EP2C35F672C6 - Cyclone II FPGA 33K LE 672-FBGA | Intel
MPN: EP2C35F672C6 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $165 | $165.00 |
| 10 | $145 | $1,450.00 |
| 100 | $122 | $12,200.00 |
| 500 | $108 | $54,000.00 |
| 1,000 | $95 | $95,000.00 |
EP2C35F672C6 Overview
A Cyclone II FPGA is a SRAM-based programmable logic device that allows designers to implement custom digital logic, signal processing, and embedded processor subsystems after PCB fabrication. It belongs to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs, FPGAs, and structured ASICs. Compared with its predecessor Cyclone I, the Cyclone II family roughly doubled logic density while targeting the same low-power, high-volume end of the market.
Key features include 33,216 LEs, 483,840 total RAM bits distributed across M4K memory blocks, 70 embedded 18x18 multipliers for DSP operations, four PLLs with multiple output taps, and 475 user I/O pins. The device supports common I/O standards including LVTTL, LVCMOS, PCI, SSTL, and LVDS, with per-pin programmable drive strength and slew-rate control.
Cyclone II uses a 90 nm process node with a 1.2 V core supply and offers dedicated hardware multipliers and M4K block RAM that allow efficient implementation of FIR filters, FFTs, video pipelines, and embedded Nios II soft processors. The part number suffix indicates the C6 speed grade (commercial temperature range, approximately -40C to +85C ambient).
Typical applications include industrial motor control, video processing and surveillance, telecommunications line cards, embedded industrial controllers, and educational/development platforms. The high I/O count (475) and large memory (483 Kbits) make it well suited for parallel bus interfacing and data-pipeline processing.
When designing with the EP2C35F672C6, engineers should plan the power distribution network carefully: Cyclone II requires multiple supply rails (VCCINT, VCCA, VCCIO per bank) and the 672-ball FBGA demands a multilayer PCB with microvia technology. Use the Quartus II design software for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers an actionable reference beyond what Altera/Intel provides in their legacy Cyclone II handbook.
Drop-in alternatives for EP2C35F672C6 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C35F672C6 (same form factor and footprint) β differing in Process Technology, RoHS Status, Package, Speed Grade, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2C35F672C7
β Drop-Inβ In Stock
$119.95 / Unit
View Datasheet βEP2C35F672C8
β Drop-Inβ In Stock
$71.85 / Unit
View Datasheet βEP2C35F672I6
β Drop-Inπ Reference alternative (not in catalog)
EP2C35F672C6N
β Drop-Inβ In Stock
$122.5 / Unit
View Datasheet βEP2C35F672I7N
β Drop-Inπ Reference alternative (not in catalog)
EP2C35F672C6 Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Logic Elements (LE) | 33,216 |
| Total RAM Bits | 483,840 |
| Number of I/O | 475 |
| Number of Logic Array Blocks (LABs) | 2,076 |
| Embedded Multipliers (18x18) | 70 |
| Number of PLLs | 4 |
| Supply Voltage - Core | 1.15 V to 1.25 V |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | C6 |
| Package / Case | 672-BGA (FBGA) |
| Mounting Type | Surface Mount |
| Process Technology | 90 nm CMOS |
EP2C35F672C6 672-bga (fbga) Pin Configuration Guide
Pin configuration for EP2C35F672C6 (672-bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C35F672C6.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C35F672C6 is suitable for 6 applications: Industrial Motor Control, Video Processing and Surveillance, Telecommunications Line Cards, Embedded Industrial Controllers, Educational and Development Platforms, Custom DSP and Audio Pipelines.
Industrial Motor Control
The EP2C35F672C6 with 33,216 logic elements and 70 hardware 18x18 multipliers can implement multi-axis motor control loops including field-oriented control (FOC) algorithms, encoder decoding, and over-current protection logic. The 475 user I/O pins support parallel connection to multiple PWM outputs, quadrature encoder inputs, Hall-effect sensors, and CAN/RS-485 comms peripherals. Cyclone II's 90 nm process allows up to 260 MHz operation, sufficient for 50 kHz torque-loop updates with oversampling. The four PLLs generate independent clocks for control loops and serial buses, while the 483 Kbit on-chip RAM buffers current/torque feedback data without external SRAM access.
Recommended
Video Processing and Surveillance
With 483 Kbits of M4K block RAM and 70 hardware multipliers, the EP2C35F672C6 can implement real-time video pipelines including RGB-to-YCbCr conversion, 2D filtering, and motion detection for surveillance camera designs. The 475 I/Os can interface directly to DDR SDRAM, CMOS image sensors, and HDMI/LVDS display panels without external bridges. Designers can integrate a Nios II soft processor for camera control and TCP/IP offload. The 672-FBGA package provides sufficient I/O to drive two simultaneous 720p60 streams at 1.2 V core, all powered by a single 1.2 V regulator + multiple VCCIO banks.
Recommended
Telecommunications Line Cards
The EP2C35F672C6 is well suited to telecommunications line-card applications because of its 475 user I/O count, four PLLs, and PCI/LVDS signalling support. Engineers can implement TDM switching fabrics, HDLC controllers, and hardware-accelerated protocol stacks on-chip, replacing multiple ASICs and CPLDs. Cyclone II's high I/O count allows direct parallel interconnect to T1/E1 framers, network processors, and bus crossbar switches, while the 483 Kbit RAM block provides frame-buffer memory for up to several thousand packets at line rate.
