EP4CE55F23I7 - 55,856-Cell FPGA | Intel | Industrial Control
MPN: EP4CE55F23I7 ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP4CE55F23I7 Overview
A field-programmable gate array is a semiconductor device containing programmable logic blocks, routing resources, and configurable I/O. Engineers configure the FPGA after board assembly to implement digital functions without manufacturing a custom ASIC. Within the semiconductor hierarchy, an FPGA belongs to programmable logic and is used where parallel processing, fast development, field updates, or interface flexibility justify its configuration complexity.
The headline density is 55,856 cells, with 3,491 configurable logic blocks and 324 I/O pins. The product listings also identify 2,396,160 embedded memory bits and a 472.5 MHz frequency. These figures place the device in a useful middle-density class for control planes, communication interfaces, test equipment, image processing, and custom accelerators. The high pin count supports multiple parallel external interfaces within one package.
The part is associated with a 60 nm Cyclone IV E architecture according to the provided comparison result for another Cyclone IV E device. The I7 ordering suffix in the verified MPN denotes the identified industrial-grade ordering variant, but exact electrical limits should be confirmed from the manufacturer ordering information. The 484-BGA package is a surface-mount package family with a dense area-array interconnect and a 1 mm pitch.
Typical applications include industrial automation, motor-control coordination, communication infrastructure, test and measurement, video and imaging, and embedded control. In these systems, the FPGA can consolidate deterministic control logic, timing, protocol handling, and data processing. The 324 I/O count is especially useful when the design must connect several sensors, converters, memory devices, or communications ports.
Designers should allocate power, decoupling, clock distribution, configuration storage, and signal-integrity resources before routing. BGA assembly requires controlled fabrication, and every high-speed interface must be evaluated for impedance, crosstalk, and return-path continuity. Designers should also verify the exact supported transceiver, memory-interface, voltage, temperature, and speed-grade limits in the manufacturer documentation rather than infer them from family-level descriptions.
This page combines the exact distributor and manufacturer values supplied for EP4CE55F23I7 with structured package mapping, practical integration guidance, and comparison data. Where the supplied sources do not establish a specification, the result is explicitly marked rather than estimated.
Drop-in alternatives for EP4CE55F23I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE55F23I7 (same form factor and footprint) — differing in Package, Speed Grade, Embedded 18x18 Multipliers, Temperature Grade, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE55F23C7
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →EP4CE55F23C8
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP4CE55F23C8N
✅ Drop-In✓ In Stock
$74 / Unit
View Datasheet →EP4CE55F23C9LN
✅ Drop-In✓ In Stock
$110.45 / Unit
View Datasheet →EP4CE55F23I7N
✅ Drop-In✓ In Stock
$119.6 / Unit
View Datasheet →EP4CE55F23I7 Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Product Family | Cyclone IV E |
| Logic Cell Count | 55,856 cells |
| Configurable Logic Blocks | 3,491 CLBs |
| Programmable I/O Count | 324 I/O |
| Embedded Memory | 2,396,160 bits |
| Frequency | 472.5 MHz |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Package | 484-BGA |
| Package Description | FBGA-484 |
| Package Dimensions | 23 mm x 23 mm |
| Ball Pitch | 1 mm |
| Mounting Type | Surface Mount |
| Temperature Grade | Industrial |
EP4CE55F23I7 23 mm x 23 mm Pin Configuration Guide
Pin configuration for EP4CE55F23I7 (23 mm x 23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE55F23I7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE55F23I7 is suitable for 6 applications: Industrial Automation Controllers, Motor-Control Coordination, Communication Interface Aggregation, Test and Measurement Equipment, Video and Imaging Pipelines, Embedded Control and Data Processing.
Industrial Automation Controllers
EP4CE55F23I7 fits industrial automation controllers that need configurable logic for machine sequencing, sensor aggregation, protocol conversion, and deterministic timing. Its 55,856 cells and 3,491 configurable logic blocks provide enough density for multiple control tasks while its 324 programmable I/O pins can connect encoders, analog-to-digital converters, actuators, and local buses. The listed 472.5 MHz frequency supports time-critical digital functions, but designers must confirm the actual timing margin after synthesis. Use Intel configuration storage, bank-specific I/O standards, and a robust power-up sequence. Verify the I7 ordering grade and environmental limits before field deployment.
Recommended
Motor-Control Coordination
EP4CE55F23I7 can coordinate motor-control functions such as PWM generation, encoder capture, position processing, safety interlocks, and communications. The 3,491 configurable logic blocks allow deterministic hardware implementations alongside software control loops, while 324 I/O pins support multiple encoders, resolver interfaces, gate-driver controls, and status signals. The listed 472.5 MHz frequency is useful for high-resolution timing, although closed-loop performance depends on the selected clock, logic utilization, and timing constraints. Designers should partition critical control paths carefully and isolate noisy motor-power grounds. Confirm PWM, I/O voltage, thermal, and industrial-grade requirements in Intel documentation.
Recommended
Communication Interface Aggregation
EP4CE55F23I7 is suitable for communication equipment that must combine several protocols, buffer data, perform framing, and bridge different clock domains. Its 324 I/O pins help expose parallel interfaces to serializers, network controllers, memory devices, and service processors. The 2,396,160 embedded memory bits provide useful local buffering, while 55,856 cells allow protocol state machines and packet processing to be implemented in parallel. The 484-BGA package supports dense interconnect but makes controlled-impedance routing essential. Confirm supported I/O standards, transceiver resources, clock networks, and board signal integrity; these exact interface limits are not stated in the supplied results.
