Intel

EP4CGX75DF27C8 - Cyclone IV GX FPGA 75K LE 672-FBGA | Intel

MPN: EP4CGX75DF27C8 ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 672-FBGA (F27) Package 3.125 Gbps Speed 4,257,792 Memory
From $142.8 USD / Unit
MOQ: 1 |
Price updated: 2026-09-10
Volume Pricing
Qty Unit Price Extended
1 $210.48 $210.48
10 $198.95 $1,989.50
100 $175.2 $17,520.00
500 $158.4 $79,200.00
1,000 $142.8 $142,800.00
ℹ️ All prices are in USD

EP4CGX75DF27C8 Overview

The Intel (formerly Altera) EP4CGX75DF27C8 is a Cyclone IV GX field-programmable gate array (FPGA) with 73,920 logic elements, 4,257,792 bits of embedded memory, and 310 user I/O pins, housed in a 672-ball fine-pitch BGA package. Built on a 60 nm low-power process, the device integrates up to eight integrated 3.125 Gbps transceivers for high-speed serial I/O, making it a high-value FPGA for cost-sensitive serial connectivity.

A Cyclone IV GX FPGA is a low-power, high-volume programmable logic device optimized for applications that require both parallel logic and multi-gigabit transceivers. The Cyclone IV GX family sits within the broader FPGA (Field Programmable Gate Array) -> programmable logic -> integrated circuit -> semiconductor taxonomy, and is differentiated from the non-transceiver Cyclone IV E family by its integrated multi-gigabit transceivers (MGTs).

Key features include 73,920 logic elements, 4,257,792 embedded memory bits, 274 embedded 18x18 multipliers, 310 user I/O pins, eight integrated 3.125 Gbps transceivers, and a 1.2 V core supply. The device supports DDR/DDR2/QDRII+ external memory interfaces and offers up to 4 PLLs. Operating junction temperature range is 0C to +85C (commercial grade, "C8" speed grade).

The Cyclone IV GX architecture combines a logic fabric of LABs (Logic Array Blocks) and MLABs (Memory Logic Array Blocks) with high-speed transceiver blocks, hard PCI Express Gen1 IP blocks, and a rich DSP block population. The 60 nm process delivers low static and dynamic power, while the integrated transceivers remove the need for external PHY chips in many serial protocols.

Typical applications include industrial video broadcast equipment, video surveillance and machine vision, industrial protocol bridging (PROFIBUS, PROFIBUS, EtherCAT), software-defined radio, low-cost ASIC prototyping, and embedded industrial control. The wide temperature-grade options and integrated transceivers make it well-suited for both commercial and industrial designs.

When designing with the EP4CGX75DF27C8, ensure proper decoupling (100 uF + 1 uF + 0.1 uF per the Cyclone IV pin connection guidelines) and follow the recommended PCB stackup for BGA fan-out. The integrated transceivers require careful PCB layout; reference the Cyclone IV GX Transceiver User Guide for channel loss budgeting and AC-coupling capacitor placement.

This page synthesizes distributor pricing, parametric alternatives, and practical PCB design notes not found in the manufacturer datasheet, giving engineers a single reference for component selection and supply-chain decisions.

Drop-in alternatives for EP4CGX75DF27C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CGX75DF27C8 (same form factor and footprint) — differing in Package, Process Technology, Number of Transceivers, Speed Grade, Mounting Type.

Intel
Package: 672-ball FBGA
Process Technology: 60 nm CMOS
Speed Grade: 6
Compare with EP4CGX75DF27C8 →
Intel
Package: 672-ball FineLine BGA (FBGA)
Process Technology: 60 nm low power
Number of Transceivers: 4 (up to 3.125 Gbps)
Compare with EP4CGX75DF27C8 →
Intel
Package: 672-ball FBGA
Compare with EP4CGX75DF27C8 →
Intel
Package: 672-FBGA (27 x 27 mm, 1.0 mm pitch)
Process Technology: 60 nm low-power
Number of Transceivers: Up to 8 (3.125 Gbps)
Compare with EP4CGX75DF27C8 →
Intel
Package: 672-ball FBGA (F27)
Process Technology: 60 nm low-power CMOS
Compare with EP4CGX75DF27C8 →
Intel
Package: FBGA-672 (FineLine BGA)
Compare with EP4CGX75DF27C8 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP4CGX75DF27C7N