Recommended
Embedded Industrial Controllers
The EP2C35F672C6 paired with a Nios II/f soft processor delivers an embedded controller capable of running industrial protocols like Modbus, Profibus slave, and EtherCAT slave controllers from open-source stacks. The 33,216 logic elements implement dual redundant CAN controllers, multi-channel ADC sequencer logic, and pulse-train output (PTO) for stepper-motor profiles. The 672-FBGA package offers sufficient I/O to drive 16 digital inputs, 16 digital outputs, RS-485 ports, and Ethernet MII bus to a PHY from a single device.
Recommended
Educational and Development Platforms
The Cyclone II family, including the EP2C35F672C6, became the de-facto FPGA for university and training labs because it is well supported by Quartus II (free Web Edition), DE2-115 development boards, and decades of open teaching materials. The device fits comfortably within typical lab designs: UART bridges, VGA generators, custom CPU cores, RISC-V/8051 implementations, and pipeline educational examples. The 483 Kbit RAM is enough for on-chip cache and frame-buffer demos, while 475 I/O expose students to nearly every low-speed signalling standard.
Recommended
Custom DSP and Audio Pipelines
With 70 hardware 18x18 multipliers, the EP2C35F672C6 can implement multi-channel audio processing pipelines including 32-tap equalizers, parametric EQ, dynamics compressors, and FFT-based spectral analysers at sample rates up to 192 kHz. The M4K RAM blocks provide coefficient storage and ring-buffer delay lines without off-chip memory. The four PLLs generate independent clocks for I2S, S/PDIF, and USB audio interfaces, while 475 I/Os drive multi-channel CODEC data buses, GPIO, and external LCD character displays in studio gear.
Recommended
Recommended Products Summary
Engineering reference data for EP2C35F672C6 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C35F672C7 | EP2C35F672C8 | EP2C35F672I6 | EP2C35F672C6N | EP2C35F672I7N | EP2C35F484I8N |
|---|---|---|---|---|---|---|---|
| Package | 672-FBGA | 672-FBGA (same) | 672-FBGA (same) | 672-FBGA (same) | 672-FBGA (same) | 672-FBGA (same) | 484-FBGA (different) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 33,216 | 33,216 (same die) | 33,216 (same die) | 33,216 (same die) | 33,216 (same die) | 33,216 (same die) | 33,216 (same die) |
| Total RAM Bits | 483,840 | 483,840 | 483,840 | 483,840 | 483,840 | 483,840 | 483,840 |
| User I/O | 475 | 475 | 475 | 475 | 475 | 475 | 322 |
| Speed Grade | C6 (commercial) | C7 (slower) | C8 (faster) | I6 (industrial) | C6 (commercial, lead-free) | I7 (industrial) | I8 (industrial) |
| Multipliers (18x18) | 70 | 70 | 70 | 70 | 70 | 70 | 70 |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest-density Cyclone II device in the standard product tier (vs EP2C20F484I8N)
- Commercial temperature speed grade C6 (vs EP2C35F672I6)
- 672-ball FBGA with 475 user I/O (vs EP2C35F484I8N)
Design Notes
The 672-ball FBGA package uses 1.0 mm ball pitch and a 27 mm x 27 mm body, requiring a multilayer PCB (typically 6+ layers) with laser-drilled microvias for breakout. Allocate at least 4 dedicated signal layers for the inner ball escape pattern, and keep a continuous ground plane beneath the device to control impedance and supply return paths. Use the Cyclone II FBGA-672 pin table from the Cyclone II Handbook (CII51007) when generating the PCB symbol.
Cyclone II requires three independent supply domains: VCCINT (1.15 V to 1.25 V core), VCCA (2.5 V analog supply for PLLs), and per-bank VCCIO (1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on I/O standard). Decouple each VCCINT pin locally with a 0.1 uF X7R plus a 10 uF tantalum or polymer bulk cap; bulk VCCINT should supply at least 3 A transient for the C6 speed grade at high toggle rates. Power sequencing must follow the Cyclone II datasheet: VCCINT ramps first, then VCCA, then VCCIO banks.
Configuration mode selection (AS, PS, JTAG) must match the chosen configuration memory device. Common mistakes include selecting the wrong MSEL[2:0] pins for the configuration scheme, omitting the pull-up on nCONFIG, and not providing a 2.5 V reference for configuration EEPROM sharing. Plan the configuration clock source and CONF_DONE / nSTATUS pull-ups explicitly on the schematic rather than relying on defaults.
Estimated: At maximum toggle rates the EP2C35F672C6 core can draw up to 1.5 A from VCCINT, corresponding to roughly 1.9 W core dissipation. Combined with I/O bank power, total board dissipation may approach 3 W under worst-case conditions. With 4 thermal balls exposed to the package bottom, use 4 thermal vias per ball to an internal ground plane for heat spreading; aim for 1 sq-in of copper pad per ball in the BGA footprint.
Compliance Information
RoHS and lead-free status for EP2C35F672C6 marked unknown because the verified web data does not explicitly state compliance. Cyclone II commercial FPGAs in FBGA packages are typically lead-free per Intel legacy documentation, but engineers must verify with the actual device marking before assuming RoHS compliance for production designs.
