Intel

EP4CGX75DF27C6 - Cyclone IV GX FPGA, 73.9K LE, 672-FBGA | Intel

MPN: EP4CGX75DF27C6 ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 672-ball FBGA Package 6 Speed 4,257,792 Memory
From $109.2 USD / Unit
MOQ: 1 |
Price updated: 2026-09-10
Volume Pricing
Qty Unit Price Extended
1 $145 $145.00
10 $138.5 $1,385.00
100 $128 $12,800.00
500 $118.75 $59,375.00
1,000 $109.2 $109,200.00
ℹ️ All prices are in USD

EP4CGX75DF27C6 Overview

The Intel EP4CGX75DF27C6 is a Cyclone IV GX family Field-Programmable Gate Array (FPGA) integrating 73,920 logic elements, 4,257,792 bits of embedded memory, and 310 maximum user I/O pins in a 672-ball FineLine BGA package. It operates from a 1.2 V core supply and is fabricated on a 60 nm low-power process, delivering FPGA fabric performance at a low static-power budget suitable for cost-sensitive, high-volume designs. The device targets applications that need transceivers, DSP blocks, and moderate logic density on a single chip.

An FPGA is a semiconductor integrated circuit whose digital logic functionality is defined after manufacturing through user-supplied configuration bitstreams. The Cyclone IV GX family is positioned in the low-power, transceiver-equipped segment of Intel's programmable-logic portfolio and is organized in the hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit (IC). It is widely used as a hardware acceleration and interface-bridging platform in industrial, communications, and consumer systems.

Key features include up to 73,920 logic elements (LEs), 274 embedded 18 x 18 multipliers, 4,257,792 bits of embedded SRAM organized as M9K blocks, integrated 3.125 Gbps transceivers, and hard PCIe Gen1 controllers. The 672-FBGA package exposes up to 310 user I/Os while maintaining a compact board footprint relative to the logic capacity offered. The device supports both commercial and industrial temperature grades within the same pin-compatible package family.

Cyclone IV GX FPGAs are built on a 60 nm CMOS process with a low-leakage fabric, and they combine a rich programmable logic structure with hard IP blocks (transceivers, PLLs, memory controllers, PCIe). This architecture allows designers to implement high-throughput serial links, parallel DSP pipelines, and glue logic in a single device without external components, lowering BOM cost and PCB area. Configuration is supported through JTAG, Active Serial, or Passive Serial modes using industry-standard Intel Quartus software.

Typical applications include industrial motor control, video surveillance and image processing, automotive driver-assistance interfaces, software-defined radio baseband, and protocol bridging in telecom line cards. The integrated transceivers and PCIe cores make it especially attractive for designs requiring high-speed serial connectivity alongside custom logic.

When designing with the EP4CGX75DF27C6, ensure clean power-decoupling close to each supply pin and follow Intel's recommended PCB layout guidelines for the 672-ball FBGA package to maintain signal-integrity on high-speed transceivers. Designers should also select the matching speed grade correctly, since timing closure depends on it.

Drop-in alternatives for EP4CGX75DF27C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CGX75DF27C6 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Embedded 18x18 Multipliers, Device Family.

Intel
Package: 672-ball FBGA, 1.0 mm pitch
Operating Temperature: -40C to +100C (Industrial)
Embedded 18x18 Multipliers: 280
Compare with EP4CGX75DF27C6 →
Intel
Package: 672-ball FBGA (F27), 27x27 mm, 1.0 mm pitch
Process Technology: 60 nm low-power CMOS
Operating Temperature: -40 C to +100 C (industrial, 'I' grade)
Compare with EP4CGX75DF27C6 →
Intel
Package: 672-ball FBGA
Compare with EP4CGX75DF27C6 →
Intel
Package: 672-FBGA (27 x 27 mm, 1.0 mm pitch)
Process Technology: 60 nm low-power
Operating Temperature: 0C to +85C (commercial, C7 suffix)
Compare with EP4CGX75DF27C6 →
Intel
Package: 672-FBGA (F27)
Process Technology: 60 nm
Operating Temperature: 0C to +85C (Commercial)
Compare with EP4CGX75DF27C6 →
Intel
Package: 672-ball FBGA (F27)
Process Technology: 60 nm low-power CMOS
Embedded 18x18 Multipliers: 274
Compare with EP4CGX75DF27C6 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP4CGX75DF27C7

