152-ball FC-FBGA package supports the high pin density required for multi-channel instruments.
Recommended
Video Broadcast and Imaging Infrastructure
Broadcast video routers, multi-format converters, and medical imaging systems leverage the EP2SGX90EF1152C5N's high logic density and embedded DSP blocks for real-time video processing. The device can handle uncompressed HD-SDI, 3G-SDI, and proprietary video formats while performing color-space conversion, scaling, and overlay. The 558 user I/Os connect to video serializer/deserializer (SerDes) chips, while the transceivers drive long-distance coax or fiber links to other equipment racks. The 4,520,448 bits of embedded RAM act as line buffers and frame stores, reducing the need for external SDRAM. Designers targeting video broadcast should reference the Stratix II GX video reference designs and observe the 1.2 V core rail sequencing specified in the Device Handbook.
Recommended
ASIC Prototyping and Emulation
The EP2SGX90EF1152C5N is widely used in ASIC prototyping platforms where the high logic density, abundant I/Os, and integrated transceivers allow one or two FPGAs to emulate a large ASIC. With 90,960 logic elements and 4,520,448 bits of RAM, a single device can hold a substantial portion of a mid-complexity ASIC design, while the 6.375 Gbps transceivers emulate high-speed chip-to-chip interfaces. The 1152-ball FC-FBGA package provides dedicated configuration, JTAG, and clock pins, making it compatible with standard ASIC prototyping boards. Designers should run place-and-route targeting the -5 speed grade to validate timing closure; for less aggressive designs, the -4 or -3 speed grade variants (EP2SGX90EF1152C4N, EP2SGX90EF1152C3N) may be acceptable drop-ins.
Recommended
Industrial Control and High-Speed Data Acquisition
In industrial control and high-speed data-acquisition systems, the EP2SGX90EF1152C5N performs real-time signal processing, motion control, and high-bandwidth sensor fusion. The 558 user I/Os connect to parallel ADCs, DACs, encoder/decoder interfaces, and motor-control peripherals, while the embedded DSP blocks implement FIR filters, FFTs, and PID loops in hardware. The multi-gigabit transceivers enable high-speed links to remote sensor heads or supervisory controllers, and the 4,520,448 bits of embedded RAM act as deep sample buffers. Operating from a 1.2 V core, the device supports the commercial 0C to +85C range suitable for factory-floor enclosures. Designers should consult the Stratix II GX Device Handbook for industrial reference designs, especially around PLC and motion-control applications.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90EF1152C5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90EF1152C5 | EP2SGX90EF1152C5ES | EP2SGX90EF1152C4N | EP2SGX90EF1152C4ES | EP2SGX90EF1152C3N | EP2SGX90EF1152C3ES |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-ball FC-FBGA | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 |
| Speed Grade | -5 | -5 | -5 | -4 (slower Fmax) | -4 (slower Fmax) | -3 (slowest Fmax) | -3 (slowest Fmax) |
| Total RAM Bits | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 |
| User I/Os | 558 | 558 | 558 | 558 | 558 | 558 | 558 |
| Transceiver Data Rate | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps |
| RoHS Status | Compliant | Non-RoHS (standard leaded) | Compliant (ES variant) | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Same die and package, identical Fmax (vs EP2SGX90EF1152C5)
- Faster speed grade for timing-critical designs (vs EP2SGX90EF1152C4N)
- Maximum Fmax in the 1152-ball family (vs EP2SGX90EF1152C3N)
Design Notes
The 1152-ball FC-FBGA package requires a high-density PCB with micro-via (laser-drilled) stack-ups. Per the Stratix II GX Device Handbook, use at least an 8-layer board with dedicated ground and power planes beneath the BGA. Match the transceiver channel lengths within 150 mils of the partner differential pair, and place AC-coupling capacitors as close to the transmit pins as possible. Series-damping resistors may be required for backplane interfaces exceeding 20 inches of FR-4 trace.
Power-on sequencing is mandatory for the EP2SGX90EF1152C5N. The 1.2 V core rail must come up before or simultaneously with the I/O and auxiliary rails; otherwise, the device can experience high inrush current and potential latch-up. Per the Stratix II GX Device Handbook, use a sequencer IC (e.g., LM3880, UCD90120A) to enforce VCC_CORE < VCCIO, and decouple each rail with 0.1 uF + 10 uF + 100 uF capacitors placed within 100 mils of the respective BGA balls. Estimated: total power consumption at full transceiver utilization can reach 15-20 W, requiring active thermal management.
The EP2SGX90EF1152C5N is in NRND status; designs targeting long production lifecycles should plan for last-time-buy or migration to a newer family such as Cyclone IV GX or Stratix IV GX. Configuration mode (AS, PS, JTAG, or Fast Passive Parallel) must be set via MSEL pins at power-up; incorrect settings can leave the device unconfigured. Also, observe the I/O bank voltage constraints: mixing 2.5 V and 3.3 V LVCMOS in adjacent banks requires the VREF pins to be properly decoupled to avoid jitter and signal-integrity issues.
Compliance Information
RoHS compliant per Altera/Intel product documentation (N suffix indicates Pb-free). REACH and conflict-minerals declarations should be confirmed against the latest Intel product compliance documents.
