EP4CGX75DF27C6N - 73.9K Logic Elements Cyclone IV GX FPGA | Intel
MPN: EP4CGX75DF27C6N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $128.5 | $128.50 |
| 10 | $119.4 | $1,194.00 |
| 100 | $105.2 | $10,520.00 |
| 250 | $96.75 | $24,187.50 |
| 500 | $88.9 | $44,450.00 |
EP4CGX75DF27C6N Overview
A Cyclone IV GX FPGA is a programmable logic device that combines a configurable logic fabric, on-chip memory blocks, DSP blocks, and high-speed serial transceivers into a single silicon die, allowing hardware engineers to implement custom digital functions, glue logic, protocol bridges, and parallel signal processing pipelines without fabricating an ASIC. Cyclone IV GX sits within Intel's low-cost FPGA portfolio below Cyclone V and Stratix families, specifically adding multi-gigabit transceivers (up to 3.125 Gbps in this family) for protocols such as PCIe Gen1, Gigabit Ethernet, and serial RapidIO. As an FPGA, it belongs to the broader category of programmable logic devices (PLDs), itself a subset of digital integrated circuits.
Key features of this device include 4 embedded transceivers with Physical Coding Sublayer (PCS) and Physical Media Attachment (PMA) hard IP, up to 425 Kbits of M9K block RAM distributed across the fabric, 310 hardware DSP blocks (18x18 multipliers plus adders), eight independent clocking PLLs, and 310 Kbits of embedded memory for FIFO buffers and lookup tables. The 672-ball FineLine BGA package supports high I/O count with up to 310 general-purpose user I/Os depending on the I/O standard selected.
Typical applications for the EP4CGX75DF27C6N include industrial motor control boards, video surveillance and image-processing front-ends, low-cost PCIe endpoint cards, telecommunications line cards, and embedded vision systems. The integrated transceivers make it especially suitable for designs that require one or more gigabit serial links without adding an external PHY. The 672-FBGA package exposes enough pins for wide external memory buses (DDR2/DDR3) and parallel video interfaces.
When designing with this part, plan the PCB layout assuming a fine-pitch BGA with 1.0mm ball pitch; you will require at least 4 to 6 PCB layers for breakout and power integrity. Thermal management at full toggle rate is moderate (the 60nm process has lower leakage than 90nm predecessors) but you must still respect the 0.85 V-1.2 V core supply sequencing requirements documented in the Altera/Intel datasheet family handbook.
Drop-in alternatives for EP4CGX75DF27C6N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX75DF27C6N (same form factor and footprint) β differing in Package, Operating Temperature, Speed Grade, Transceivers, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CGX110DF27C6N
β Drop-Inβ In Stock
$119.9 / Unit
View Datasheet βEP4CGX150DF27C6N
β Drop-Inβ In Stock
$205 / Unit
View Datasheet βEP4CGX110DF27C7N
β Drop-Inβ In Stock
$204.2 / Unit
View Datasheet βEP4CGX150DF27C7N
β Drop-Inβ In Stock
$171 / Unit
View Datasheet βEP4CGX50DF27C6N
β Drop-Inβ In Stock
$155 / Unit
View Datasheet βEP4CGX75DF27C6N Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV GX |
| Logic Elements | 73,920 |
| Logic Array Blocks (LABs) | 4,630 |
| Total Memory Bits | 4,257,792 |
| Embedded Multipliers (18x18) | 310 |
| Maximum User I/O | 310 (FBGA-672) |
| Process Technology | 60 nm low power |
| Core Supply Voltage | 1.2 V |
| Number of Transceivers | 4 (up to 3.125 Gbps) |
| Package | 672-ball FineLine BGA (FBGA) |
| Speed Grade | C6 (slowest commercial) |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (lead-free) |
| MSL Level | 3 |
EP4CGX75DF27C6N 672-ball fineline bga (fbga) Pin Configuration Guide
Pin configuration for EP4CGX75DF27C6N (672-ball fineline bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX75DF27C6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX75DF27C6N is suitable for 7 applications: Industrial Motor Control, Video Surveillance and Image Processing, Low-Cost PCIe Endpoint Card, Telecommunications Line Card, Embedded Vision System, Industrial Protocol Bridge, Test and Measurement Equipment.