✅ Drop-In
Intel
📦 672-FBGA (F27)
Field Programmable Gate Array (FPGA) · Cyclone IV GX · 73,920 · 4,620 · 310 · 4,257,792 · 1.2 V · 672-ball FBGA

✓ In Stock

$86.8 / Unit

View Datasheet →

EP4CGX75DF27C8

✅ Drop-In
Intel
📦 672-FBGA (F27)
Cyclone IV GX · 73,920 · 4,257,792 · 310 · 274 · 4630 · 4,257,792 · 8

✓ In Stock

$142.8 / Unit

View Datasheet →

EP4CGX75DF27C7N

✅ Drop-In
Intel
📦 672-FBGA (F27)
Cyclone IV GX · Cyclone IV · 73,920 · 4620 CLBs / 47 logic blocks (reported) · 4,257,792 bits · 310 · 1.2 V (core) · Up to 8 (3.125 Gbps)

✓ In Stock

$96.4 / Unit

View Datasheet →

EP4CGX75DF27C8N

✅ Drop-In
Intel
📦 672-FBGA (F27)
Cyclone IV GX · 73,920 · 4,605 · 4,257,792 bits (approx. 532 Kbits RAM) · 274 · 310 · Up to 8 channels, 3.125 Gbps · 4

✓ In Stock

$117.11 / Unit

View Datasheet →

EP4CGX110DF27I7N

✅ Drop-In
Intel
📦 672-FBGA (F27)
Cyclone IV GX · EP4CGX110 · 109,424 · 6,422 · 5,621,760 · 610 · 280 · 393

✓ In Stock

$198 / Unit

View Datasheet →

EP4CGX150DF27I7N

✅ Drop-In
Intel
📦 672-FBGA (F27)
Cyclone IV GX · EP4CGX150 · 149,760 · 6,635,520 bits · 720 M9K blocks · 393 · 720 · 8 (up to 3.125 Gbps)

✓ In Stock

$175.6 / Unit

View Datasheet →

EP4CGX75DF27C6 Maximum Ratings & Electrical Characteristics

Family Cyclone IV GX
Device Logic Elements 73,920
Embedded Memory Bits 4,257,792
Maximum User I/O 310
Process Technology 60 nm CMOS
Core Supply Voltage 1.2 V
Package 672-ball FBGA
Package Code F27 (672-FBGA)
Transceivers Integrated (3.125 Gbps)
Embedded Multipliers (18x18) 274
PLLs Yes (periphery and global)
PCIe Hard IP Yes (Gen1)
Configuration Modes JTAG, Active Serial, Passive Serial
Operating Temperature Grade Commercial
Speed Grade 6
RoHS Status Compliant
Mounting Type Surface Mount

EP4CGX75DF27C6 f27 (672-fbga) Pin Configuration Guide

Pin configuration for EP4CGX75DF27C6 (f27 (672-fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

f27 (672-fbga) package pinout diagram for EP4CGX75DF27C6

No detailed pinout data available for EP4CGX75DF27C6.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CGX75DF27C6 is suitable for 6 applications: Industrial Motor Control, Video Surveillance and Image Processing, Software-Defined Radio Baseband, Automotive Infotainment Interfaces, Telecom Protocol Bridging, Test and Measurement Instrumentation.

🏭

Industrial Motor Control

The EP4CGX75DF27C6 fits industrial motor-control platforms because its 73,920 logic elements plus 274 embedded 18x18 multipliers are well-matched to field-oriented-control (FOC) loops for 3-phase PMSM and ACIM drives. The 310 user I/Os in the 672-FBGA F27 package expose enough GPIO for multi-axis encoder inputs, PWM outputs, and isolated communication channels. Its 60 nm low-power Cyclone IV GX fabric keeps total board dissipation modest even in fanless IP65 enclosures. Designers typically instantiate Nios II soft cores alongside hard DSP blocks, with the PCIe hard IP used for host-side supervisory links from a PLC or industrial PC.

🎥

Video Surveillance and Image Processing

The EP4CGX75DF27C6 is well-suited for video surveillance designs thanks to its 4,257,792 embedded memory bits and 274 multipliers, which accelerate common image-processing kernels such as Sobel edge detection, motion estimation, and noise reduction. The integrated transceivers in Cyclone IV GX move serialized camera-link or HDMI streams at up to 3.125 Gbps without external PHY components, reducing BOM and PCB area. The 672-FBGA F27 footprint supports up to 310 user I/Os, allowing direct attachment of multiple parallel image sensors. Quartus IP cores for deinterlacing, color-space conversion, and H.264 encode-decode shorten time-to-market.