Recommended
Test and Measurement Equipment
EP4CE55F23I7 fits test and measurement systems that require simultaneous acquisition control, trigger generation, data formatting, and communications. Its 55,856 cells support complex timing and signal-processing state machines, and 324 programmable I/O pins can interface with converters, instruments, memory, and control panels. The listed 472.5 MHz frequency supports demanding digital functions, but measurement accuracy still depends on clock jitter, board layout, reference design, and implemented firmware. The 23 mm by 23 mm, 1 mm-pitch 484-BGA package needs careful escape and thermal planning. Use deterministic constraints and validate every I/O bank and termination scheme against the actual measurement chain.
Recommended
Video and Imaging Pipelines
EP4CE55F23I7 can process image data in applications that need hardware parallelism, frame buffering, timing generation, and multiple camera or display interfaces. The 3,491 configurable logic blocks support parallel pixel pipelines, while 2,396,160 embedded memory bits can hold line buffers, lookup tables, and synchronization data. Its 324 programmable I/O pins help connect image sensors, serializers, frame memory, and control devices. The listed 472.5 MHz frequency provides a useful device-level reference, not a guaranteed video throughput; achievable resolution and frame rate depend on resource utilization, memory bandwidth, and board constraints. Verify I/O standard support, clock rates, and signal integrity before selecting the FPGA configuration.
Recommended
Embedded Control and Data Processing
EP4CE55F23I7 is appropriate for embedded systems that combine custom control, real-time preprocessing, memory interfacing, and multiple peripheral connections. The 55,856-cell device can replace several fixed-function devices with one programmable platform, while 324 I/O pins support sensor buses, local memory, converters, and communications. Its 2,396,160 embedded memory bits help with buffering and state storage, and the listed 472.5 MHz frequency supports high-speed logic when timing is closed. Designers should plan configuration memory, boot behavior, clock domains, and debug access before layout. The 484-BGA package also requires careful decoupling, plane continuity, thermal analysis, and assembly-process control.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE55F23I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE55F23C7 | EP4CE55F23C8 | EP4CE55F23C8N | EP4CE55F23C9LN | EP4CE55F23I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BGA; 23 mm x 23 mm; 1 mm pitch | 484-BGA; same package class | 484-BGA; same package class | 484-BGA; same package class | 484-BGA; same package class | 484-BGA; same package class |
| Process Technology | 60 nm | 60 nm (family comparison) | 60 nm (family comparison) | 60 nm (family comparison) | 60 nm (family comparison) | 60 nm (family comparison) |
Key Differentiators
- High verified logic density (vs EP4CE40F23I7)
- Large programmable I/O resource (vs EP4CE40F23I7)
- Embedded memory for buffering (vs EP4CE30F29I7N)
- Package and ordering traceability (vs EP4CE55F23C7)
Design Notes
EP4CE55F23I7 is listed with a 1.2 V core voltage, but that value is not a substitute for a complete power design. Verify every required rail, tolerance, sequencing requirement, current limit, and power-up behavior in the current Intel datasheet and device-family documentation. Place local bulk and high-frequency decoupling close to the relevant power balls, maintain continuous reference planes, and use independent analysis for simultaneous I/O switching. Estimated rail current and power cannot be calculated reliably from the supplied values.
The 484-BGA package measures 23 mm by 23 mm with 1 mm pitch, so escape routing should begin with the official Intel land pattern and ball map. Use the manufacturer-recommended via and trace geometry, preserve a continuous ground or power-reference return, and reserve escape channels before assigning outer BGA rows. Avoid routing high-speed signals through multiple uncontrolled vias. Because a verified pinout was not supplied, do not infer any BGA ball assignment from package-family illustrations or from a nearby ordering code.
Treat the 324 programmable I/O pins as a banked system rather than as 324 identical connections. Confirm supported voltage standards, direction, termination, drive strength, clocking resources, and bank restrictions for each assigned signal from Intel documentation. The 472.5 MHz listed frequency is a device-level reference, not a guarantee for every implemented path. Constrain clocks, use controlled impedance, minimize via transitions, analyze crosstalk and return paths, and verify timing after place-and-route. For external memory or converters, include setup, hold, skew, and jitter in the system budget.
FPGA junction temperature depends on the design's logic utilization, clock rates, toggle patterns, I/O loading, voltage rails, airflow, and board construction. A safe thermal design should use the manufacturer's power-estimation and thermal guidance, then correlate the estimate with measured board temperatures in the final enclosure. Keep thermal vias and copper spreading under the permitted package area, maintain airflow around high-power sections, and define a shutdown or derating policy for fault conditions. The supplied data does not provide a thermal resistance or maximum junction temperature, so no such value is invented.
Common implementation errors include assuming that a similar suffix is electrically identical, using a family-level block diagram as a pinout, omitting configuration-storage requirements, mixing I/O standards across incompatible banks, and releasing a BGA board before checking the land pattern. Keep the exact EP4CE55F23I7 ordering code in the BOM, qualification records, and design files. Confirm configuration interface, clock startup, supported peripherals, environmental grade, and lifecycle status. When considering EP4CE55F23C7, C8, C9, or I7N candidates, validate the complete ordering table and run equivalence checks rather than relying on package similarity alone.
Compliance Information
The supplied results do not provide verified RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 statements for EP4CE55F23I7. Obtain the current Intel material declaration and qualification documentation for the exact MPN.