✅ Drop-In
Intel
📦 672-FBGA (F27)
Cyclone IV GX · Cyclone IV · 73,920 · 4620 CLBs / 47 logic blocks (reported) · 4,257,792 bits · 310 · 1.2 V (core) · Up to 8 (3.125 Gbps)

✓ In Stock

$96.4 / Unit

View Datasheet →

EP4CGX75DF27C7

✅ Drop-In
Intel
📦 672-FBGA (F27)
Field Programmable Gate Array (FPGA) · Cyclone IV GX · 73,920 · 4,620 · 310 · 4,257,792 · 1.2 V · 672-ball FBGA

✓ In Stock

$86.8 / Unit

View Datasheet →

EP4CGX75DF27C6N

✅ Drop-In
Intel
📦 672-FBGA (F27)
Cyclone IV GX · 73,920 · 4,630 · 4,257,792 · 310 · 310 (FBGA-672) · 60 nm low power · 1.2 V

✓ In Stock

$88.9 / Unit

View Datasheet →

EP4CGX75DF27C6

✅ Drop-In
Intel
📦 672-FBGA (F27)
Cyclone IV GX · 73,920 · 4,257,792 · 310 · 60 nm CMOS · 1.2 V · 672-ball FBGA · F27 (672-FBGA)

✓ In Stock

$109.2 / Unit

View Datasheet →
ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

EP4CGX75DF27C8 Maximum Ratings & Electrical Characteristics

Series Cyclone IV GX
Logic Elements 73,920
Embedded Memory Bits 4,257,792
User I/O Pins 310
Embedded 18x18 Multipliers 274
Number of LABs/CLBs 4630
Total RAM Bits 4,257,792
Number of Transceivers 8
Transceiver Speed 3.125 Gbps
Number of PLLs 4
Core Supply Voltage 1.2 V
Operating Temperature 0C to +85C (Commercial)
Speed Grade 8
Package 672-FBGA (F27)
Process Technology 60 nm
Mounting Type Surface Mount
RoHS Status Compliant

EP4CGX75DF27C8 672-fbga (f27) Pin Configuration Guide

Pin configuration for EP4CGX75DF27C8 (672-fbga (f27) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

672-fbga (f27) package pinout diagram for EP4CGX75DF27C8

No detailed pinout data available for EP4CGX75DF27C8.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CGX75DF27C8 is suitable for 6 applications: Industrial Video Broadcast, Machine Vision Systems, Industrial Protocol Bridging, Software-Defined Radio Front-End, Low-Cost ASIC Prototyping, Surveillance and Security DVR.

📺

Industrial Video Broadcast

The EP4CGX75DF27C8 fits industrial video broadcast by combining 73,920 logic elements with eight 3.125 Gbps transceivers that handle SDI/HDMI-over-serial links. The 4,257,792 embedded memory bits buffer video frames while 274 18x18 multipliers support real-time scaling and color-space conversion. Commercial 0-85C operation suits controlled-environment broadcast studios. Designers use the FPGA's hard PCIe Gen1 block to interface with host PCs for ingest cards, while LVDS pairs feed parallel camera/HDMI bridges.

🎥

Machine Vision Systems

The EP4CGX75DF27C8 serves machine vision pipelines where its 274 18x18 multipliers accelerate Sobel, Gaussian, and convolution kernels for edge detection. The 73,920 logic elements implement Camera Link HS deserialization, while 4 Mbits of embedded memory line-buffer image rows. The eight transceivers support CoaXPress or GigE Vision uplinks. Commercial temperature range suits factory-floor vision cells; the 672-FBGA's high pin count connects parallel image sensors at full MIPI-CSI bandwidth.

🏭

Industrial Protocol Bridging

The EP4CGX75DF27C8 is well-suited for industrial protocol bridging between EtherCAT, PROFINET, PROFIBUS, and EtherNet/IP masters and slaves. The eight integrated transceivers provide the PHY connectivity for the master Ethernet link, while 73,920 logic elements implement the deterministic slave state machines. The 310 user I/O pins drive isolated RS-485 and SPI links to legacy fieldbus peripherals. Industrial OEMs choose this FPGA when standard silicon ASSPs lack a required combination of protocol stacks.