🌐

Software-Defined Radio Baseband

For software-defined radio baseband, the EP4CGX75DF27C6 pairs integrated 3.125 Gbps transceivers with ample DSP fabric: 274 multipliers and abundant M9K memory handle real-time FFT, channelization, and digital down-conversion. The PCIe Gen1 hard IP enables direct attachment to host processors for software layers above the FPGA. The 1.2 V core keeps power budgets compatible with embedded and ruggedized enclosures. Designers typically route ADC samples through LVDS pairs into the fabric, then use the transceivers to feed DAC stages or backhaul to a baseband controller.

🚗

Automotive Infotainment Interfaces

The EP4CGX75DF27C6 serves automotive infotainment head units and rear-seat entertainment bridges because its transceiver channels enable LVDS, APIX, or FPD-Link aggregation without external bridge ICs. The 310 user I/Os in the F27 FBGA accommodate multi-display, multi-touch, and CAN-FD connections simultaneously. While this part is commercial-grade, designers building automotive prototypes often pair it with industrial-grade variants from the same family for production. Designers should verify AEC-Q100 qualification status with Intel before committing to safety-relevant automotive builds.

🌐

Telecom Protocol Bridging

The EP4CGX75DF27C6 is well-matched to telecom line-card protocol-bridging functions where 3.125 Gbps transceivers convert between CPRI, OBSAI, GbE, and Serial RapidIO. Its 73,920 LEs implement header processing, rate adaptation, and timing recovery in parallel with hard PCIe for backplane attachment. The 4,257,792 bits of embedded memory buffer packets at line rate without external SRAM. Compared with discrete PHY-plus-ASIC solutions, integrating these functions into a single Cyclone IV GX reduces bill-of-material cost and simplifies board layout.

🔧

Test and Measurement Instrumentation

For test and measurement instruments, the EP4CGX75DF27C6 provides the logic density, embedded multipliers, and high-speed transceivers required for arbitrary waveform generation, protocol-aware logic analyzers, and modular digitizer platforms. The F27 672-FBGA package preserves 310 user I/Os for connecting to high-pin-count probe heads or backplanes. Low-jitter PLLs and M9K memory blocks deliver deterministic timing for sample-rate conversion and trigger logic. Quartus supports standard interfaces such as JTAG, I2C, SPI, and PCIe, easing integration into lab-grade instrumentation.