Industrial Motor Control
The EP4CGX75DF27C6N fits industrial motor control boards because its 310 dedicated 18x18 hardware DSP blocks can implement field-oriented-control (FOC) loops, space-vector PWM generators, and digital filters in parallel without taxing soft logic. The four integrated transceivers (up to 3.125 Gbps) carry encoder feedback, EtherCAT, or SERCOS III links without an external PHY, reducing board area and BOM. The 310 user I/Os in the 672-FBGA package expose enough pins for multi-axis PWM outputs, ADC interfaces, and resolver/external memory buses. Designers benefit from deterministic timing via the eight PLLs and the Quartus Prime Qsys IP library for motor-control reference designs.
Recommended
Video Surveillance and Image Processing
The EP4CGX75DF27C6N is well-matched to video surveillance front-ends that need real-time image preprocessing, scaling, and motion detection on parallel video streams. Its 4,257,792 bits of embedded M9K memory buffer full-HD video frames line by line, while the 310 DSP blocks perform 2D filters, edge detection, and JPEG/MJPEG compression in hardware at frame rate. The 310 user I/Os in the 672-FBGA package accommodate BT.656, BT.1120, or LVDS camera interfaces, and the four transceivers feed gigabit Ethernet uplinks carrying compressed streams to NVR back-ends. Compared with DSP-only solutions, the FPGA enables firmware-upgradable image pipelines.
Recommended
Low-Cost PCIe Endpoint Card
The EP4CGX75DF27C6N serves well in low-cost PCIe endpoint cards because Cyclone IV GX hard-IP supports PCIe Gen1 x1/x2/x4 with integrated PCS/PMA transceivers, eliminating the need for an external bridge chip and reducing BOM cost by roughly $15-30 per board. Designers can implement custom protocol acceleration, data-acquisition buffering in M9K blocks, or high-speed host DMA engines using the 73,920 logic elements and 4,257,792-bit memory budget. The 672-FBGA package provides enough user I/Os for auxiliary headers, JTAG, and external DDR2/DDR3 memory interfaces required for high-throughput streaming. Quartus Prime PCIe Compiler simplifies TLP engine implementation.
Recommended
Telecommunications Line Card
The EP4CGX75DF27C6N is suitable for telecom line cards where the four 3.125 Gbps transceivers can carry CPRI, OBSAI, or Gigabit Ethernet uplinks to base-station controllers, while the 73,920 logic elements implement custom PHY-layer DSP, framing, and protocol-aware switching. The 4,257,792-bit embedded memory buffers packet bursts and timing-critical samples, and the 310 user I/Os in the 672-FBGA package connect to external framers, crosspoint switches, and timing-recovery PLLs. The 60nm low-power process keeps board thermal design manageable in 1U/2U line-card form factors with limited airflow.
Recommended
Embedded Vision System
The EP4CGX75DF27C6N serves embedded vision platforms such as machine-vision inspection cameras, robotic perception boards, and ADAS prototypes. Its 310 18x18 DSP blocks accelerate convolutional filters, histogram equalization, and feature extraction algorithms in hardware, achieving real-time processing of QVGA-to-1080p video streams. The 4,257,792 bits of M9K memory store image tiles and lookup tables, and the four integrated transceivers provide high-speed links to external image sensors, GMSL serializers, or host processors over gigabit Ethernet. The 672-FBGA package gives enough I/O for MIPI-CSI-2 bridges and dual-camera interfaces.
Recommended
Industrial Protocol Bridge
The EP4CGX75DF27C6N is well-suited to industrial protocol bridges that translate between legacy fieldbuses (Modbus RTU, PROFIBUS, CAN) and modern Ethernet-based protocols (PROFINET, EtherCAT, Ethernet/IP). The four integrated transceivers carry the Ethernet side at gigabit speed, while the 310 user I/Os expose RS-485, CAN, and isolated GPIO channels for legacy equipment. The 73,920 logic elements implement protocol state machines, packet buffers, and timing-critical PDU handlers in deterministic hardware, and the 4,257,792-bit memory supports deep circular buffers for retransmission. Designers can use Altera's Triple-Speed Ethernet MegaCore to shorten firmware development.
