EPF6024AQC2403N - 24K Gates FLEX 6000 FPGA | Intel / Altera
MPN: EPF6024AQC2403N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.1 | $251.00 |
| 100 | $19.85 | $1,985.00 |
| 500 | $16.4 | $8,200.00 |
| 1,000 | $14.2 | $14,200.00 |
EPF6024AQC2403N Overview
A field programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect and surrounded by programmable I/O cells. FPGAs belong to the broader category of programmable logic devices (PLDs), which also includes CPLDs and SPLDs. Within modern electronics, FPGAs sit between fixed-function ASICs and software-driven microcontrollers, offering hardware-timed parallelism, reprogrammability in the field, and gate counts ranging from a few thousand to millions of logic elements.
Key features of the EPF6024AQC2403N include reconfigurable SRAM configuration memory, multi-voltage I/O support (3.3 V with 5.0-V tolerance when a pull-up resistor is used), and built-in JTAG-based in-system programmability. The device supports both 5.0-V and 3.3-V I/O standards on the same package, and the IOL current specification must be considered when sizing pull-up resistors on 5.0-V-tolerant outputs. The OptiFLEX architecture minimizes die size while maintaining high performance and routability, which makes the FLEX 6000 family a low-cost alternative to high-volume gate array designs.
Typical use cases include glue logic replacement, custom peripheral interfacing, bus bridging, and low-volume ASIC prototyping. The wide 199-I/O budget suits parallel data acquisition and bus-aggregation designs, while the SRAM configuration supports frequent in-field firmware revisions. Industrial control front-ends and telecom line-card glue logic remain common sockets.
When designing with this part, validate configuration mode and JTAG chain ordering against the FLEX 6000 family datasheet, and verify timing closure using the Quartus II or MAX+PLUS II tool flow. The 3.3-V core with 5.0-V-tolerant I/O simplifies mixed-voltage board designs without external level shifters on most signals.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not consolidated in the Altera FLEX 6000 datasheet, helping engineers shorten the sourcing and qualification cycle.
Drop-in alternatives for EPF6024AQC2403N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024AQC2403N (same form factor and footprint) — differing in Operating Temperature, Mounting Type, Process Technology, Configuration Memory, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024AQC240-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$19.8 / Unit
View Datasheet →EPF6024AQC240-2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$26.1 / Unit
View Datasheet →EPF6024AQC240-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$23.1 / Unit
View Datasheet →EPF6024AQC240-1N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$54 / Unit
View Datasheet →EPF6024AQC240-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$18.95 / Unit
View Datasheet →EPF6024AQC2403N Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Architecture | OptiFLEX |
| Logic Elements / Cells | 1,960 |
| Equivalent Gate Count | 24,000 gates |
| Maximum User I/O | 199 |
| Supply Voltage (VCCINT) | 3.3 V |
| Process Technology | 0.42 µm SRAM |
| Maximum Internal Frequency | 142.86 MHz |
| Configuration Memory | SRAM (volatile, in-system reconfigurable) |
| Package | 240-BFQFP / PQFP-240 |
| Mounting Type | Surface Mount |
| I/O Standard Support | 3.3 V, 5.0 V (with pull-up resistor) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
| Operating Temperature | Commercial (0°C to 70°C) |
EPF6024AQC2403N Pin Configuration
| Pin 1 | I/O — User I/O pin (bank-dependent voltage) |
| Pin 60 | I/O — User I/O pin |
| Pin 120 | VCCINT — Core supply 3.3 V |
| Pin 121 | GND — Ground |
| Pin 180 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pin 200 | TDI — JTAG Test Data In |
| Pin 210 | TCK — JTAG Test Clock |
| Pin 220 | TMS — JTAG Test Mode Select |
| Pin 230 | TDO — JTAG Test Data Out |
| Pin 235 | nCONFIG — Configuration control (active low) |
| Pin 236 | nSTATUS — Configuration status (active low) |
| Pin 237 | CONF_DONE — Configuration done indicator |
| Pin 238 | DCLK — Configuration clock |
| Pin 240 | MSEL0 — Configuration mode select 0 |
Typical Applications
EPF6024AQC2403N is suitable for 6 applications: ASIC Prototype and Pre-Silicon Validation, Industrial Glue Logic and Bus Bridging, Telecom Line-Card Custom Interface, Test and Measurement Front-End, Legacy System Board Repair and Sustainment, Educational and FPGA Learning Platforms.
ASIC Prototype and Pre-Silicon Validation
The EPF6024AQC2403N's 24,000-gate capacity and 1,960 logic elements make it well suited as an ASIC prototype for sub-30K-gate designs. Engineers migrating an ASIC to FPGA pre-silicon validation can map gate-level netlists directly because the FLEX 6000 family supports both behavioral and structural HDL. The SRAM-based configuration allows rapid design iteration in the lab. With 199 user I/O, the part supports wide parallel buses typical of pre-silicon validation rigs, and the 142.86 MHz FMAX provides adequate timing margin for most ASIC clock domains below 100 MHz.
Recommended
Industrial Glue Logic and Bus Bridging
The 199 user I/O pins of the EPF6024AQC2403N are ideal for bridging legacy parallel buses (PC/104, ISA-style, VME) to modern microprocessors in industrial control systems. The FLEX 6000 family's mixed-voltage I/O (3.3 V core with 5.0-V tolerance via pull-up) eliminates external level shifters on most interface pins. Real-time glue logic such as address decoding, wait-state insertion, and DMA arbitration fits within the 1,960-LE budget. Per the FLEX 6000 datasheet, the SRAM configuration supports late-stage board re-spin logic fixes without respin.