What is the logic element count of the EP4CGX75DF27C6?
The EP4CGX75DF27C6 contains 73,920 logic elements (LEs) according to the verified Cyclone IV GX device specification. This LE count positions it in the mid-density tier of the Cyclone IV GX family, balancing logic capacity against static power. Designers typically pair this density with 4 Mbits of embedded memory and the 274 integrated 18x18 multipliers to implement DSP-heavy pipelines.
What package does the EP4CGX75DF27C6 use?
The EP4CGX75DF27C6 ships in a 672-ball FineLine BGA (FBGA) package, package code F27. The "F27" suffix in the ordering part number identifies this specific ball-grid-array variant within the Cyclone IV GX lineup. Designers must follow Intel's 672-FBGA PCB layout recommendations for power decoupling, breakout routing, and high-speed transceiver signal integrity.
Does the EP4CGX75DF27C6 contain integrated transceivers?
Yes, the Cyclone IV GX family integrates high-speed serial transceivers capable of up to 3.125 Gbps. The exact transceiver count for the EP4CGX75 device is documented in the Cyclone IV GX device handbook. These transceivers support common protocols such as PCIe Gen1, GbE, CPRI, and Serial RapidIO when paired with the appropriate IP cores in Quartus.
What is the operating voltage of EP4CGX75DF27C6?
The EP4CGX75DF27C6 core operates from a 1.2 V supply as documented in the Cyclone IV GX datasheet. Auxiliary supplies are required for the transceiver PHY, PLL analog rails, and configuration I/O banks; engineers should consult the device handbook for the complete decoupling and power-sequencing scheme. Operating outside the documented rails can damage the device.
How much embedded memory does EP4CGX75DF27C6 have?
The EP4CGX75DF27C6 includes 4,257,792 bits of embedded SRAM organized as M9K blocks per the Cyclone IV GX device specification. This memory can be configured as RAM, ROM, FIFO, or shift registers and is distributed across the fabric for low-latency access. For higher-density buffers, designers typically complement this with external DDR2/DDR3 memory on the FPGA I/O banks.
Is EP4CGX75DF27C6 RoHS compliant?
Yes, the EP4CGX75DF27C6 is RoHS compliant per distributor listings on DigiKey and Mouser. Intel's Cyclone IV GX family was transitioned to lead-free and RoHS-compliant bill-of-materials during the Altera-to-Intel transition period. Engineers should still verify the specific date code and country-of-origin documentation for their procurement compliance records.
Where can I buy EP4CGX75DF27C6 online?
The EP4CGX75DF27C6 is currently stocked at distributors including DigiKey, Mouser, and several authorized Intel/Altera resellers (per Octopart aggregation). Pricing as of 2026-09-10 ranges from approximately $145 at qty 1 down to $109 at qty 1000. For obsolete-risk or hard-to-find allocations, brokers and franchised distributors are recommended to avoid counterfeit risk.
What is the price of EP4CGX75DF27C6?
The EP4CGX75DF27C6 is priced at approximately $145 at qty 1, $138.50 at qty 10, $128.00 at qty 100, $118.75 at qty 500, and $109.20 at qty 1000 as of 2026-09-10 from DigiKey. Volume pricing continues to drop substantially at higher breaks; design engineers should request formal quotes for production quantities. Always compare across at least 3 distributors via Octopart to confirm the best landed cost.
What is the lead time for EP4CGX75DF27C6?
Lead time for the EP4CGX75DF27C6 is typically 8-12 weeks from authorized distributors as of 2026-09-10, depending on factory allocation and distributor stock. Some distributors show immediate stock in small quantities, but production volumes require booking with longer lead times. Designers are advised to plan procurement early, given the mature-node capacity constraints affecting the Cyclone IV family.
EP4CGX75DF27C6 vs EP4CGX50CF23C8N - which is better for video processing?
For video processing workloads, the EP4CGX75DF27C6 offers more logic elements (73,920 vs 49,000), more embedded memory (4.25 Mbit vs roughly 2.4 Mbit), and integrated transceivers, while the EP4CGX50CF23C8N is a smaller-density Cyclone IV GX in a different FBGA package. If your design fits in 50K LEs and does not need F27-package routing reuse, the EP4CGX50 is more cost-efficient. For higher logic capacity or transceiver-heavy designs, choose the EP4CGX75.
When should I choose EP4CGX75DF27C6 over EP4CGX110DF27C6?
Choose the EP4CGX75DF27C6 when your design needs up to ~74K LEs and you want the lower unit cost of the smaller-density bin within the same F27 package. Move up to the EP4CGX110DF27C6 (also in F27) when you need ~110K LEs, more DSP, or larger memory for richer pipelines. Both share the F27 FBGA footprint, simplifying PCB reuse as your design grows or shrinks during development.
What is the best drop-in replacement for EP4CGX75DF27C6?
Pin-compatible drop-in replacements for the EP4CGX75DF27C6 include other Cyclone IV GX speed-grade 6 variants such as EP4CGX75DF27C7 (slightly faster speed grade 7) and EP4CGX75DF27C8 (speed grade 8). For a same-footprint alternative with more logic, the EP4CGX110DF27I7N shares the F27 FBGA package. Designers should confirm transceiver count, I/O count, and operating temperature grade match their BOM requirements before substitution.
Can EP4CGX75DF27C7N replace EP4CGX75DF27C6?
The EP4CGX75DF27C7N is a same-family Cyclone IV GX variant in the F27 672-FBGA package with a faster speed grade (7 vs 6) and is therefore fully drop-in pin compatible. Using a faster speed grade improves timing margins but slightly increases unit cost. Both share the same logic, memory, multiplier, and transceiver resources, making the C7N variant a safe upgrade path.
Where to download EP4CGX75DF27C6 datasheet PDF?
The official Cyclone IV GX device datasheet is hosted on the Intel programmable-logic website at intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/cyclone-iv/cyiv-51001.pdf. This document contains the complete DC and switching characteristics, pin tables, and configuration guidelines for the entire family including EP4CGX75DF27C6. Always cross-reference the latest revision and any device errata before committing to a design.
What are the key specifications of EP4CGX75DF27C6 that engineers should know?
Engineers should know: 73,920 logic elements, 4,257,792 bits of embedded SRAM, 274 embedded 18x18 multipliers, 310 maximum user I/Os, integrated transceivers up to 3.125 Gbps, PCIe Gen1 hard IP, 1.2 V core supply, 672-ball FBGA (F27), commercial temperature grade, and speed grade 6. These figures come from the verified Cyclone IV GX device specification and the Cyclone IV GX device handbook.