🌐

Software-Defined Radio Front-End

The EP4CGX75DF27C8 supports SDR front-end designs where 3.125 Gbps transceivers digitize IF or directly sample RF front-ends, while 274 18x18 multipliers implement digital down/up-conversion and pulse-shaping FIRs. The 4 Mbits of embedded memory hold channelization coefficients, and the 73,920 logic elements implement the modem baseband. The hard PCIe Gen1 block streams I/Q data to a host x86 processor, making the FPGA ideal for laboratory and signal-intelligence prototypes.

🔧

Low-Cost ASIC Prototyping

The EP4CGX75DF27C8 functions as a low-cost ASIC prototype platform for designs that target ~70K ASIC gates. The 73,920 logic elements plus 274 multipliers map RTL blocks 1:1 onto FPGA fabric, while eight transceivers and the hard PCIe block replicate the real SoC's IO perimeter. Engineers reuse the same Quartus project for both FPGA prototype and ASIC synthesis baselines, dramatically reducing pre-silicon verification cycles for cost-sensitive consumer and IoT ASICs.

🎥

Surveillance and Security DVR

The EP4CGX75DF27C8 enables multi-channel surveillance DVR designs where 73,920 logic elements implement H.264/H.265 encode assist and 4 Mbits of embedded memory hold reference frames. Eight transceivers aggregate IP-camera streams over Gigabit Ethernet, while 310 user I/O pins drive SATA links to local storage arrays. Commercial 0-85C operation suits indoor NVR enclosures. The Cyclone IV GX's low static power keeps thermals manageable in fanless designs.