Recommended
Telecom Line-Card Custom Interface
The EPF6024AQC2403N's 142.86 MHz FMAX and 199-I/O budget suit telecom line-card custom logic such as T1/E1 framer glue, HDLC controllers, and time-slot interchangers in legacy equipment. The 3.3 V core with 5.0-V-tolerant I/O enables direct interfacing to legacy 5 V bus transceivers on the backplane. SRAM-based reconfigurability allows field upgrades as protocol revisions evolve, critical for telecom operator networks that cannot tolerate board swaps. Per the FLEX 6000 datasheet, the JTAG chain supports board-level boundary-scan on populated line cards.
Recommended
Test and Measurement Front-End
The EPF6024AQC2403N serves well as a programmable front-end for low-speed test and measurement gear, where 199 user I/O can be routed to instrumentation-grade analog front-ends. Its 1,960-LE budget accommodates custom trigger logic, pattern generators, and protocol-aware state machines. The OptiFLEX architecture's deterministic routing helps meet timing closure on parallel acquisition paths operating under 100 MHz. Per the FLEX 6000 datasheet, JTAG-based in-system programming simplifies field firmware updates in deployed test racks.
Recommended
Legacy System Board Repair and Sustainment
The EPF6024AQC2403N, while NRND, remains in demand for sustaining legacy industrial, defense, and aerospace boards designed around the FLEX 6000 family. The part's exact compatibility with the EPF6024AQC240-3 (lead-finish variant) supports board-repair workflows where lead-free reballing is not feasible. Per the Intel product change notifications, FLEX 6000 inventory is dwindling, so procurement teams place multi-year last-time-buy orders to sustain deployed systems through 2030+.
Recommended
Educational and FPGA Learning Platforms
The EPF6024AQC2403N's moderate density (1,960 LEs) makes it an excellent teaching vehicle for university-level VLSI and digital-design courses. Students can implement full RISC cores, peripheral controllers, and signal-processing pipelines within the 24K-gate budget. The PQFP-240 package is hand-solderable on breakout boards, simplifying lab prototyping without BGA rework equipment. Per the FLEX 6000 datasheet, the Quartus II / MAX+PLUS II tool flow remains freely available for educational use.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024AQC2403N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024AQC240-3 | EPF6024AQC240-2N | EPF6024AQC240-2 | EPF6024AQC240-1N | EPF6024AQC240-1 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | PQFP-240 (BFQFP-240) | PQFP-240 - same | PQFP-240 - same | PQFP-240 - same | PQFP-240 - same | PQFP-240 - same |
| Family / Architecture | FLEX 6000 / OptiFLEX | FLEX 6000 / OptiFLEX - same | FLEX 6000 / OptiFLEX - same | FLEX 6000 / OptiFLEX - same | FLEX 6000 / OptiFLEX - same | FLEX 6000 / OptiFLEX - same |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 |
| Maximum User I/O | 199 | 199 | 199 | 199 | 199 | 199 |
| Speed Grade (FMAX) | -3 (142.86 MHz) | -3 (142.86 MHz) | -2 (lower) | -2 (lower) | -1 (lowest) | -1 (lowest) |
| Lead Finish | Lead-free (-N) | Standard lead (no -N) | Lead-free (-N) | Standard lead | Lead-free (-N) | Standard lead |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest-density member of the FLEX 6000 family (vs EPF6016AQC208-3N)
- Faster speed grade (-3) at 142.86 MHz FMAX (vs EPF6024AQC240-2N)
- Lead-free (-N) finish for RoHS-compliant boards (vs EPF6024AQC240-3)
Design Notes
Estimated: with VCCINT = 3.3 V at 100% logic utilization (~1,960 LEs toggling at 50 MHz), ICCINT is approximately 200-400 mA per the FLEX 6000 datasheet ICC vs frequency curve. Provide at least four 0.1 µF X7R decoupling capacitors near the VCCINT pins and bulk 100 µF tantalum on the 3.3 V rail. VCCIO banks should each have their own 0.1 µF + 10 µF decoupling pair. Power sequencing: VCCINT must ramp before VCCIO to prevent I/O latch-up.
The PQFP-240 package has 0.5 mm pitch leads and requires IPC-SM-782 compliant land patterns with a 6-8 mil solder mask dam. Use a 4-layer PCB with continuous ground plane beneath the device to minimize lead-inductance ringing on VCCINT transitions. Keep all configuration pins (nCONFIG, nSTATUS, CONF_DONE, DCLK, MSEL0-1) within 25 mm of the part to avoid reflection on the configuration signals. Per the FLEX 6000 datasheet, JTAG chain TCK should be kept under 100 mm total length.
Do not confuse the EPF6024AQC2403N (PQFP-240) with the EPF6024AQC208-3N (PQFP-208); they are NOT pin-compatible and require different PCB footprints. The -N suffix denotes lead-free / Pb-free finish; boards requiring RoHS compliance must select -N variants. SRAM configuration is volatile — designs without a configuration ROM will lose their bitstream on power-down. For new designs, consider Cyclone II/III as a modern, supported replacement.
Compliance Information
The -N suffix denotes lead-free (Pb-free) matte-tin finish per RoHS. FLEX 6000 family is not AEC-Q100 qualified; choose a Cyclone-based automotive-grade part for vehicle applications.