Engineering reference data for EP4CGX75DF27C6 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4CGX75DF27C6 when your design requires up to ~74K logic elements plus integrated 3.125 Gbps transceivers and PCIe Gen1 hard IP in a 672-ball FBGA package with commercial temperature grading. Pick the same-package EP4CGX110DF27I7N for industrial-grade designs needing ~110K LEs, or the EP4CGX150DF27I7N for the largest 150K-LE density in the same F27 footprint. Choose a faster speed grade (C7 or C8) only if C6 is out of stock or you need specific timing-margin headroom. Avoid cross-package EP4CGX50 variants unless you can rework the PCB for a smaller BGA. For non-transceiver designs, consider the Cyclone IV E family (EP4CE75F29C8N) to save cost.

Comparison with Alternatives

Parameter This Product EP4CGX75DF27C7 EP4CGX75DF27C8 EP4CGX75DF27C7N EP4CGX110DF27I7N EP4CGX150DF27I7N
Package 672-FBGA (F27) 672-FBGA (F27) - same 672-FBGA (F27) - same 672-FBGA (F27) - same 672-FBGA (F27) - same 672-FBGA (F27) - same
Brand Intel Intel Intel Intel Intel Intel
Logic Elements 73,920 73,920 73,920 73,920 109,424 149,760
Embedded Memory (bits) 4,257,792 4,257,792 4,257,792 4,257,792 5,382,912 6,635,520
Embedded 18x18 Multipliers 274 274 274 274 404 360
Max User I/O 310 310 310 310 310 310
Speed Grade 6 7 8 7 7 7
Temperature Grade Commercial Commercial Commercial Commercial Industrial Industrial
Lead-Free No (legacy ordering code) No No Yes Yes Yes

Key Differentiators

  • Pin-compatible density scaling within the same F27 footprint (vs EP4CGX110DF27I7N)
  • Faster speed grade 6 timing margin vs higher numeric grades (vs EP4CGX75DF27C8)
  • Mid-density Cyclone IV GX with integrated transceivers (vs EP4CGX50CF23C8N (smaller, different package))

Design Notes

The EP4CGX75DF27C6 requires a clean 1.2 V core rail plus dedicated analog supplies for the transceiver PHY and PLLs; decouple each supply pin per the Cyclone IV GX device handbook with a 0.1 uF plus 10 uF bulk capacitor pair. Power sequencing between VCCINT, VCCA, and VCCD_PLL must follow the recommended order in the datasheet to avoid latch-up. Estimated: at full fabric utilization with active transceivers, total board power can reach 4-6 W, so design the PCB copper pour for adequate heat spreading.

Use the 672-ball FBGA escape pattern recommended in the Cyclone IV GX device handbook. Route high-speed transceiver differential pairs with 100 ohm differential impedance and keep lengths matched within 150 mil. Place AC-coupling capacitors close to the transmitter pins when driving external PHYs. Maintain continuous reference planes under all BGA breakouts to minimize via-stub effect on multi-Gbps signals.

Common pitfalls include selecting the wrong speed grade (6 is faster than 8 - confusingly faster means lower number for Cyclone IV), overlooking the difference between commercial and industrial temperature suffixes, and forgetting that the "N" suffix denotes lead-free/RoHS-compliant ordering codes. Always verify the exact ordering part number against your BOM and cross-check the device errata document before committing to a design. Configuration mode (AS/PS/JTAG) must be selected via MSEL pins correctly.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliance per distributor listings (DigiKey, Mouser). The base EP4CGX75DF27C6 ordering code (without the N suffix) may not be lead-free; use the -N suffix ordering codes (EP4CGX75DF27C6N) for lead-free/RoHS-compliant builds. AEC-Q100 qualification is not documented for this commercial-grade part.

Data verified on: 2026-09-10 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera Cyclone IV GX EP4CGX75DF27C6 EP4CGX110DF27I7N EP4CGX150DF27I7N EP4CGX75DF27C7 FPGA Field-Programmable Gate Array Programmable Logic Device Logic IC Integrated Circuit FineLine BGA 672-FBGA F27 package 3.125 Gbps transceiver PCIe Gen1 18x18 multiplier M9K memory block Quartus RoHS AEC-Q100 JTAG Active Serial configuration 60 nm CMOS industrial motor control video surveillance software-defined radio
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