What is the EP4CGX75DF27C8?
The EP4CGX75DF27C8 is an Intel (formerly Altera) Cyclone IV GX field-programmable gate array (FPGA) with 73,920 logic elements and eight integrated 3.125 Gbps transceivers, in a 672-ball FBGA package. According to the Altera product page, it is built on a 60 nm low-power process and is targeted at cost-sensitive designs that require high-speed serial I/O, such as industrial video and protocol bridging.
How much logic and memory does the EP4CGX75DF27C8 have?
The EP4CGX75DF27C8 contains 73,920 logic elements, 4,630 LABs/CLBs, 4,257,792 embedded memory bits, and 274 embedded 18x18 multipliers. These figures come from the verified distributor listings; the Cyclone IV GX EP4CGX75 datasheet defines the same totals for the F27-package device family.
What is the package and pin count of the EP4CGX75DF27C8?
The EP4CGX75DF27C8 ships in a 672-ball fine-pitch BGA (FBGA-672, package code F27). The package supports 310 user I/O pins and the integrated transceiver balls, making it a high-density SMD solution that requires a standard BGA fan-out PCB stackup.
Where can I download the EP4CGX75DF27C8 datasheet PDF?
The official Cyclone IV GX device datasheet (covering the EP4CGX75 family) is available on the Altera/Intel website at the product detail page referenced in the data sources of this listing. It contains DC and switching characteristics, pin-out, package information, and ordering-code definitions for all Cyclone IV GX variants.
What is the price of the EP4CGX75DF27C8?
As of 2026-09-10, the EP4CGX75DF27C8 lists at approximately $210.48 for qty 1, $198.95 for qty 10, $175.20 for qty 100, $158.40 for qty 500, and $142.80 for qty 1000, based on verified distributor pricing. Volume pricing on DigiKey and Mouser typically improves at higher quantities; the Heisener listing also reports ~4,848 units in stock.
Is the EP4CGX75DF27C8 in stock and what is the lead time?
The Heisener distributor listing reports 4,848 units in stock with a quoted delivery window of May 19-May 24 (expedited shipping). DigiKey and Mouser also list inventory in their FPGA categories for this MPN. Lead times fluctuate with demand; check the live distributor pages for the most current stock state.
Where can I buy the EP4CGX75DF27C8 online?
The EP4CGX75DF27C8 is available through authorized distributors including DigiKey, Mouser, Heisener, Lisleapex, and Xecor. Stock and pricing are listed in the data sources of this page; the Intel/Altera product page is the authoritative source for the latest part-number lifecycle status.
What is the difference between EP4CGX75DF27C8 and EP4CGX75DF27C7?
The EP4CGX75DF27C8 has a speed grade of 8 (slower Fmax), while the EP4CGX75DF27C7 has speed grade 7 (faster Fmax). Both share the same Cyclone IV GX EP4CGX75 die and the same 672-FBGA F27 package, so they are pin-compatible drop-in alternatives; choose C8 for cost-sensitive designs and C7 when higher logic performance is required.
Can the EP4CGX75DF27C6 replace EP4CGX75DF27C8?
Yes - the EP4CGX75DF27C6 is the fastest speed-grade (6) variant of the same EP4CGX75 die in the F27 672-FBGA package. It is a fully pin-compatible drop-in replacement offering higher Fmax performance at typically higher cost. Use C6 when design timing closure is critical, otherwise C8 (this part) is the more cost-effective choice.
How many transceivers does the EP4CGX75DF27C8 have and what speed?
The EP4CGX75DF27C8 integrates eight multi-gigabit transceivers rated up to 3.125 Gbps, sufficient for PCIe Gen1, Gigabit Ethernet, CPRI, and Serial RapidIO links. The Cyclone IV GX Transceiver User Guide details the supported protocols, channel-loss budgets, and AC-coupling capacitor placement.
What is the operating temperature range of the EP4CGX75DF27C8?
The "C" in the part suffix indicates the commercial 0C to +85C junction temperature range. For industrial (-40C to +100C) operation, choose the equivalent "I" speed-grade variant such as the EP4CGX75DF27I7N. Both share the same F27 672-FBGA footprint.
Is the EP4CGX75DF27C8 RoHS compliant?
Yes. The EP4CGX75DF27C8 is RoHS compliant per the Altera/Intel product page. Lead-free reflow profiles per JEDEC J-STD-020 should be used during PCB assembly. The part is supplied in lead-free, halogen-free packaging consistent with current Intel FPGA environmental compliance.
What are the typical applications of the EP4CGX75DF27C8?
Typical applications include industrial video broadcast, machine vision, video surveillance, protocol bridging (EtherCAT, PROFINET), low-cost ASIC prototyping, and software-defined radio. The integrated 3.125 Gbps transceivers make it especially suitable for designs that need both parallel logic and high-speed serial I/O without an external PHY.
Hey Google, what is a drop-in replacement for the EP4CGX75DF27C8?
A drop-in replacement for the EP4CGX75DF27C8 is any other speed-grade variant of the EP4CGX75 die in the same F27 672-FBGA package. The EP4CGX75DF27C7N, EP4CGX75DF27C7, EP4CGX75DF27C6N, and EP4CGX75DF27C6 are all pin-compatible and share the same footprint, allowing PCB reuse with only a Quartus device-select change.
What key specifications of the EP4CGX75DF27C8 should engineers know?
Engineers should know: 73,920 logic elements, 4,257,792 embedded memory bits, 310 user I/O pins, eight integrated 3.125 Gbps transceivers, 274 18x18 multipliers, 1.2 V core supply, commercial 0C to +85C temperature range, speed grade 8, and the 672-ball FBGA F27 package. The Cyclone IV GX family datasheet defines the full DC/AC characteristics.

Engineering reference data for EP4CGX75DF27C8 — comparison, design guidance, and compliance information.

Selection Guide

Choose EP4CGX75DF27C8 when you need a Cyclone IV GX FPGA in the F27 672-FBGA package with commercial temperature range and you do not need maximum Fmax - this is the cost-optimized speed-grade for industrial designs that meet timing at grade 8. Choose EP4CGX75DF27C7 or C6 if timing closure at -C8 fails (10-15% Fmax gain per grade step). Choose the EP4CGX75DF27I7N industrial-temperature variant if your design operates below 0C or above +85C. Choose EP4CGX75CF23C8 if you can move to the smaller 484-FBGA F23 package and save PCB area, but verify the new pinout - it is NOT pin-compatible with F27. For higher logic density, migrate to the EP4CGX110 or EP4CGX150 family, accepting that these require different PCB footprints.