Recommended
Test and Measurement Equipment
The EP4CGX75DF27C6N fits mid-range test and measurement equipment such as protocol analyzers, logic-analyzer front-ends, and arbitrary waveform generators. Its 310 hardware multipliers perform real-time FFT, FIR/IIR filtering, and digital modulation/demodulation on sampled waveforms, while the 4,257,792 bits of M9K memory buffer acquisition bursts. The four 3.125 Gbps transceivers enable high-speed data offload to host PCs over PCIe or 10 GbE aggregation channels. The 310 user I/Os in the 672-FBGA package accommodate LVDS or DDR3 interfaces to high-speed ADCs and DACs used in modern instruments.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX75DF27C6N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX110DF27C6N | EP4CGX150DF27C6N | EP4CGX110DF27C7N | EP4CGX150DF27C7N | EP4CGX50DF27C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FBGA | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same |
| Logic Elements | 73,920 | 109,424 | 149,760 | 109,424 | 149,760 | 49,888 |
| Embedded Memory (bits) | 4,257,792 | 5,455,872 | 6,635,520 | 5,455,872 | 6,635,520 | 2,502,144 |
| 18x18 Multipliers | 310 | 488 | 720 | 488 | 720 | 200 |
| Transceivers (up to 3.125 Gbps) | 4 | 4 | 8 | 4 | 8 | 4 |
| Speed Grade | C6 | C6 | C6 | C7 (faster) | C7 (faster) | C6 |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
Key Differentiators
- Highest logic density in 672-FBGA at C6 speed grade with 4 transceivers (vs EP4CGX50DF27C6N)
- Integrated 3.125 Gbps transceivers eliminate external PHY (vs EP4CE75F23I7N)
- Lowest unit cost among 4-transceiver Cyclone IV GX devices in 672-FBGA (vs EP4CGX110DF27C6N)
Design Notes
Estimated: The 672-ball FBGA package uses 1.0mm ball pitch with 20x20 ball layout excluding depopulated rows. A 6-layer PCB stackup with 1 oz copper on signal layers and 0.5 oz on planes is recommended for power-integrity and clean break-out routing. Fan-out via pattern should follow the IPC-7352 guidelines with 0.4mm laser-drilled microvias. The 0.85V-1.2V core supply decoupling requires at least 12 x 100nF X7R 0402 capacitors placed directly under the BGA footprint, plus 4 x 4.7uF bulk capacitors within 10mm of the device. All transceiver channels require 100-ohm differential routing with length matching within 0.13mm.
The Cyclone IV GX 60nm process consumes approximately 0.5W-1.5W typical and up to 3W worst-case at full toggle rate with all four transceivers active. The 672-FBGA package requires thermal vias (24-30 vias in a 3x3 array) under the central ball grid connected to an internal copper pour on layer 2 and bottom layer for spreading. With proper via construction and 100x100mm board area, theta-JA is typically 12-15 C/W, providing adequate headroom at the commercial +85C maximum. For industrial -40C to +100C operation, consider the EP4CGX75DF27I7N industrial variant instead.
Three common pitfalls with EP4CGX75DF27C6N designs: (1) The C6 speed grade is the slowest commercial tier - if you need higher Fmax for timing-critical paths, choose the C7 or C8 variants. (2) Configuration mode (AS, PS, JTAG, FPP) is set via MSEL[3:0] pins - they MUST be strapped to the correct value before VCCIO_8 powers up, or the device will not configure. (3) All unused user I/O pins should be left floating or tied to GND via software setting in Quartus Prime to minimize power; floating outputs can cause oscillation. Refer to the Cyclone IV handbook chapter on configuration schemes for full details.
Cyclone IV GX transceivers require careful attention to reference clock jitter: a 100 MHz or 125 MHz LVDS reference with phase noise below -90 dBc/Hz at 100 kHz offset is recommended for jitter-sensitive protocols like PCIe. PCB trace length from the reference-clock oscillator to the CLK_n/p pins must be within 5mm and matched within 0.13mm. The transceiver TX and RX differential pairs must be length-matched within 0.025mm and routed over a continuous ground reference plane with no splits under the channel. Use IBIS-AMI simulations via Quartus Prime to validate eye-diagram compliance for your target protocol (PCIe Gen1, GbE, CPRI).
The EP4CGX75DF27C6N requires five supply rails: VCCINT (1.2V core), VCCA (2.5V PLL analog), VCCD_PLL (1.2V PLL digital), VCCIO_x (1.2V-3.3V I/O banks, mixed voltages allowed), and VCC_GXB (1.2V or 2.5V transceiver analog). Power-on sequencing per the datasheet: VCCINT must precede or follow VCC_GXB by no more than 100ms; otherwise latchup can occur. Recommended power-on sequence is VCCINT -> VCC_GXB -> VCCA -> VCCD_PLL -> VCCIO, with all supplies reaching 90% of nominal within 100ms. Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet to compute worst-case power budget before final schematic design.
Compliance Information
RoHS and lead-free status confirmed via the 'N' suffix in the MPN and distributor listings. Cyclone IV GX is commercial-grade FPGA - not AEC-Q100 qualified; for automotive applications consult Intel AEC-Q100 documentation or contact Intel directly.