Comparison with Alternatives

Parameter This Product EP4CGX75DF27C7N EP4CGX75DF27C7 EP4CGX75DF27C6N EP4CGX75DF27C6 EP4CGX75CF23C8
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 672-FBGA (F27) 672-FBGA (F27) - same 672-FBGA (F27) - same 672-FBGA (F27) - same 672-FBGA (F27) - same 484-FBGA (F23) - different
Speed Grade 8 7 (faster) 7 (faster) 6 (fastest) 6 (fastest) 8 (same)
Logic Elements 73,920 73,920 (same die) 73,920 (same die) 73,920 (same die) 73,920 (same die) 73,920 (same die)
Embedded Memory Bits 4,257,792 4,257,792 4,257,792 4,257,792 4,257,792 4,257,792
Transceivers 8 x 3.125 Gbps 8 x 3.125 Gbps 8 x 3.125 Gbps 8 x 3.125 Gbps 8 x 3.125 Gbps 8 x 3.125 Gbps
Core Voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Temperature Grade Commercial (0 to +85C) Commercial (0 to +85C) Commercial (0 to +85C) Commercial (0 to +85C) Commercial (0 to +85C) Commercial (0 to +85C)

Key Differentiators

  • Speed grade 8 offers best cost-vs-performance for non-timing-critical industrial designs (vs EP4CGX75DF27C6)
  • F27 672-FBGA gives 310 user I/Os vs the 484-FBGA F23's lower I/O count (vs EP4CGX75CF23C8)
  • Same-die compatibility across all four F27 speed grades preserves Quartus project reuse (vs EP4CGX110DF27C8 (higher density))

Design Notes

The Cyclone IV GX EP4CGX75 requires a 1.2 V core supply and dedicated 2.5 V/1.2 V/3.0 V PLL/transceiver auxiliary rails. Follow the Cyclone IV Pin Connection Guidelines for the recommended decoupling network: place 100 µF bulk + 1 µF + 0.1 µF ceramic capacitors near each supply pin, and provide a separate ferrite-isolated island for the transceiver (VCCH_GXB) supply. Designers must power-up VCCINT before VCCAUX to avoid latch-up.

The 672-FBGA package requires a controlled-impedance PCB stackup with matched 50 ohm single-ended and 100 ohm differential traces for transceiver channels. Use a microstrip or stripline layout with the reference plane one dielectric thickness below the top layer, and route high-speed differential pairs length-matched to within 5 mils. BGA fan-out should use a 4- or 6-layer stackup with via-in-pad recommended for the inner rows.

Estimated: based on eight 3.125 Gbps channels, each transceiver requires AC-coupling capacitors (typically 100 nF 0402 size) on the TX and RX serial data pairs. Place these caps within 200 mils of the FPGA ball, with ground vias stitching the return path adjacent to each AC cap. Route each differential pair on the top layer with continuous ground reference, avoiding signal splits across plane voids.

Do not populate the EP4CGX75CF23C8 package on a board laid out for the EP4CGX75DF27C8 - the F23 484-FBGA and F27 672-FBGA pinouts are NOT identical. Also note that only 6 of the 8 PLLs in this device are usable for general clocking; some are reserved for transceiver reference clocks. Always re-run Quartus fitter pin assignments when changing speed grades (C6 vs C7 vs C8) since I/O timing differs.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS compliant per Altera/Intel product page. AEC-Q100 not applicable - FPGAs are not qualified for automotive safety-critical use unless explicitly designated. Lead-free reflow per JEDEC J-STD-020 required.

Data verified on: 2026-09-10 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP4CGX75DF27C8 Cyclone IV GX FPGA Field Programmable Gate Array 672-FBGA BGA 3.125 Gbps transceiver multi-gigabit transceiver 1.2 V core voltage PCI Express Gen1 Quartus RoHS JEDEC J-STD-020 73,920 logic elements 4,257,792 embedded memory bits 310 user I/O pins 274 18x18 multipliers 60 nm process EtherCAT PROFINET machine vision industrial broadcast
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